• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.169-173
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• 2003

We demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon) printed circuit board (PCB). The copper lines were formed with $100\;{\mu}m$ width and $18\;{\mu}m$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of $100-200\;{\mu}m$. The DFRs of $15\;{\mu}m$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100^{\circ}C\;to\;150^{\circ}C$ and laminating speed. We found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63 cm/s. And the smallest size of indium solder bump was diameter of $50\;{\mu}m$ with pitch of $100\;{\mu}m$.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.61 no.3
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• pp.472-478
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• 2012

The inspection machine in PCB (printed circuit board) assembly line checks assembly errors by inspecting the images inside of the component inspection region. The component inspection region consists of region of component package and region of soldering. It is necessary to extract the regions automatically for auto-teaching system of the inspection machine. We propose an image segmentation method to extract the component inspection regions automatically from images of PCB. The acquired image is transformed to HSI color model, and then segmented by several regions by clustering method. We develop a modified K-means algorithm to increase the accuracy of extraction. The heuristics generating the initial clusters and merging the final clusters are newly proposed. The vertical and horizontal projection is also developed to distinguish the region of component package and region of soldering. The experimental results are presented to verify the usefulness of the proposed method.

• International Journal of Quality Innovation
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• v.2 no.2
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• pp.69-92
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• 2001

The laser-assisted seeding (LAS) process has potential to replace conventional electroless copper plating in Printed Circuit Board (PCB) manufacturing since it combines the steps of laser drilling and plating into one single process. In the LAS process, the single extra LAS step can metallize a microvia. Thus, the process steps can be greatly reduced and the productivity enhanced, but also the high aspect ratio microvias can be metallized. The objectives of this paper are to study the LAS copper thickness within PCB microvias and the thermal reliability of the microvias produced by this process. It was found that results were satisfactory in both the reliability test and also the LAS copper thickness which both comply with IPC standard, the copper thickness produced by the LAS process is sufficient for subsequent electro-plating process. The reliability of the microvias produced by LAS process is acceptable which are free from any voids, corner cracks, and distortion in the plated copper.

• Electrical & Electronic Materials
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• v.10 no.9
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• pp.952-959
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• 1997

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1009-1010
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• 2011

• Proceedings of the KIEE Conference
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• 2004.11c
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• pp.577-579
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• 2004

Digital hearing aids enclose $6{\sim}8$ tiny components. Those electromechanical components are individually wired by soldering which is a manual labor and sometimes causes components' damage by heating. This paper suggests a PCB design for overcome these problems. Several PCBs are designed and manufactured and circuited to produce ITE(In The Ear) type hearing aids which are inserted in the ear canal. The most optimal size of the PCB design for the ITE hearing aid is presented in this paper.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2000.10a
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• pp.141-147
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• 2000

For miniaturization of electronic parts and higher productivity, part arrangement job of PCB(printed Circuit Board) has been replaced with complete automated facilities, and contribution which is concerned about this will be expanded continuously. Such part arrangement job of PCB could have lots of influences to entire productivity In this paper, effective grouping method of parts is suggested for the effective insertion path job of PCB concerning the constraints to the size of parts.

• Proceedings of the Korea Information Processing Society Conference
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• 2001.04b
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• pp.1209-1212
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• 2001

본 논문에서는 PCB(Printed Circuit Board)회로에서 고속 신호들을 전달하는 배선의 특성 및 배선의 요구사항에 의한 설계 규칙과 이론화된 공식은 이용하여 PCB상에 배치되는 부품들간의 배선경로를 추적하여 해당 배선의 특성을 분석하고, 흐르는 신호의 특성 및 해당 신호의 전기/전자적인 시뮬레이션을 수행할 수 있도록 하는 PCB회로의 신호통합 시뮬레이터에 대하여 언급하고 실험을 통하여 시뮬레이션의 타당성을 검증하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1491-1494
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• 2008

Typically internal mobile LCD display modules are connected to the mobile product baseband PCB with flexible printed circuit board equipped with board-to-board connector. This solution has a drawback of limiting the product concept work to certain solutions that are based on connector size, location, flexible PCB length, bending, etc. in the display module. Also flexible printed circuit board based solutions are not completely optimized from reliability point of view, causing flex circuit board breakings. For the external displays in the PC or Home entertainment market, the cable solution is too expensive and resource demanding. The wireless solution has obvious advantages over reliability, low cost and flexibility. This paper describes a wireless audio-visual interface solution.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.173-175
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• 2005

The effects of PCB Board on the filter characteristics such as insertion loss and transmission characteristics were investigated for the measurement of 5GHz LC filter. Insertion loss measured with PCB Board of Teflon is 0.3 dB lower in comparion with FR-4. The filter characteristics measured in the passband were different from the calculated results. In comparison with the calculated value, the measured value shows that center frequency is 20MHz lower, passband is narrower and insertion loss is larger. The difference of Insertion loss between Teflon and FR-4 increases with increasing measurement frequency.