• 한국소음진동공학회논문집
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• 제21권1호
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• pp.81-88
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• 2011

The method is introduced for estimating the noise source contribution on the noise of PDP TV in a multiple-input system where the input sources may be coherent with each other. By the coherence function method, it is found that the biggest part of the noise source in the PDP TV noise is generated by the PCB boards which consume high power and produce high heat. This analysis is modeled as three-input/single-output system because the noise is generated by three main boards, X-board, Y-board, SMPS that are located close to each other. The coherence function method is proved to be useful tool for identifying of noise source. In this study, Transfer Path Analysis using MDSA is implemented to determine the quantitative noise contribution of each board for PDP TV with the rear case closed and with the rear case open. And the possibility of noise reduction is confirmed through the experimental method that isolates the most contributing board by adding sound-absorbing materials to it.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2008년도 춘계학술대회논문집
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• pp.856-860
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• 2008

Wire-suspensions in the conventional actuators mechanically support the moving part and guarantee the accuracy of the actuator without tangential tilt actuation. However, such a suspension configuration has considerable stiffness in the tangential tilt direction with two additional wire beams for the tangential tilt. Thus, we performed a design sensitivity analysis for the wire-suspension stiffness of 4-axis actuator and controlled the main parameters such as distance among wire-suspensions and wire-suspension length to allow tangential tilt flexibility. The elasticity of frame PCB that supports the moving part by wire-suspensions was also exploited to improve the flexibility of wire-suspension in the tangential tilt direction. A novel suspension structure was devised by establishing eight wire-suspensions at both sides of the moving part for electrical connection to coils. The magnetic circuit according to the proposed 4-axis actuator using multi-polar magnet and coils was also suggested for the generation of electromagnetic forces in the focusing, tracking, radial and tangential tilt directions.

• 마이크로전자및패키징학회지
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• 제20권3호
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• pp.59-62
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• 2013

Plastic ball grid array (PBGA)에 대한 강력한 임의 진동에서의 신뢰성을 실험적으로 검증하였다. 실험시편을 만들기 위해 데이지 체인이 형성된 PCB에 칩을 실장시킨 후 그중 절반은 underfill 공정을 거쳤다. 임의 진동 프로파일은 인공위성 전자장비의 신뢰성 검증에서 사용되는 두 종류의 진동 수준, 즉 판정시험 (acceptance level) 및 합격시험(qualification level)을 사용하였으며 각각의 power spectrum density는 22.7 Grms와 32.1 Grms였다. 실험후 underfill과 관계없이 모든 샘플에서 솔더의 균열이 발생되지 않았으며, 차후 항공 및 우주용 전자장비를 대치할 수 있는 패키징 구조의 가능성을 보여 줬다.

• 한국기계가공학회지
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• 제4권3호
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• pp.20-31
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• 2005

The contents of mobile phones are rapidly appended and the structures are being changed substantially. Most of the problems with mobile phones are related with the vibrations and the displacements of PCB boards. In this study, the vibration magnitudes of the boards by impulses on the case are analyzed with the variations of the selected design parameters. The result shows that the extensive suppression of the vibrations are feasible by the proper selection of the design parameters. Also the suggested relationships between the parameter selections and the magnitudes of vibrations can be applied to establish a database for improved stability of the mobile phone structure which is a critical concern considering the short life span of the mobile phone models.

• 한국항공운항학회지
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• 제27권3호
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• pp.15-23
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• 2019

This paper contains analyses and development processes of the requirements to detect the possible intermittent failure in an old avionics backplane. Interconnections for signal transmission between electronic components, such as Pin-to-PCB, FPCB-to-FPCB, pin-to-FPCB, and pint-to-wire, were selected as the main cause of intermittent failure by analyzing target equipment and documents. The possibility of detecting intermittent failures occurring in the target equipment is verified by physics-of-failure analyses. In order to verify the occurrence of intermittent failures and their detectability, latching continuity circuit testers were manufactured and accelerated life tests were performed by applying temperature and vibration cycle in consideration of flight conditions. Through the above process, the detection requirements for the major intermittent failure in the target avionics backplane was developed.

• 한국소음진동공학회논문집
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• 제23권12호
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• pp.1045-1055
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• 2013

It is true that the dependency on import is currently high in case of the safety checkup system of domestic airplanes, and it is at the point of time that localization of HUMS for small airplanes is required. In this study, the design factors were selected for the lightweight of HUMS for small airplanes by using Pro-Engineer which is a design tool and Abaqus. 9 models were made through experiment plans with Taguchi method for this, and the each model for weight lightening was selected through vibration analysis and shock analysis while in operation with experiment profile values. After fabricating HUMS, it was verified that as a result of experiment with the same profile values as the analysis, there was similarity between the analyzed values and values of the experiment. As a result of performing weight lightening which is the purpose of the study, electronic performance for small airplanes is assured and a design plan reducing 15 % weight compared to the targeted weight was deduced. Besides, it could be verified that the light weight model satisfied the maximum allowable displacement value of PCB[printed circuit board] and accordingly satisfied electronic properties of HUMS. In this study, the reliability of a product was certified through the result of an experiment on ground. If the reliability of HUMS were verified through a test flight in the future, it is considered that it would make a big contribution to localization of aerospace electronic equipment.

• 마이크로전자및패키징학회지
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• 제17권4호
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• pp.35-40
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• 2010

본 연구에서는 상용 고온 솔더 중 많이 쓰이고 있는 Sn-3.5Ag, Sn-0.7Cu, Sn-5.0Sb 솔더에 대한 열충격 시험, 열싸이클 시험, 고온 진동 복합 시험 신뢰성 평가를 하였다. 테스트 샘플을 제작하기 위해 Sn-3.5Ag, Sn-0.7Cu, Sn-5.0Sb 솔더볼을 ENIG 표면 처리된 BGA에 접합하였으며, 그 후 BGA샘플을 OSP 표면 처리된 PCB에 실장 하였다. 신뢰성평가 동안 저항변화를 측정하였으며 신뢰성 평가 전후 전단강도 시험을 통하여 접합강도의 변화를 평가하였다. Sn-3.5Ag의 솔더인 경우 전기저항과 접합강도의 저하가 비교 평가한 3가지 솔더 중 가장 높은 저하율을 보였으며 Sn-0.7Cu의 솔더가 신뢰성 평가 후에 비교적 높은 안정성을 나타내었다.

• Journal of Welding and Joining
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• 제34권1호
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• pp.26-34
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• 2016

Automotive today has been transforming to an electronic product by adopting a lot of convenience and safety features, suggesting that joining materials and their mechanical reliabilities are getting more important. In this study, a Sn-Cu-Cr-Ca solder composition having a high melting temperature ($>230^{\circ}C$) was fabricated and its joint properties and reliability was investigated with an aim to evaluate the suitability as a joining material for electronics of engine room. Furthermore, mechanical properties change under complex environment were compared with several existing solder compositions. As a result of contact angle measurement, favorable spreadability of 84% was shown and the average shear strength manufactured with corresponding composition solder paste was $1.9kg/mm^2$. Also, thermo-mechanical reliability by thermal shock and vibration test was compared with that of the representative high temperature solder materials such as Sn-3.5Ag, Sn-0.7Cu, and Sn-5.0Sb. In order to fabricate the test module, solder balls were made in joints with ENIG-finished BGA and then the BGA chip was reflowed on the OPS-finished PCB pattern. During the environmental tests, resistance change was continuously monitored and the joint strength was examined after tests. Sn-3.5Ag alloy exhibited the biggest degradation rate in resistance and shear stress and Sn-0.7Cu resulted in a relatively stable reliability against thermo-mechanical stress coming from thermal shock and vibration.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2010년도 춘계학술발표대회 초록집
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• pp.76-76
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• 2010

무연솔더 재료를 자동차 전장품에 적용하기 위해서는 고온환경에 대한 내구성 및 진동 인자에 대한 영향을 고려해야한다. 특히, ELV(End of Life Vehicles) 지침이 개정됨에 따라 고온용 무연솔더 재료에 대한 재평가가 반드시 필요한 시점이다. 이에 대해 본연구에서는 현재 상용화 된 Pb-free솔더의 재료들 중 총 4종의 Solder을 선정하여 자동차 환경에 부합하는 진동조건하에서 시험해보았다. 그리고 미세조직의 특성, 접합부 형성시의 기계적 강도 및 접합부의 신뢰성을 평가하여 보았다. 각각의 조성에 대한 CHIP type과 QFP type의 실장부품을 준비하였으며, 각각의 조성별로 솔더 페이스트로 Daisy Chain PCB에 접합하여 조성에 따른 비교 데이터를 구축할 수 있었다. 리플로우 공정후 초기의 미세조직 및 전당강도, 저항값을 측정하여 진동시험에 따른 데이터와 비교하였다. 주파수는 10Hz~1,000Hz였으며, 진동가속도는 $29.4m/s^2$, 20시간의 랜덤진동이 적용되는 동안 챔버내의 온도는 상온으로 유지되었다. 진동시험과 이에 따른 저항측정을 통하여 진동 주파수와 시간에 따른 실장 부품이 받는 진동 영향과 실시간 저항값을 측정하였으며, 이때의 미세조직 비교를 통해 진동특성을 평가하였다. 진동 주파수에 따른 저항값의 변화가 있었으며, 진동전후 전단강도에도 영향을 주었다. QFP type에서는 SAC105가 진동에 가장 취약하였으며, CHIP type에서는 SACX0307이 진동에 가장 취약하였다.

• 한국정밀공학회지
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• 제23권5호
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• pp.177-183
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• 2006

A tape feeder is an important feeding device to supply micro-chips such as 1005 and 0603 components to PCB in SMT process. Traditionally, tape feeding methods using sprocket wheel mechanism has been used for the pickup system of chip-mounters. However, there is growing needs for new feeding mechanism with high accuracy and confidence as electric components are getting much smaller. Thus, recently, a tape feeder using cam-slider mechanism is developed to meet such requirements. The major advantages of developed system are; significantly reduced indexing and backlash errors, slim and compact design, and improved repetitive capacity compared to existing system. In this paper, the performance evaluation criteria for the developed tape feeder are suggested. Stability against induced vibration, positioning accuracy, cycle time, durability and supply error rate are estimated using developed self testers. As a result, the excellence of developed tape feeding mechanism is validated using the effective rating methods.