• Proceedings of the IEEK Conference
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• 2000.06e
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• pp.9-12
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• 2000

This paper describes the modeling and experimental results of coreless printed circuit board (PCB) based transformer that can be used for power conversion at high frequency operation. The principle of using coreless PCB based transformer in 2MHz, 10W class ZVS Flyback DC-DC converter has been successfully demonstrated. The maximum power conversion efficiency is 79%. Even for high operating frequency, an efficiency greater than 70% can be obtained with under 1% regulation error.

• Journal of the Korean Institute of Navigation
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• v.23 no.2
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• pp.61-66
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• 1999

It is being more and more difficult to suppress emissions from electronic products using PCB(Printed Circuit Board) to the limit. Therefore, the exact evaluation of the emission from PCB has been more important to reduce the required time and the cost at the design phase of the products, especially on board ship's equipments. This research has evaluated the emission radiated from PCB based on the theoretical approach of SDA(Spectral Domain Analysis), which is available to analyze microwave stripline, coplanar line, patch antenna, etc. According to the theoretical results, it has been clearly shown that the emission radiated from PCB is reduced as the thickness of PCB is thinner, the permittivity of PCB is higher, the length of stripline is shorter, and the frequency is lower.

• Journal of Satellite, Information and Communications
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• v.9 no.4
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• pp.42-46
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• 2014

In this paper, a coil typed electromagnetic band gap (EBG) structure to be inserted in the printed circuit board (PCB) inner layer in order to stabilize the PCB power line is proposed and implemented for global-navigation satellite service (GNSS) with the bandwidth from 1.55GHz to 1.81GHz. From the measurement result of the PCB board including EBG structure, the insertion loss(S21) was measured below about -50dB. From these results, it is expected that the stabilization of power delivery network (PDN) structure in the PCB circuit design should be improved and the preparation to EMI will be effective.

• Journal of IKEEE
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• v.21 no.3
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• pp.272-275
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• 2017

Recently, semiconductor integration density enormously increases and its interconnection width is significantly narrowed, which leads to EMI (electromagnetic interference) problems on chip level. Chip manufacturer exploits TEM cell (transverse electromagnetic cell) to measure EMI on chip level, which requires PCB (printed circuit board) for measurement purpose. However, it is often neglected to consider that PCB patterns and other factors can affect on EMI measurement. In this paper, several test patterns are designed for different PCB design variables, and effects of PCB patterns on EMI measurement in TEM cell are analyzed. Based on these analyses, PCB design guidelines are also proposed to minimize the effects on EMI measurements.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.5
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• pp.89-96
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• 2007

Inkjet printing has become one of the most attractive manufacturing techniques in industry. Especially inkjet printing technology will soon be part of the PCB (Printed Circuit Board) fabrication processes. Traditional printing on PCB includes screen printing and photolithography. These technologies involve high costs, time-consuming procedures and several process steps. However, by inkjet technology manufacturing time and production costs can be reduced, and procedures can be more efficient. PCB manufacturers therefore willingly accept this inkjet technology to the PCB industry, and are quickly shifting from conventional to inkjet printing. To produce the printed circuit board by the inkjet technology, it must be harmonized with conductive nano ink, printing process, system, and inkjet printhead. In this study, micro patterning of conductive line has been investigated using the piezoelectric printhead driven by a bipolar voltage signal is used to dispense 20-40 ${\mu}m$ diameter droplets and silver nano ink which consists of 1 to 50 nm silver particles that are homogeneously suspended in an organic carrier. To fabricate a conductive line used in PCB with high precision, a printed line width was calculated and compared with printing results.

• Resources Recycling
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• v.23 no.6
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• pp.30-39
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• 2014

The trajectories of PCB(Printed Circuit Board) particles in the corona discharge electrostatic separation was simulated. The PCB particles are prepared by crushing bare board, which disassembled from electronic components, consist mostly of copper and FR-4(Flame Retardant Level-4) Firstly, a model was established for calculating of detachment points of PCB particles from the rotating electrode in separator. The model of detachment points was derived from equilibrium of force such as gravity force, centrifugal force, electrostatic force. The trajectories of particles after detachment was calculated by acceleration derived from time-integrating method of motion equation. In this simulation, particle size, supplied voltage, rotation speed of rotating roll electrode and angle of induction electrode were adopted as variables. While the trajectories of FR-4 particles were affected by all variables, rotation speed of rotating roll electrode was dominant variables affecting trajectories of copper particles.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.11 no.6
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• pp.664-670
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• 2018

In modern society, CCTV, which is the eye of surveillance, is being used to collect image data in various ways in daily life. CCTV is used not only for security, surveillance, and crime prevention but also in many fields such as automobile and black box. In this paper, we have developed a STM32F407 ARM chip based camera system for various applications. In order to develop camera system, modeling of camera system based on 3D structure was carried out in SolidWorks environment. The PCB board design was developed to extract the PCB parts from the camera system modeling files into iges files, convert them from the Altium Designer tool into 3D and 2D boards, After designing the camera system circuit and PCB, we have been studying the implementation of the stable system by using TRM (Thermal Risk Management) tool to cope with the heat simulation generated on the board.

• Journal of Korea Multimedia Society
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• v.12 no.3
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• pp.397-408
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• 2009

Image training is a very important yet difficult state for automated visual inspection using computers. Because the size of parts for the recently produced PCB (Printed Circuit Board) becomes smaller and circuit patterns gradually become more complex, a difficult and complex training process is becoming a big problem within an industry where development cycle for new products is short and various products must be inspected. This research produced a reference image by using CAD (Gerber) file which becomes a standard for PCB automatic visual inspection. Reference image from a Gerber file guarantees PCB patterns with no defects. Through system implementation and experimentation, Gerber file is used in order to propose a plan which allows an easy training process for PCB automatic visual inspection system.

• Proceedings of the KIPE Conference
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• 2003.07b
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• pp.781-784
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• 2003

In this paper, high density on-board dc/dc converter using multi-layer PCB is proposed. Recently, the communication system wants power supply of open-frame, high density and low profile. So experimental converter was consisted of 3.3V/30A Quarter Brick size DC/DC Converter. To power height limit, coil of transformer, choke and circuits were consisted of multi layer PCB. Besides to improve of efficiency, made secondary synchronous rectifier Mosfet driving circuit. So total efficiency could be improved.

• IE interfaces
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• v.18 no.3
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• pp.297-307
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• 2005

PCB assembly is a complicated and difficult process to optimize due to the necessity of simultaneous consideration of component’s rack assignment and board mounting sequencing. An efficient PCB assembly method is developed by using neighboring positioned identical components information as well as quantity and size of the components. It is found that same type of components are located closely each other by checking real PCBs and interviewing with PCB designers in practice. Better performance of the developed procedure is obtained along with more number of total components and more number of neighboring positioned identical components cases. Simulation models are developed using Visual C++ for performance evaluation purposes of the suggested heuristic.