• Resources Recycling
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• v.12 no.2
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• pp.3-10
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• 2003

Copper oxychloride used as an agricultural fungicide has been recovered from copper-containing waste etchant by the neutralization with alkali hydroxides. Large amount of copper-containing waste etchant is generated from Printed Circuit Board industry. In an environmental and economic point of view, retrieve of the valuable natural resource from the waste is important. Recycling process of copper oxychloride from the waste etchant is discovered through the our study. In the range of reaction temp. 2$0^{\circ}C$-4$0^{\circ}C$, pH 5-7, pure copper oxychloride was able to prepare and the yield of copper oxychloride was higher than 95%. Physical properties of the sample have been characterized using SEM, XRD, TGA, ICP and Atomic absorption spectroscopy.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.795-796
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• 2012

• 제어로봇시스템학회:학술대회논문집
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• 1993.10a
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• pp.244-249
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• 1993

This paper proposes a method of automatic function test for parts mounted Printed Circuit Board. For this purpose, we designed a Data Acquisition Equipment, PC interface card and inspection software. The experiment was done for the coffee vending machine and its result was good.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.195-196
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• 2008

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.11a
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• pp.187-190
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• 1998

In this paper a probe for the' measurement of dielectric properties of dielectric sheet materials is designed and implemented as a coaxial air line type. Using the broadband impedance method with this measurement probe the dielectric constant and loss tangent of the glass-epoxy and teflon are determined in the frequency range of 0.1 - l.O[GHz] with the temperature variation from $25[^{\circ}C]$ up to $65[^{\circ}C]$. A measured relative dielectric constant of the glass-epoxy is 4.42 and a loss tangents is 0.019 relatively, and the relative dielectric constants of teflon is 2.17 and a loss tangents is 0.002 relatively

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2003.05a
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• pp.741-743
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• 2003

A surface mount machine operation policy to assemble printed circuit boards is being developed in this research. The policy includes how to assign electronic components to slots on a component rack, and how to determine placement sequences on printed circuit board. The suggested heuristic uses information about component types and closeness relationships in each component on the board to assemble. First, the size of components and closeness ratings are used to divide them into two different size groups. Then rack assignment and placement routes are developed using component type and quantity information for a small size group, and followed by a large size group. Simulation models are developed using Visual C++ for performance evaluation of the heuristic. Necessary statistical analyses are provided to show the effectiveness of the suggested heuristic.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2009.10a
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• pp.422-424
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• 2009

In this paper, we studied methods that measure chip stack height using slit beam in mold equipment among semiconductor manufacture equipments. We studied two methods to improve chip stack height measurement performance. First, it is relation of camera exposure time and height measurement repeatability. Second we could improve measurement performance applying method of least mean square method for measurement error minimization about PCB(Printed Circuit Board) flexure phenomenon.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.7 s.349
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• pp.13-19
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• 2006

A 5Gb/s cross coupled transimpedance amplifier (TIA) & limiting amp(LA), regulated cascode(RGC) is realized in a 0.18$\mu$m CMOS technology for optical printed circuit board applications. The optical receiver demonstrates $92.8db{\Omega}$ transimpedance and limiting amplifier gain, 5Gb/s bandwidth for 0.5pF photodiode capacitance, and 9.74mW power dissipation from 1.8V, 2.4V supply. Input stage impedance is $50{\Omega}$. The circuit was implemented on an optical PCB, and the 5Gb/s data output signal was measured with a good data eye opening.

• Proceedings of the KIEE Conference
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• 2004.11c
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• pp.577-579
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• 2004

Digital hearing aids enclose $6{\sim}8$ tiny components. Those electromechanical components are individually wired by soldering which is a manual labor and sometimes causes components' damage by heating. This paper suggests a PCB design for overcome these problems. Several PCBs are designed and manufactured and circuited to produce ITE(In The Ear) type hearing aids which are inserted in the ear canal. The most optimal size of the PCB design for the ITE hearing aid is presented in this paper.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2000.10a
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• pp.141-147
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• 2000

For miniaturization of electronic parts and higher productivity, part arrangement job of PCB(printed Circuit Board) has been replaced with complete automated facilities, and contribution which is concerned about this will be expanded continuously. Such part arrangement job of PCB could have lots of influences to entire productivity In this paper, effective grouping method of parts is suggested for the effective insertion path job of PCB concerning the constraints to the size of parts.