• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2017.10a
• /
• pp.166-169
• /
• 2017

Currently, studies using Deep Learning are actively carried out showing good results in many fields. A template matching method is mainly used to recognize parts mounted on PCB(Printed Circuit Board). However, template matching should have multiple templates depending on the shape, orientation and brightness. And it takes long time to perform matching because it searches for the entire image. And there is also a disadvantage that the recognition rate is considerably low. In this paper, we use the Faster-RCNN method for recognizing PCB components as machine learning for classifying several objects in one image. This method performs better than the template matching method, execution time and recognition.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.41 no.5
• /
• pp.421-426
• /
• 2017

In this study, we propose a method for predicting the mechanical properties of the printed circuit board (PCB) that has transversely isotropic characteristics. Unlike the isotropic material, there is no specific test standard for acquisition of the transversely isotropic properties. In addition, common material test methods are not readily applicable to that type of laminated thin plate. Utilizing the natural frequency obtained by a modal test and the sizing optimization technique provided in $OptiStruct^{(R)}$, the mechanical properties of a PCB were derived to minimize the difference between test and analysis results. In addition, the validity of the predicted mechanical properties was confirmed by the MAC (Modal Assurance Criteria) value of each of the compared mode shapes. This proposed approach is expected to be extended to the structural analysis for the design verification of the top product that includes a PCB.

• Journal of the Microelectronics and Packaging Society
• /
• v.11 no.1
• /
• pp.21-28
• /
• 2004

We have demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon ) printed circuit board (PCB). The copper lines were formed with 100$\mu\textrm{m}$ width and 18$\mu\textrm{m}$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of 100-200$\mu\textrm{m}$. The DFRs of 15$\mu\textrm{m}$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100{\circ}C$ to 15$0^{\circ}C$ and laminating speed from 0.28-0.98cm/s. We have found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63cm/s. And the smallest size of indium solder bump was diameter of 50$\mu\textrm{m}$ with pitch of 100$\mu\textrm{m}$.

• Proceedings of the KSME Conference
• /
• 2007.05a
• /
• pp.321-325
• /
• 2007

Recently, demands on thin multi-layer printed circuit boards(PCB) have been rapidly increased with broad spread of personal portable digital appliances such as multi-media. In case of mobile phone, however, the fact that PCBs have low flexural strength might cause defects. The purpose of this study is to improve the flexural strength by substituting the well-known GFRP(glass fiber reinforced plastic) for CFRP(carbon fiber reinforced plastic). Firstly, finite element simulation was carried out using ABAQUS to find out a unique CFRP layer that has a role to sustain the applied forces mainly in PCB. Secondly, three point bending tests were conducted with the newly designed CFRP PCB model to verify the improvement of the flexural strength. Consequently, it is shown that PCB layered with the CFRP on both outer sides of the board can be used to improve the flexural strength effectively.

• Journal of Korean Society of Industrial and Systems Engineering
• /
• v.16 no.28
• /
• pp.1-8
• /
• 1993

Electrical or electronic products have been becoming smaller and high integrated recently, with printed circuit boards(PCB's) being the key components for these products. The introduction of new technology of surface mounted devices(SMD) opens new ways towards high integration on the PCB. Many plants in eletronical industry which produce high variety of PCB's to meet the demands of customer orders require flexibility in PCB's production lines. This survey paper describes the related optimization problems and solution methods to the automated surface mount technology(SMT) assembly lines, and provides with the research direction for improving flexibility.

• Resources Recycling
• /
• v.21 no.3
• /
• pp.56-64
• /
• 2012

It is generally well known that PCB (Printed Circuit Board) is an electric component assembled by various metals mixed with plastics and ceramics. Accordingly, it is very important to extract metallic components from used PCBs from the point of view of recycling of used resources as well as an environmental protection. In this paper, patents and paper on the recycling technologies of PCB were analyzed. The range of search was limited in the open patents of USA (US), European Union (EP), Japan (JP), Korea (KR) and SCI journals from 1980 to 2011. Patents and journals were collected using key-words searching and filtered by filtering criteria. The trends of the patents and journals was analyzed by the years, countries, companies, and technologies.

• Resources Recycling
• /
• v.26 no.4
• /
• pp.9-18
• /
• 2017

Recently, the amount of electronic scrap is rapidly increasing due to the rapid growth of the electronics industry. Among the components of electronic scrap, the printed circuit board(PCB) is an important recycling target which includes common metals, precious metals, and rare metals such as gold, silver, copper, tin, nickel and so on. In Korea, however, PCB recycling technologies are mainly commercialized by some major companies, and other process quantities are not accurately counted. According to present situation, several urban mining companies, research institutes, and universities are conducting research on recovery of valuable metals from PCBs and/or reusing them as raw materials that is different from existing commercialization process developed by major companies. In this study, we analyzed not only current status of collection/disposal process and recycling of waste PCBs in Korea but also the trend of recycling technologies in order to help resource circulation from waste PCBs become more active.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.15 no.8
• /
• pp.702-707
• /
• 2002

This paper presents a micro fluxgate sensor in printed circuit board (PCB). The fluxgate sensor consists of five PCB stack layers including one layer magnetic core and four layers of excitation and pick-up coils. The center layer as a magnetic core is made of a micro patterned amorphous magnetic ribbon and the core has a rectangular-ring shape. The amorphous magnetic core is easily saturated due to the low coercive field and closed magnetic path for the excitation field. Four outer layers as an excitation and pick-up coils have a planar solenoid structure. The chip size of the fabricated sensing element is 7.3$\times$5.7$\textrm{mm}^2$. Excellent linear response over the range of -100$\mu$T to +100$\mu$T is obtained with 540V/T sensitivity at excitation square wave of 3 $V_{p-p}$ and 360kHz. The very low power consumption of ~8mW was measured. This magnetic sensing element, which measures the lower fields than 50$\mu$T, is very useful for various applications such as: portable navigation systems, military research, medical research, and space research.h.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.1853-1856
• /
• 2003

Multi-layer printed circuit board(PCB) is being used widely for the product with relatively complex circuits such as TV, VTR and FAX. With the rapid enlargement of electronic and IT industry, the hole machining technology on multi-layer PCB is increasingly required to improve. Thus, the micro drilling with ultrasonic vibration can be a good method for hole machining. Unlike conventional drilling, ultrasonic vibration applied drilling introduces less wear and fracture of not only tool but also internal surface of workpiece due to little cutting resistance, thus, machinability can be improved. The experiment is conducted through the comparison between the results of conventional drilling and ultrasonic micro drilling as well as among each results by the variation according to not only feed rate of drill but also amplitude and frequency of ultrasonic vibration. The multi-layer PCB consists of 6 layers and ${\Phi}$0.3 diameter drill was used. As a result, it was found that the state of internal surfaces of holes on multiple layer PCBs is improved by the application of ultrasonic vibration.

• Resources Recycling
• /
• v.10 no.6
• /
• pp.15-21
• /
• 2001

Shape-controlled copper oxides have been recovered from copper-containing waste etchant by neutralization with alkalihydroxide. Large amount of copper-containing waste etchant is generated from Printed Circuit Board industry. In an environmental and economic point of view, retrieve of the valuable natural resource from the waste is important. In recycling process of copper oxide from the waste etchant, reaction temperature controls shapes and sizes of the products. Copper oxide recovered below reaction temperature $40^{\circ}C$ was of a needle shape, while copper oxide comes in a platy shape above $40 ^{\circ}C$ . Physical properties of samples have been characterized using SEM, XRD, TGA and Atomic absorption spectroscopy.