• Journal of Welding and Joining
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• v.18 no.2
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• pp.222-222
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)

• Journal of Welding and Joining
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• v.18 no.2
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• pp.95-99
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB banking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB banking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate.

• Transactions on Electrical and Electronic Materials
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• v.13 no.3
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• pp.129-135
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• 2012

A number of surface mount technology (SMT) process variables including land design are considered for minimizing tombstone defect in flexible printed circuit assembly in high volume manufacturing. As SMT chip components have been reduced over the past years with their weights in milligrams, the torque that once helped self-centering of chips, gears to tombstone defects. In this paper, we have investigated the correlation of the assembly process variables with respect to the tombstone defect by employing statistically designed experiment. After the statistical analysis is performed, we have setup hypotheses for the root causes of tombstone defect and derived main effects and interactions of the process parameters affecting the hypothesis. Based on the designed experiments, statistical analysis was performed to investigate significant process variable for the purpose of process control in flexible printed circuit manufacturing area. Finally, we provide beneficial suggestions for find-pitch PCB design, screen printing process, chip-mounting process, and reflow process to minimize the tombstone defects.

• Proceedings of the Korean Society of Computer Information Conference
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• 2024.01a
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• pp.289-290
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• 2024

PCB(Printed circuit board)생산시에 중요한 역할을 담당하는 비전검사 시스템의 성능은 지속적으로 발전해왔다. 기존 머신 비전 검사 시스템은 이미지가 불규칙하고 비정형일 경우 해석이 어렵고 전문가의 경험에 의존한다. 그리고 비전검사 시스템 개발 당시의 기준과 다른 불량이 발생한다면 검출이 불가능 하거나 정확도가 낮게 나온다. 본 논문에서는 이를 개선하고자 딥러닝 영상인식을 이용한 PCB 기판 비전 검사 시스템을 구현하였다. 딥러닝 영상인식 알고리즘은 YOLOv4를 이용하고, 워핑(warping)과 시킨 PCB 이미지를 학습하여 비전검사 시스템을 구성하였다. 딥러닝 영상인식 기술의 처리 속도를 보완하고자 QR코드로 PCB 기판 종류를 인식하고, 해당 PCB 부품의 미삽은 정답 이미지 바운딩 박스 좌표와 비교하여 불량품을 발견하면 표시해준다. 기판의 부품 인식을 위해 기판 데이터는 직접 촬영하여 수집하였다. 이를 활용하여 PCB 생산 공정에서 비전검사 시스템의 성능이 향상되었고,, 다양한 PCB를 생산에 신속하게 대응할 수 있다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.4
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• pp.132-137
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• 2018

Although the number of chemical accidents has been declining since the Chemical Control Act of 2015, there have been repeated occurrences of similar types of accidents at printed circuit board (PCB) manufacturing facilities. These accidents were caused by the overflow of hydrochloric acid and hydrogen peroxide, which are toxic chemicals used in the printed circuit board manufacturing process. An analysis of the $Cl^-$ content to identify the cause of the accident showed that in the mixed route of hydrochloric acid and hydrogen peroxide, which are accidental substances, the $Cl^-$ concentration was 66.85 ppm in the hydrogen peroxide sample. Through reaction experiments, it was confirmed that the deformation of a PVC storage tank and generation of chlorine gas, which is a toxic gas, occurred due to reaction heat occurring up to $50.5^{\circ}C$. This paper proposes a facility safety management plan, including overcharge, overflow prevention, leak detection device, and separation tank design for mixing prevention in printed circuit board manufacturing facility etch process. To prevent the recurrence of accidents of the same type, the necessity of a periodic facility safety inspection and strengthening of the safety education of workers was discussed.

• Korean Journal of Materials Research
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• v.17 no.12
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• pp.676-681
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• 2007

According to progress rapidly digitalization, networked and mobilization of electronics industry, there are demands for being smaller, thinner, more light, and more efficient complex functions of electronic devices which are wireless devices, semi-conductors, packages and mobile devices. Therefore, the solder resist on a printed circuit board have been required with the high resolution and the eco-friendly materials in the surface treatments such as high heating process and coating process with electrolysis. In this study, the photoinitiator initiator and monomers of the solder resist were prepared with their contents for reducing the occurrence of the under-cut. We investigated the sample surface by UV/VIS spectrometer, FT-IR, OM after HASL and ENIG process. From our results, it is possible to get a high adhesion of resist with optimal contents between the photoinitiator initiator and monomers after surface treatments.

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.8
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• pp.697-702
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• 2000

The paper considers the problem of improving the productivity of surface mounting in the printed circuit board(PCB) assembly line. This problem is generally divided into two problems ; real assignment problem and pick-and -place sequencing problem which are known to have no polynomial time algorithms. In the last ten years algorithm designers have been trying to solve them separately. However they need to be solved jointly because they are highly interrelated. This paper proposes an evolutionary algorithm which can consider the two problems jointly and thus yield a better solution. In order to evaluate the proposed algorithm computer simulation is performed on real-life surface mounting machines. The proposed algorithm is expected to reduce the assembly time of surface mounting machines and thus improve the productivity.

• Management & Information Systems Review
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• v.34 no.2
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• pp.67-78
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• 2015

In this paper, we consider a scheduling problem of printed circuit board production process with setup cost depending job sequence. Given a set of PCBs, these are produced in single surface mounting device. The problem is to define job sequence with the objective of minimizing the total seutp cost. We propose a mathematical formulation and the problem is proven to be NP-hard. So, a meta heuristic based on genetic algorithm is developed.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.7 no.3
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• pp.461-472
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• 1995

The interaction of laminar mixed convection and surface radiation in a two-dimensional channel with an array of rectangular blocks is analyzed numerically. Three blocks are maintained at high temperature and the other bottom and top horizontal walls are insulated. Discrete ordinate method(DOM) is introduced to analyze the radiative heat transfer. The effects of the variations of Reynolds number and channel specifications on the heat transfer characteristics are investigated. The average Nusselt numbers along the block surfaces are correlated and presented in terms of Reynolds number and dimensionless geometric parameters such as the block spacing, height and channel spacing. For the conditions considered in this study, average Nusselt numbers along the block surfaces are strongly influenced by the channel spacing and Reynolds number but weakly influenced by the block spacing and block height.

• Journal of the Korea Society of Computer and Information
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• v.21 no.2
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• pp.97-103
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• 2016

This paper deals with the cycle time minimization problem that determines the productivity in printed circuit board (PCB) with n components using the m placement machines. This is known as production cycle time determination problem (PCTDP). The polynomial time algorithm to be obtain the optimal solution has been unknown yet, therefore this hard problem classified by NP-complete. This paper gets the initial assignment result with the machine has minimum unit placement time per each component firstly. Then, the balancing process with reallocation from overhead machine to underhead machine. Finally, we perform the swap optimization and get the optimal solution of cycle time $T^*$ within O(mn) computational complexity. For experimental data, the proposed algorithm can be obtain the same result as integer programming+branch-and-bound (IP+B&B) and B&B.