• Title/Summary/Keyword: P21 Tool Steel

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Fabrication of Functionally Graded Materials Between P21 Tool Steel and Cu by Using Laser-Aided Layered Manufacturing (레이저 적층조형을 이용한 P21 툴 스틸과 Cu 간 기능성 경사 복합재의 제작)

  • Jeong, Jong-Seol;Shin, Ki-Hoon
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.37 no.1
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    • pp.61-66
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    • 2013
  • With the development of layered manufacturing, thermally conductive molds or molds embedding conformal cooling channels can be directly fabricated. Although P21 tool steel is widely used as a mold material because of its dimensional stability, it is not efficient for cooling molds owing to its low thermal conductivity. Hence, the use of functionally graded materials (FGMs) between P21 and Cu may circumvent a tradeoff between the strength and the heat transfer rate. As a preliminary study for the layered manufacturing of thermally conductive molds having FGM structures, one-dimensional P21-Cu FGMs were fabricated by using laser-aided direct metal tooling (DMT), and then, material properties such as the thermal conductivity and specific heat that are related to the heat transfer were measured and analyzed.

Life and Mechanical Properties of Hot Former Die for Bearing Race using P/M High Speed Steel (분말고속도공구강을 활용한 베어링 레이스 열간 단조 금형의 수명 및 기계적 특성)

  • Hong, Seong-Hyeon;Bae, Jong-Soo
    • Journal of Powder Materials
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    • v.14 no.6
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    • pp.367-371
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    • 2007
  • P/M high speed steel (1.26% C, 4.42% Cr, 6.54% W, 4.92% Mo, 3.21 % V, 8.77% Co, bal. Fe) was applied to hot former die. It showed that the die life became 2.7 times higher than that of cast/wrought SKH 55 tool steel which is commercially used. The increase of die life was corresponding to the improved hardness and transverse rupture strength of PM high speed steel due to the finer grain and carbide as well as the uniform carbide distribution. The P/M high speed steel with the promoted die life could be an alternative to the conventional SKH55.

A Development of SEM Applied Microjoining System (SEM을 이용한 미세 접합 시스템 개발)

  • 황일한;나석주
    • Journal of Welding and Joining
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    • v.21 no.4
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    • pp.63-68
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    • 2003
  • Scanning electron microscopy (SEM) has been used as a surface measurement instrument and a tool for lithography in semiconductor process due to its high density localized beam. For those purposes, however, the maximum current of SEM Is less than 100pA, which is not enough fo material processing. In this paper SEM was modified to increase the amount of current reaching a specimen from gun part where current is generated, the possibility of applying SEM to material processing, especially microjoining, was investigated. The maximum current of SEM after modifications was measured up to 10$\mu$A, which is about 10$^{5}$ times greater than before modifications. Through experiments such as eutectic solder wetting on thin 304 stainless steel foil and microjoining of 10$\mu$m thick 304 stainless steel, the intensity of electron beam of SEM proved to be great enough fur material processing as heat source. And a tight jig system was found necessary to hold materials close enough fur successful microloining.

Design of the Thermally Conductive Mould to Improve Cooling Characteristics of Injection Mould for a Mouse (마우스 사출성형금형의 냉각 특성 향상을 위한 열전도성 금형 설계)

  • Ahn, Dong-Gyu;Kim, Hyun-Woo;Lee, Ki-Yong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.33 no.3
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    • pp.201-209
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    • 2009
  • The objective of present research work is to design the heat conductive mould to improve cooling characteristics of the injection mould for a mouse. In order to obtain the high cooling rate of the mould, a heat conductive mould with three different materials was designed. The materials of the base structure, the mid-layer and the molding part of the heat conductive mould were chosen as Cu-Ni alloy (Ampcoloy 940) to improve the heat conductivity of the mould, Ni-Cu alloy (Monel 400) to reduce a thermal stress, injection tool steel (P21), respectively. Through the three-dimensional transient heat transfer analysis and the thermal stress analysis, the effects of the geometrical arrangement of each material on the cooling characteristics and the thermal stress distribution were examined. From the results of the analyses, a proper design of the thermal conductive mould was obtained.