A study of properties for phosphorous content of ENIG against Sn-3Ag-0.5Cu solders (Sn-3Ag-0.5Cu solder에 대한 무전해 Ni-P층의 P함량에 따른 특성 연구)
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- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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- 2009.11a
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- pp.24-24
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- 2009