• 한국세라믹학회지
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• 제49권4호
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• pp.301-307
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• 2012

SiAlON glasses are silicates or alumino-silicates, containing Mg, Ca, Y or rare earth (RE) ions as modifiers, in which nitrogen atoms substitute for oxygen atoms in the glass network. These glasses are found as intergranular films and at triple point junctions in silicon nitride ceramics and these grain boundary phases affect their fracture behaviour. This paper provides an overview of the preparation of M-SiAlON glasses and outlines the effects of composition on properties. As nitrogen substitutes for oxygen in SiAlON glasses, increases are observed in glass transition temperatures, viscosities, elastic moduli and microhardness. These property changes are compared with known effects of grain boundary glass chemistry in silicon nitride ceramics. Oxide sintering additives provide conditions for liquid phase sintering, reacting with surface silica on the $Si_3N_4$ particles and some of the nitride to form SiAlON liquid phases which on cooling remain as intergranular glasses. Thermal expansion mismatch between the grain boundary glass and the silicon nitride causes residual stresses in the material which can be determined from bulk SiAlON glass properties. The tensile residual stresses in the glass phase increase with increasing Y:Al ratio and this correlates with increasing fracture toughness as a result of easier debonding at the glass/${\beta}-Si_3N_4$ interface.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.292-292
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• 2009

OLED(Organic Light Emitting Device)는 LCD(Liquid Crystal Display)의 뒤를 잇는 차세대 디스플레이의 선두주자로서 자체발광형이기 때문에 백라이트 등의 보조광원이 불필요하며, 구동전압이 낮고 넓은 시야각과 빠른 응답속도 등의 특징을 가지고 있다. 또한 플렉서블 기판을 사용할 수 있어 차세대 디스플레이인 플렉서블 디스플레이에 적합하다. 플렉서블한 디스플레이를 만들기 위해서 플라스틱 기판에 OLED 물질을 사용하여 기존에 무겁고, 깨지기 쉬우며, 변형이 불가능한 유리로 만든 소자 보다 더 가볍고 깨지지 않고 변형이 가능한 플렉서블 디스플레이를 제작 할 수 있다. 그러나 플라스틱 기판은 매우 큰 투습율을 가지고 있어 OLED소자에 적용시키면 공기 중의 수분이나 산소와 접촉이 많아져 쉽게 산화되어 소자의 효율 및 수명이 짧아진다. 또한 OLED에 사용되는 유기물도 산소나 수분에 의해 특성이 급격히 저하되기 때문에 산소 및 수분의 차단은 필수적이다. 이러한 단점을 최소화하기 위해서 PECVD(Plasma Enhanced Chemical Vapor Deposition)로 만든 SiON(Silicon Oxynitride) 박막을 차단막(Passivation layer)으로 사용하였다. PECVD를 이용하여 SiON 박막을 증착시킬 때 RF Power, 공정압력, Distance의 변화에 따른 박막의 결정화도, 수분투습도, 광투과도 등의 특성을 FT-IR(Fourier Transform Infrared Spectroscopy), Ellipsometer, UV-visible Spectrophotometer, MOCON를 이용하여 SiON 박막의 특성을 고찰하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1991년도 추계학술대회 논문집 학회본부
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• pp.237-240
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• 1991

In this paper, silicon oxynitride(SiON) films were chemically deposited by 193 nm Excimer laser irradiated parallel to the substrate. the laser pulse energy was 80 mJ, repetetion rate was 80 Hz and the laser average power was 6.4 watt, the gas ratio of $N_2O/NH_3$ was 0.75, the substrate temperature was $300^{\circ}C$, and the chamber pressure was 2 torr. And then, the interface state density($N_{ss}$) was characterized by DLTS(Deep Level Transient Spectroscopy). In addition, the capture cross section($\sigma$) and activation energy(${\Delta}E$) was also obtained. The resulting Nss values were $5.5{\times}10^{10}-3.2{\times}10^{11}(eV^{-1}cm^{-2})$, $\sigma$ was $6.64{\times}10^{-20}-2.114{\times}10^{-17}(cm^2)$, the ${\Delta}E$ of two peaks were $8.93{\times}10^{-2}$(eV), 0.375(eV).

• 대한전기학회:학술대회논문집
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• 대한전기학회 1991년도 추계학술대회 논문집 학회본부
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• pp.241-244
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• 1991

In this paper, we introduced Silicon Oxynitride films deposited by Laser CVD, and evaluated the electrical breakdown of these films by TZDB(Time Zero Dielectric Breakdown) and TDDB(Time Dependent Dielectric Breakdown) test. In addition, high frequency C-V test was done in order to calculate hysterisis and flatband voltage(before and after electric field stress). Failure times against eletric field are examined and electric field accelation factor $\beta$ are obtained, and long term reliability was also described by extrapolating into life time in the operating voltage(5V). In this experiments, the deposited films with increased temperature represented small flatband voltage, hysterisis and favorable breakdown characteristics, this is why the hydrogen in the film was decreased and the film was densified, long term reliability was good in the laser CVD SiON films.

• 한국표면공학회지
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• 제33권2호
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• pp.93-100
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• 2000

Effects of Ti content and Ti underlayer on the pitting behavior of TiN coated AISI 304 stainless steel have been studied. The stainless steel containing 0.1~1.0wt% Ti were melted with a vacuum melting furnace and heat treated at $1050^{\circ}C$ for 1hr for solutionization. The specimen were coated with l$\mu\textrm{m}$ and 2$\mu\textrm{m}$ thickness of Ti and TiN by E-beam PVD method. The microstructure and phase analysis were conducted by using XRD, XPS and SEM with these specimen. XRD patterns shows that in TiN single-layer only the TiN (111) Peak is major and the other peaks are very weak, but in Ti/TiN double-layer TiN (220) and TiN (200) peaks are developed. It is observed that the surface of coating is covered with titanium oxide (TiO$_2$) and titanium oxynitride ($TiO_2$N) as well as TiN. Corrosion potential on the anodic polarization curve measured in HCl solution increase in proportion to the Ti content of substrate and by a presence of the Ti underlayer, whereas corrosion and passivation current densities are not affected by either of them. The number and size of pits decrease with increasing Ti content and a presence of the coated Ti film as underlayer in the TiN coated stainless steel.

• 한국수소및신에너지학회논문집
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• 제17권1호
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• pp.55-61
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• 2006

신규 $Nb_2Zr_6O_{17-x}N_x$ 광촉매를 고상합성법처리(solid state synthesis) 후 암모니아가스($NH_3$)에 의한 기상처리법(ammonolysis)으로 합성하였다. 합성된 신규 광촉매 및 이를 다시 Pt 및 $RuO_2$를 도핑 하여 $H_2S$를 광분해하여 수소를 발생 실험을 수행하였다. 이 신규 oxynitrid계 광촉매는 가시광하에서 $H_2S$를 광분해하여 수소를 발생하는(Quantum yield = 13.5 %) 우수한 광촉매 활성을 보여주었다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1462-1464
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• 2006

Scaling rules for TFT application devices have led to the necessity of ultra thin dielectric films and high-k dielectric layers. In this paper, The advantages of high concentration of nitrogen in silicon oxide layer deposited by using $N_2O$ in Inductively Coupled Plasma Chemical Vapor Deposition (ICP-CVD) is investigated using X-ray energy dispersive spectroscopy (EDS). We have reported about Ellipsometric measurement, Capacitance - Voltage characterization and processing conditions.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.207-209
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• 2004

Currently, for satisfying the needs of scaled MOSFET's a high quality thin oxide dielectric is desired because the properties of conventional $SiO_2$ film are not acceptable for these very small sized transistors. As an alternative gate dielectric have drawn considerable alternation due to their superior performance and reliability properties over conventional $SiO_2$, to obtain the superior characteristics of ultra thin dielectric films, $N_2O$ grown thin oxynitride has been proposed as a dielectric growtuanneal ambient. In this study the authors observed process characteristics of $N_2O$ grown thin dielectric. In view points of the process characteristics of MOS capacitor, the sheet resistance of 4.07$[\Omega/sq.]$, the film stress of $1.009e^{10}[dyne/cm^2]$, the threshold voltage$(V_t)$ of 0.39[V], the breakdown voltage(BV[V]) of 11.45[V] was measured in PMOS. I could achieve improved electrical characteristics and reliability for deep submicron MOSFET devices with $N_2O$ thin oxide.

• 한국세라믹학회지
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• 제38권1호
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• pp.22-27
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• 2001

$\beta$-Si$_3$N$_4$종자입자 첨가가 소결조제로 Y-Mg-Si-Al-O-N계 oxynitride glass를 사용하여 일축가압 소결을 행한 SiC-Si$_3$N$_4$복합재료의 미세구조와 기계적 특성에 미치는 영향을 고찰하였다. 길게 자란 $\beta$-Si$_3$N$_4$입자들과 등방성의 $\beta$-SiC 입자들이 균일하게 분포된 미세구조를 얻었다. $\beta$-Si$_3$N$_4$종자입자 함량이 증가함에 따라 SiC-Si$_3$N$_4$복합재료의 강도와 파괴인성이 증가하였고, 이는 복합화에 기인하는 결함크기의 감소와 길게 자란 $\beta$-Si$_3$N$_4$입자에 의한 균열가교 및 균열회절 등에 기인하였다. SiC-70 wt% Si$_3$N$_4$복합재료의 대표적인 강도와 파괴인성은 각각 770 MPa과 6.2 MPa.m$^{1}$2/ 이었다.

• Journal of Mechanical Science and Technology
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• 제18권3호
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• pp.388-394
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• 2004

Composites of Si$_3$N$_4$-SiC containing up to 30 wt% of dispersed SiC particles were fabricated via hot-pressing with an oxynitride glass. To determine the effect of sintering time and SiC content on the mechanical properties and the cutting performance, the composites with fixed 8hr-sintering time and 20 wt% SiC content were fabricated and tested. Fracture toughness of the composites increased with increasing sintering time, while the hardness increased as the SiC content increased up to 20 wt%. The hardness of the composites was relatively independent of the grain size and the sintered density. For machining heat-treated AISI4140, the insert with 20 wt% SiC sintered for 8hr showed the longest tool life while the insert with 20 wt% SiC sintered for 12hr showed the longest tool life for machining gray cast iron. An effort was made to relate the mechanical properties, such as hardness, fracture toughness and wear resistance coefficient with the tool life. However, no apparent relationship was found between them. It may be stated that tool life is affected by not only the mechanical properties but also other properties such as surface roughness, density, grian size and the number of the inherent defects in the inserts.