• 한국전기전자재료학회논문지
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• 제13권1호
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• pp.80-84
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• 2000

BSCCO thin films are fabricated via a co-deposition process by an ion beam sputtering with an ultra-low growth rate, and sticking coefficients of the respective elements are evaluated. The sticking coeffi-cient of Bi element exhibits a characteristic temperature dependence : almost a constant value of 0.49 below 73$0^{\circ}C$ and decreases linearly with temperature over 73$0^{\circ}C$. This temperature dependence can be elucidated from the evaporation and sublimation rates of bismuth oxide, Bi\ulcornerO\ulcorner, from the film surface. It is considered that the liquid phase of the bismuth oxide plays an important role in the Bi(2212) phase formation in the co-deposition process.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 춘계학술대회 논문집
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• pp.94-97
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• 2005

Bismuth high Tc superconducting thin films are fabricated via a co-deposition process by an ion beam sputtering with an ultra low growth rate, and sticking processing of the respective elements are evaluated. The sticking processing of bismuth element in bismuth high Tc superconducting thin film formation was observed to show a unique temperature dependence; it was almost a constant value of 0.49 below about $730^{\circ}C$ and decreased linearly over about $730^{\circ}C$. This temperature dependence can be elucidated from the evaporation and sublimation rates of bismuth oxide, $Bi_2O_3$, from the film surface. It is considered that the liquid phase of the bismuth oxide plays an important role in the bismuth phase formation in the co-deposition process.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.198-202
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• 2002

$HfO_2$films were grown on Si substrate in the temperature range $250~550^{\circ}C$ using metal organic chemical vapor deposition (MOCVD) technique for a gate dielectric. Hafnium tart-butoxide and Oxygen gas were used as precursors and N2 was used as carrier gas. Impurity distribution and film structure(including interfacial layer) were studied at the deposition temperature range between 25$0^{\circ}C$ and $550^{\circ}C$. The growth rate and impurty distribution decreased with increasing temperature. The electrical properties of $HfO_2$were investigated with C-V, 1-V method and showed it has a good properties as a gate dielectric.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.213-216
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• 1999

BSCCO thin films are fabricated via a co-deposition process by an ion beam sputtering with an ultra-low growth rate, and sticking coefficients of the respective elements are evaluated. The sticking coefficient of Bi element exhibits a characteristics temperature dependence : almost a constant value of 0.49 below 730$^{\circ}C$ and decreases linearly with temperature over 730$^{\circ}C$. This temperature dependence can be elucidated from the evaporation and sublimation rates of bismuth oxide, Bi$_2$O$_3$ from the film surface. It is considered that the liquid phase of the bismuth oxide plays an important role in the Bi(2212) phase formation in the co-deposition process.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.193-197
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• 2000

BSCCO thin films are fabricated via a co-deposition process by an ion beam sputtering with an ultra-low growth rate, and sticking coefficients of the respective elements are evaluated. The sticking coefficient of Bi element exhibits a characteristic temperature dependence : almost a constant value of 0.49 below 73$0^{\circ}C$ and decreases linearly with temperature over 73$0^{\circ}C$. This temperature dependence can be elucidated from the evaporation and sublimation rates of bismuth oxide, Bi$_2$O$_3$, from the film surface. It is considered that the liquid phase of the bismuth oxide plays an important role in the Bi(2212) phase formation in the co-deposition process.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2008년도 제31회 추계학술대회논문집
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• pp.217-220
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• 2008

킥모터의 정확한 성능 예측을 위해서 슬래그 적층량을 구하였다. 알루미늄 액적의 궤적 계산을 통해 슬래그가 모터 내부에 적층되는 현상을 나타내었다. 유동현상 및 액적의 적층 현상을 Flunet 6.3을 사용해서 수치해석을 수행하였다. 슬래그 적층량을 예측하기 위해 비행중의 가속도, 액적의 크기 등에 대한 영향을 분석하였고 이를 고려하여 총 슬래그양을 구하였다. 지상시험 결과를 이용해서 구한 슬래그양과 비교해서 수치해석을 통한 슬래그 적층량이 잘 예측된 것을 확인하였다.

• Bulletin of the Korean Chemical Society
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• 제34권5호
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• pp.1462-1466
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• 2013

We demonstrate that ruthenium oxide ($RuO_2$) nanotubes with controlled dimensions can be synthesized using facile electrochemical means and anodic aluminum oxide (AAO) templates. $RuO_2$ nanotubes were formed using a cyclic voltammetric deposition technique and an aqueous plating solution composed of $RuCl_3$. Linear sweep voltammetry (LSV) was used to determine the effective electrochemical oxidation potential of $Ru^{3+}$ to $RuO_2$. The length and wall thickness of $RuO_2$ nanotubes can be adjusted by varying the range and cycles of the electrochemical cyclic voltammetric potentials. Thick-walled $RuO_2$ nanotubes were obtained using a wide electrochemical potential range (-0.2~1 V). In contrast, an electrochemical deposition potential range from 0.8 to 1 V produced thin-walled and longer $RuO_2$ nanotubes in an identical number of cycles. The dependence of wall thickness and length of $RuO_2$ nanotubes on the range of cyclic voltammetric electrochemical potentials was attributed to the distinct ionic diffusion times. This significantly improves the ratio of surface area to mass of materials synthesized using AAO templates. Furthermore, this study is directive to the controlled synthesis of other metal oxide nanotubes using a similar strategy.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 하계학술대회 논문집 C
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• pp.1535-1537
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• 2003

Manganese oxide electrode was designed to improve electrical conductivity for dimensionally stable anode(DSA) using discreet variation (DV)-X${\alpha}$ method. It was calculated in DV-X${\alpha}$ method that the addition of nickel to manganese oxide reduce the energy band gap of manganese oxide electrode. Therefore, it is estimated that nickel in 3 additive elements of Ti, Ni and Sn is the best candidate to improve the electrical conductivity of manganese oxide. The anodically deposited manganese oxide which was produced in 0.2M $MnSO_4$ and 0.2M (Mn,Ni)$SO_4$ solution had $MnSO_4$ structure which was identified by XRD. The $MnSO_4$ films produced in both solutions over than 50mA/$cm^2$ of current density and long deposition time of 600sec showed low adhesion with Ti substrate.

• 대한화학회지
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• 제43권1호
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• pp.23-29
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• 1999

황산용액에서 제조된 Al양극 산화피막 내부로 여러 주파수의 교류전압을 통하여 1 g/L $KMnO_4$ 용액내에서 Mn금속을 전착시켰다. 이때 Al 산화피막 내부로 전착되는 Mn금속의 변화와 산화피막의 특성변화를 임피던스를 통하여 조사했다. 낮은 교류전압의 주파소로 Mn전착된 피막의 임피던스 스펙트럼은 황산에서 제조된 산화피막의 임피던스 스펙트럼과 차이를 나타냈으며, 특히 등가회로에서는 Mn전착의 영향을 나타내는 파라미터인 저항과 축전용량이 추가로 첨가되었다. 또한 Mn전착은 기공성의 산화피막 내부로 진행되는 것으로 나타났다. 또한 기공성의 산화피막의 경우는 저주파를 부하하여 Mn전착시킬 경우 비전도성의 피막성장에 의해 전하이동저항이 높게 나타났다. 이러한 Al산화피막의 특성은 전도도의 구배를 나타내는 파라미터인 Young 임피던스를 통하여 관찰되었다.

• Korean Chemical Engineering Research
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• 제47권1호
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• pp.11-16
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• 2009

단일벽 탄소나노튜브의 표면 위에 동력학적 전위법으로 산화루테늄($RuO_2$)의 석출 및 루테늄-코발트 혼합산화물(Ru-Co mixed oxide)의 공석출에 의해 산화환원 수퍼커페시터용 복합전극을 제조하였다. 루테늄 성분이 13.13 wt%, 코발트 성분이 2.89 wt%가 석출된 Ru-Co 혼합산화물 전극은 낮은 전위 스캔속도($10\;mV\;s^{-1}$)에서는 $RuO_2$ 전극과 유사한 비용량(${\sim}620\;F\;g^{-1}$)을 나타내지만, 높은 스캔속도($500\;mV\;s^{-1}$)에서는 $RuO_2$ 전극보다 큰 비용량을 보인다. 높은 스캔 속도에서 Ru-Co 혼합산화물 전극이 비용량의 증가를 나타내는 것은 Ru 성분을 통한 전기전도성을 Co 성분이 구조적으로 지지해주기 때문이다.