• Advanced Composite Materials
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• 제16권4호
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• pp.385-394
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• 2007

In this study, the effect of molding condition on the tensile properties for plain woven hemp fiber reinforced green composite was examined. The tensile properties of the composite were compared with those of the plain woven jute fiber composite fabricated by the same process. Emulsion type biodegradable resin or polypropylene sheet was used as matrix. The composites were processed by the compression molding where the molding temperature and its heating time were changed from 160 to $190^{\circ}C$ and from 15 to 25 min, respectively. The following results were obtained from the experiment. The tensile property of hemp fiber reinforced polypropylene is improved in comparison with polypropylene bulk. The strength of composite is about 2.6 times that of the resin bulk specimen. Hemp fiber is more effective than jute fiber as reinforcement for green composite from the viewpoint of strength. The molding temperature and time are suitable below $180^{\circ}C$ and 20 min for hemp fiber reinforced green composite. Hemp fiber green composite has a tendency to decrease its tensile strength when fiber content is over 50 wt%.

• 한국생산제조학회지
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• 제8권6호
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• pp.64-70
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• 1999

Family injection molding of plastic is widely used to enhance productivity. Runners for molded products in fami-ly injection molding have to be balanced so that each of the producs is filled completely at the same time,. In this study computer simulations were performed to determine balanced circular section runners in family injection molding with two cavities where each of he cavity shapes is like a case. It was found from the computer simula-tions that runner balance could be fulfilled only by modifying runner diameters. But in order to get more quality molded products other process factors such as flow length flow resistance shapes of products and etc, should be taken in to consideration for the design of a family injection molding process.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1995년도 추계학술대회 논문집
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• pp.64-67
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• 1995

Transfer Molding is currently the most widely used process for encapsulation integrated circuits(;IC). Although the process has been introduced over 20 years ago, generating billions of parts each year, it is far from being optimized. With each new mold, epoxy mold, epoxy mold compound, and lead-frame, lengthy period and expensive qualification runs have to be performed to minimized defects ranging from wire sweep, incomplete fill, and internal voids etc. This studies describes how simulation can be applied to transfer molding to yield acceptable design and processing parameter. The non-isothermal filling of non-newtonian reactive epoxy molding compound(;EMC) in a multi-cavity mold is analyzed. Sensitivity analysis is conducted to investigate the influence of process deviations on the final molded profile. This study trend is carried out by following some heuristic process guidelines.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 추계학술대회논문집A
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• pp.743-746
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• 2000

Plastic microlenses play an important role in reducing the size, weight, and the cost of the systems in the fields of optical data storage and optical communication. In the present study, plastic microlens arrays were fabricated using micro-compression molding process. The design and fabrication procedures for mold insert were simplified by using silicon instead of metal. A simple but effective micro compression molding process, which uses polymer powder, were developed for microlens fabrication. The governing process parameters were temperature and pressure histories and the micromolding process was controlled such that the various defects developing during molding process were minimized. The radius and magnification ratio of the fabricated microlens were $125{\mu}m$ and over 3.0, respectively.

• 대한기계학회논문집A
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• 제25권8호
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• pp.1242-1245
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• 2001

Plastic microlenses play an important role in reducing the size, weight, and the cost of the systems in the fields of optical data storage and optical communication. In the present study, plastic microlens arrays were fabricated using micro-compression molding process. The design and fabrication procedures for mold insert were simplified by using silicon instead of metal. A simple but effective micro compression molding process, which uses polymer powder, were developed for microlens fabrication. The governing process parameters were temperature and pressure histories and the micromolding process was controlled such that the various defects developing during molding process were minimized. The radius and magnification ratio of the fabricated microlens were 125$\mu\textrm{m}$ and over 3.0, respectively.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.81-85
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• 2006

In this study, we have been examined nano Injection Molding process which can improve transcription of 100nm-level pattern. We changed the various parameter (temperature of injection mold, clamp force, temperature of nozzle) which can be influence for improving transcription. And we measured and analyzed shapes of 100nm-level pattern by Automic Force Microscope for proving transcription. We made the Blu-ray Disc sample for proving transcription. And we measured HF-Signal and jitter. As a result, when the temperature of mold is more than $120^{\circ}C$ and the clamp force is more than 10 ton, We reached over 95 percent of transcription compared with stamper pattern. And we reached in-spec. value for HF-Signal and Jitter. Then we reached over 95 percent of transcription compared with stamper pattern.

• 소성∙가공
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• 제18권2호
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• pp.177-182
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• 2009

A work of thin-walled outsell injection molding technology for a plastic part of moldframe applicable in a display product was performed in the present study. The thin-walled plastic part is one of the core parts in the display product, which supports and protects a light guide plate and back light unit from external environmental conditions. It globally has the shape of rectangular and surrounds the light guide plate and back light unit for each class of inch, however, the cross section of the part is not clear to define the thickness. This causes the difficult problem of injection molding itself for the part. Moreover, a metal outsell part makes a difficult problem in injection molding over it. Because the mold temperature control of the parts are not uniform in thickness direction due to the metal part. A careful injection melding analysis and injection mold design from the analysis results have to be proceeded to obtain a production of precision moldframe. Therefore, optimization for injection molding process and analysis of warpage characteristics were studied. Consequently, it was possible from the presented virtual manufacturing process that the manufacturing of precision thin-walled outsell moldframe.

• Korea-Australia Rheology Journal
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• 제16권1호
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• pp.27-33
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• 2004

Application of gas assisted injection molding has been expanded during last two decades because of many advantages such as design flexibility, dimensional stability, reduction of machine tonnages, and so on. However, the surface defects including hesitation mark and gloss difference are observed for thick parts. Difficulties in lay-out of the gas channel and processing condition are another disadvantages. Liquid gas assisted injection molding(LGAIM), in which a liquid with a boiling point lower than the temperature of the polymer melt is injected into the melt stream, and travels with the melt into the mold where it vaporizes and pushes the melt downstream and against the cavity walls to create hollow channels within the part, is a good alternative of the conventional gas assisted injection molding especially in manufacturing simple and very thick parts. Though this is a new frontier of the innovation in the injection molding industry, there is no guideline for the design and processing conditions. In this paper, theoretical analysis has been made to describe the hollow formation dynamics in LGAIM. This model provides an insight into LGAIM process: explains why LGAIM has advantages over conventional gas assisted injection molding, and gives a guideline for the design and processing conditions.

• 한국식품영양과학회지
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• 제30권2호
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• pp.250-255
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• 2001

Effect of molding temperature on the quality changes of extruded meju was studied. Meju was molded at 8$0^{\circ}C$, 6$0^{\circ}C$ and 4$0^{\circ}C$, and then stored at $25^{\circ}C$ with 50% of relative humidity for 30 days. The texture of the cooked soybean grain showed that the firmness and cohesiveness were increased, and consistency was decreased by decrease of molding temperature. The density of the meju molded at 8$0^{\circ}C$, 6$0^{\circ}C$ and 4$0^{\circ}C$ were 1.072g/mL, 1.079g/mL and 1.203g/mL, respectively. The meju molded at 4$0^{\circ}C$ had significantly higher density than those molded at 8$0^{\circ}C$ or 6$0^{\circ}C$. Also, delay of water evaporation, acidification, and rapid growth of fungal mycellium were observed on the sample with molding temperature at 4$0^{\circ}C$ during fermentation. Activity of amylase and protease, contents of total reducing sugar and amino nitrogen of 4$0^{\circ}C$-molded meju were represented lower level than those of 6$0^{\circ}C$ or 8$0^{\circ}C$-molded sample. Therefore, it was considered that the molding temperature was an important factor for meju fermentation and molding temperature of 6$0^{\circ}C$ or over would be acceptable.

• 유변학
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• 제11권2호
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• pp.159-167
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• 1999

샌드위치 사출성형 공정은 기존의 사출성형 공정이 가지지 못하는 여러 장점들로 인해 최근 산업적으로 주목 받고 있는 고분자 가공 공정이다. 이 공정의 해석적인 접근은 거의 불가능하므로, 본 연구에서는 수치모사를 통해서 샌드위치 사출성형의 충전 공정을 연구하였다. 수치모사는 기본적으로 유한요소법을 사용하였고 Flow Analysis Network(FAN)/관할체적(Control Volume)법 등을 함께 이용하였다. 그리고 skin polymer의 선단을 확인할 수 있는 기존의 충전율 변수와 함께 skin polymer와 core polymer의 경계를 표시하는 새로운 충전율 변수를 도입하였고 이것을 이용하여 core polymer의 선단을 추적하였다. 새로운 충전율 변수는 두께 방향으로 온도장을 풀기 위해 나눈 각 층에서 정의되었다. 수치모사에 사용된 skin polymer와 core polymer로는 물성이 다른 두 고분자 물질을 주입시켜서 나타나는 충전 형태를 비교했다. 즉, 점도 상수, power-law 지수 등과 같은 유변 물성이 다른 두 고분자 물질을 충전시키기 위해 공정상 필요한 입구에서의 압력 등을 계산했으며 나중에 들어가게 되는 core polymer의 충전 완료 후 금형 내에서의 두께 방향과 흐름 방향으로의 분포 등을 구하였다. 또한 실제 공정 상에서 가공조건에 해당되는 switchover time과 벽 온도 등의 조건을 바꿔가면서 수치모사를 진행하였다. 사례 연구를 통하여 얻어진 물성과 가공 조건에 따른 core polymer의 충전 형태와 입구에서의 압력 등은 샌드위치 사출성형의 산업적 이용에 매우 유용하게 사용될 수 있다.