• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.637-637
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• 2013

We develop single-crystal poly(3,4-ethylenedioxythiopene nanowires using liquid-bridge-mediated nanotransfer printing via vapor phase polymerization. This direct printing method can simultaneously enable the synthesis, alignment and patterning of the nanowires from molecular ink solutions. Twoor three-dimensional complex structures of various single-crystal organic nanowires were directly fabricated over a large area using many types of molecular inks. This method is capable of generating several optoelectronic devices. LB-nTM is based on the direct transfer of various materials from a mold to a substrate via a liquid bridge between them. To demonstrate its usefulness, we used LB-nTM to fabricate nanowire field-effect transistors and arrays of 6,13-bis (triisopropyl- silylethynyl) pentacene (TIPS-PEN) nanowire field-effect transistors.

• Korean Journal of Computational Design and Engineering
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• v.10 no.6
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• pp.381-391
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• 2005

The design methodology of injection molding die has been changed from two-dimensional drafting to three-dimensional solid modeling, which is due to many advantages over the conventional methodology in terms of design modification and data associativity. In addition to the solid modeling capability, it is required for a mold designer to utilize a database management system that facilitates efficient mold design. In the paper presented is the implementation of a software program which automatically generates three-dimensional mold-bases including standard parts and slider parts, conforming to given geometric constraints. It is based on a commercial CAD system (Unigraphics NX) along with related API (application program interface) libraries. The research is expected to reduce design efforts and simplify construction of a complex three-dimensional mold-base model that is comprised of standard parts and slider parts, by use of the three-dimensional database and automatized geometric dimensioning.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.10
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• pp.805-811
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• 2000

Reliability of PBGA(plastic ball grid array) package is weak compared with normal plastic packages. The low reliability is caused by low resistance to the popcorn cracking, which is generated by moisture absorption in PCB(prited circuit board). In this paper, plasma treatment process was used and we analyzed its effects to interface adhesion. The contents of C and Cl decrease after plasma treatment but those of O, Ca, N relatively increase. The plasma treatment improves the adhesion between EMC(epoxy molding compound) and PCB(solder mask). The grade of improvement was over 100% Max, which depends on the properties of EMC. The RMS(root mean square) roughness value of the solder mask surface increases to plasma treatment. There is little difference of adhesion in RF power and treatment time.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.11a
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• pp.249-252
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• 2000

To overcome problems of excavation technology far repairing or replacing underground buried pipes which are worn out or damaged, various trenchless repair-reinforcement technologies have been invented. But these trenchless technologies also have many problems in the aspect of economy and convenience of operation. In this research, the repair-reinforcement process using RTM (Resin Transfer Molding) which can solve problems of present trenchless technologies was developed. The resin wetting and void removal during RTM process to form large composite structures inside of buried pipes were experimentally investigated. From the experiment, it was found that the new technology had advantage over conventional methods by employing appropriate process parameters and void removal vents.

• Journal of the Korean institute of surface engineering
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• v.34 no.2
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• pp.142-150
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• 2001

Due to naturally formed copper oxides, the adhesion strength between copper and epoxy resin is often very poor. To improve the adhesion strength between copper and epoxy resin, Cu-based leadframe sheets were oxidized in a brown-oxide forming solution. Then the effect of brown-oxide formation on the adhesion strength of leadframe to epoxy molding compound (EMC) was studied using pull-out specimens. After the pull-out test, fracture surfaces were analyzed using SEM, AES and EDS to determine failure path. The results showed that the failure path lay over inside the CuO and inside the EMC irrespective of the pull strength.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.132-140
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• 2005

It is well known that the family-mold has an advantage to reduce the cost for production and mold. However, defects are frequently occurred by over packing the smaller volume cavity during molding, especially whorl the family-mold has a volumetric difference between two cavities. In this study, we confirmed the cavity-filling imbalance by the temperature and the pressure sensors, and developed a variable-runner system for the cavity-filling balance. We carried out experiments fur balancing the cavity filling in the family-mold with the variable-runner system, and confirmed a balanced cavity-filing through analyzing the temperature and pressure change in each cavity as the cross-sectional area of the runner changed. We also examined the influence of the injection-speed to the balancing-capability of the variable-runner system in the experiment.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.265.2-265.2
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• 2013

We fabricate poly(3,4-ethylenedioxythiopene patterns using liquid-bridge-mediated nanotransfer (LB-nTM) printing via vapor phase polymerization (VPP). LB-nTM printing method can simultaneously enable the synthesis, alignment and patterning of the nanowires from molecular ink solutions. Two- or three-dimensional complex structures of VPP-PEDOT were directly fabricated over a large area using many types of molecular inks. VPP method is a versatile technique that can be used to obtain highly conducting coatings of conjugated polymer on both conducting and non-conducting substrates. The PEDOT patterns has analyzed crystallinity from X-ray diffraction pattern and select-area diffraction patterns. In addition, the PEDOT pattern has high conductivity compared other conducting polymers.

• Journal of Integrative Natural Science
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• v.13 no.4
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• pp.158-169
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• 2020

Modern people live in the age of plastics. It has been widely used due to its easy molding processing, mass production, and excellent durability. However, over-produced plastics for convenience cause plastic disasters and adversely affect the ecosystem. Since the COVID-19 outbreak, the use of single-use plastic waste due to the use of delivery services has increased. The COVID-19 pandemic has caused a plastic pandemic. Currently, domestic recycling policies depend only on recycling collection companies and market prices of recyclable resources. This paper confirms whether the outbreak of COVID-19 has affected the price of plastic waste. It also shows that the price of plastic waste is more unstable than metals with a high recycling rate. This urges businesses to share the cost of recycling on plastic waste, no longer being dependent on market prices for recyclable resources.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.12
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• pp.57-64
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• 2017

Today, due to the environmental regulations regarding air pollution in the EU, the use of EPS (Styrofoam) as the cushioning material in the packaging industry is decreasing. In effect, air cushioning based cushioning materials are rapidly expanding into the market and replacing EPS, due to their excellent buffering ability and environmental friendliness. This is a new selective filling type air filling material manufacturing technology that affords improvements in the amount of raw materials required, its processing and its aesthetic appearance compared to the conventional air filling cushioning materials. In this study, a multi-stage air cell filling valve molding technology is developed based on selective filling technology, which allows packages to be selectively filled in various forms by applying valve forming structure technology. This multi-stage air cell filling valve molding technology is a technique in which a plurality of injection ports are formed by laminating three layers of films, viz. a first injection film, a valve film, and a second injection film having valve ends. In the conventional technology, a separate external air injection path for injecting air into a plurality of connected air bags is needed. However, in the proposed system, an external air injection path is formed inside the air bag, Due to the lack of need for an injection furnace, the raw material and process are reduced and air is injected and then discharged, while the air bag is reduced in length to 63 ~ 66% of its normal value. The outer surface of the outer air injection path is integrated inside by maintaining the original length of the cross section, while the unnecessary folded air is injected into the interior of the air bag, This smart air filling type cushioning material manufacturing technology constitutes a big improvement over the existing technologies.

• Composites Research
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• v.12 no.5
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• pp.31-39
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• 1999

Glass-fiber reinforced polymeric composites provide the desitable properties of high stiffness and strength as well as specific weight. Hence, they have become some of the most important materials in several industries. These composites can be grouped into thermoplastic and thermoset composites, with thermoplastic composites having several advantages over thermoset composites in mechanical properties and processing. As a result, the study of the material behavior and forming techniques of such composites has attracted considerable attention in recent years. When the continuous fiber-reinforced polymeric composites are molded by flow molding, the molded parts leads to be nonhomogeneity and anisotropic because of the separation and orientation of fibers. As the characteristics of the products are greatly dependent on the separation, it is very important to clarify the separation in relarion to molding conditions, fiber mat structures and mold geometry. In this study, the effects of the mold geometry and the fiber mat structure on the compression moldability are studied using the cup-type molding.