• Journal of the Korean institute of surface engineering
• /
• v.48 no.2
• /
• pp.33-37
• /
• 2015

High efficiency LED device is being concerned due to its high heat loss, and such heat loss will cause a shorter lifespan and lower efficiency. Since there is a demand for the materials that can release heat quickly into the external air, the organic insulating layer was required to be replaced with high thermal conductive materials such as metal or ceramics. Through anodizing the upper layer of Al, the Breakdown Voltage of 3kV was obtained by using an uniform thickness of $60{\mu}M$ aluminum oxide($Al_2O_3$) and was carried out to determine the optimum process conditions when thermal cracking does not occur. Two Ni layers were formed above the layer of $Al_2O_3$ by sputtering deposition and electroplating process, and saccharin was added for the purpose of minimizing the remain stress in electroplating process. The results presented that the 3-layer film including the Ni layer has an adhesive force of 10N and the thermal conductivity for heat dissipation is achieved by 150W/mK level, and leads to improvement about 7 times or above in thermal conductivity, as opposed to the organic insulation layer.

• Journal of Environmental Science International
• /
• v.26 no.5
• /
• pp.639-649
• /
• 2017

Measurements of polychlorinated biphenyls (PCBs) were taken in surface sediments inside Seogwipo and Hallim Harbors of Jeju Island, Korea, to evaluate their distribution. These harbors typically have heavy ship traffic. The samples were collected three times (in June, October, and December, 2013). PCB concentrations in sediments from Seogwipo Harbor were higher than in those from Hallim Harbor, but both levels were very low, compared with those in other parts of the world. Sedimentary PCB levels had a strong correlation with organic carbon and fine granule mud content. PCB concentration values in the examined surface sediments were much lower than Sediment Quality Guidelines (SQGs) such as ER-L (Effect Rrange-Low), TEL (Threshold Effects Level) and ISQG (Interim Sediment Quality Guideline)-low value applied in countries, such as USA, Canada, and Australia. This suggests that the PCBs did not have significant biological effects on benthic organisms in the marine environment.

• Proceedings of the KIEE Conference
• /
• 2007.07a
• /
• pp.260-261
• /
• 2007

본 논문에서는 800MHz와 1.9GHz 대역의 시스템에 적용할 수 있는 20dB 방향성 결합기를 8층 PCB 기판에 내장하여 소형화 및 저가화 할 수 있도록 설계하였다. 방향성 결합기는 4층과 6층에 coupled line으로 적층함으로써, 다층 PCB기판을 최대한 활용하여 공간을 최소화하였다. 또한, 고유전율을 가진 필름을 이용하여, coupled line의 끝에 내장형 고용량 커패시터를 연결하여 설계하였다. 6 $\times$ 6 $\times$ 0.7 (height)$mm^3$ 크기로 설계된 방향성 800MHz 결합기의 경우 -20dB의 coupling 특성, -0.6dB의 transmission 특성, -25dB의 isolation 특성을 나타내었다. 패키징 기판에 내장된 방향성 결합기는 단말기 및 통신시스템의 소형화에 크게 기여할 수 있을 것이다.

• Journal of the Korean Chemical Society
• /
• v.44 no.4
• /
• pp.343-349
• /
• 2000

Volatile Organic Compounds(VOCs) emitted form electronicSince toluene, xylene, cyclohexanone, and benzofuran will bring on the deleterious smell and the health risk, eventhough very small amount of these areexposed to human body, quantitative analysis was achieved by GC-MS system. As a result of these analyses, except PCB(CEM-1) of which is one of the electronic parts, the left of electronic parts represented, imme-diately form 30 minutes to 1 hour after heating, the trends that toluene, xylene, cyclohexanone and phenol were consecuticely emitted very high. and toluene, xylene, phenol, cyclohexanone, and benzofuran from most of the electronic parts were emitted very frequently within the measuring period. Finally, Trans of electronic parts showed the highest concentration of emission, and xylene(550~2482 ${\mu}g/m^2$) was the most noticeably emitting compound of VOCs.

• Journal of Soil and Groundwater Environment
• /
• v.7 no.3
• /
• pp.61-70
• /
• 2002

Direct electron beam irradiation experiments on artificially contaminated soil by polynuclear aromatic hydrocarbons (PAHs) and polychlorinated biphenyls (PCBs) were performed to evaluate applicability of direct electron beam irradiation process for contaminated soil remediation. The removal efficiency of PAHs was about 97 % at 600 kGy and PCBs about 70 % at 800 kGy. PAHs were removed 27 % more, compared to PCBs although the absorbed dose was as low as 200 kGy. The contaminants decomposition was due predominantly to direct interaction of high-energy electrons and the target compounds rather than due to oxidation/reduction reaction by reactive intermediates. Radiolysis of electron beam may be able to decontaminate contaminated soil by toxic and recalcitrant organic compounds like as PAHs and PCBs effectively, but it may be economically uncompetitive. Thus, developments of post-treatment process of conventional site remediation technologies may be more practical and economical than direct radiolysis.

• Journal of the Microelectronics and Packaging Society
• /
• v.16 no.3
• /
• pp.53-59
• /
• 2009

Low pressure mercury lamp type UV equipments have been widely used for cleaning and modification of PCB surfaces. To enhance the productivity of the process, we newly developed remote DBD type atmospheric pressure plasma equipment. The productivity of both equipments could be compared by measuring surface contact angle for various transferring speed. By the result of the measurement, we could verify that the productivity of the atmospheric pressure plasma be superior to the productivity of the UV equipment. XPS experiments confirmed that the surface effect of the UV and atmospheric pressure plasma processing are similar for each other. Organic contamination level was reduced after the processing and some surface elements were oxidized for both cases. Finally, the atmospheric pressure plasma equipment was adapted to flip chip BGA's flux printing process and it was concluded that the printing uniformity be enhanced by the atmospheric pressure plasma surface treatment.

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.1
• /
• pp.35-39
• /
• 2011

Shearing characteristics of Sn-3.0wt%Ag-0.5wt%Cu ball for standardization of high speed shear test were investigated. The solder ball of 450 ${\mu}m$ in diameter was reflowed at $245^{\circ}C$ on FR4 PCB (Printed Circuit Board) to prepare a sample for the high-speed shear test. The metal pads on the PCB were OSP (Organic Solderability Preservative, Cu pad) and ENIG (Electroless Nickel/Immersion Gold, i.e CulNi/Au). Shearing speed was varied from 0.5 to 3.0 m/s, and tip height from 10 to 135 ${\mu}m$. As experimental results, for the OSP pad, a ductile fracture increased with tip height, and it decreased with shearing speed. In the case of ENIG pad, the ductile fracture increased with the tip height. The tip height of 10 ${\mu}m$ (2% of solder ball diameter) was unsuitable since the fracture mode was mostly pad lift. Shear energy increased with increasing shearing tip height from 10 to 135 ${\mu}m$ for both of OSP and ENIG pads.

• Journal of Korean Society of Environmental Engineers
• /
• v.32 no.9
• /
• pp.870-878
• /
• 2010

We investigated the concentration and the sources of ubiquitous persistent organic pollutants [i.e., 17 toxic polychlorinated dibenzo-p-dioxins and dibenzofurans (PCDD/Fs), 12 coplanar polychlorinated biphenyls (Co-PCBs), and 16 priority polycyclic aromatic hydrocarbons (PAHs)] in waste papers and lumbers from industrial complexes. The total concentrations in waste papers and lumbers ranged from 9.69~176.77 pg/g-dry and 0.14~0.25 pg/g-dry for 17 PCDD/Fs, 109.95~4097.25 pg/g-dry and 28.23~59.88 pg/g-dry for 12 Co-PCBs and 9.30~52.18 ng/g-dry and 0.82~1.82 ng/g-dry for 16 PAHs respectively. Generally, the concentration of these pollutants in waste papers was higher than those in waste lumbers. OCDD was dominant in waste papers and lumbers and the PCDD/F patterns of these samples were similar with that of stack gas. The distribution patterns of Co-PCBs in wastes were related with commercial PCB products, indicating the effect of commercial PCB products on ubiquitous environment. The diagnostic ratios of several PAH compounds in waste paper showed that they were related with pyrogenic sources.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.1
• /
• pp.47-53
• /
• 2012

Bonding strength of Sn-3.0Ag-0.5Cu solder joint due to degradation characteristic of OSP surface finish was investigated, compared with SnPb finish. The thickness variation and degradation mechanism of organic solderability preservative(OSP) coating were also analyzed with the number of reflow process. To analyze the degradation degree of solder joint strength, FR-4 PCB coated with OSP and SnPb were experienced preheat treatment as a function of reflow number from 1st to 6th pass, respectively. After 2012 chip resistors were soldered with Sn-3.0Ag-0.5Cu on the pre-heated PCB, the shear strength of solder joints was measured. The thickness of OSP increased with increase of the number of reflow pass by thermal degradation during the reflow process. It was also observed that the preservation effect of OSP decreased due to OSP degradation which led Cu pad oxidation. The mean shear strength of solder joints formed on the Cu pads finished with OSP and SnPb were 58.1 N and 62.2 N, respectively, through the pre-heating of 6 times. Although OSP was degraded with reflow process, the feasibility of its application was proven.

• Analytical Science and Technology
• /
• v.24 no.5
• /
• pp.395-400
• /
• 2011

This study has been carried out in order to effectively manage three groups of unregulated hazardous organic substances (PCDD/DFs, PAHs, PCBs) in South Korea. The investigated substances have been analyzed according to the test methods for hazardous substances in specified wastes provided by the National Institute of Environmental Research, Korea. Total contents of the organic compounds have been determined for hazardous wastes from three major industrial categories (paint, iron removal, steelmaking), such as waste organic solvent, waste paint or dust. By investigating the waste samples for 7 PAHs using GC/MSD, Naphthalene has been detected (N.D~1631.33 mg/kg). The highest Naphthalene concentration, which exceeded the korean marine dumping waste standard, was found in waste organic solvents and waste paints. Although a content analysis of 7 PCB isomers has been conducted, none of these compounds was detected. The analysis of PCDD/DFs has revealed that all samples meet the criterion for low POP content defined in the technical guidelines developed under the Basel Convention. The PCDD/DFs content in dust samples deriving from 10 manufacturing processes (billet, bloom) was determined to be in the range of N.D~5.66 ng I-TEQ/g waste.