• 한국지하수토양환경학회지:지하수토양환경
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• 제18권1호
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• pp.67-77
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• 2013

To improve the energy efficiency of conventional thermal treatment, soil remediation with microwave has been studied. In this study, the remediation efficiency of contaminated soil with semi-volatile organic contaminants were evaluated with microwave oven and several additives such as water, formic acid, iron powder, sodium hydroxide (NaOH) solution, and activated carbon. For the experiment, loamy sand and sandy loam collected from Imjin river flood plain were intentionally contaminated with hexachlorobenzene and phenanthrene, respectively. The contaminated soils were treated with microwave facility and the mass removals of organic contaminants from soils were evaluated. Among additives that were added to increase the remediation efficiency, activated carbon and NaOH solution were more effective than water, iron powder, and formic acid. When 10 g of hexachlorobenzene (142.4 mg/kg-soil) or phenanthrene (2,138.8 mg/kg-soil) contaminated soil that mixed with 0.5 g iron powder, 0.5 g activated carbon and 1 ml 6.25 M NaOH solution were treated with microwave for 3 minutes, more than 95% of contaminants were removed. The degradation of hexachlorobenzene during microwave treatments with additives was confirmed by the detection of pentachlorobenzene and tetrachlorobenzene. Naphthalene and phenol were also detected as degradation products of phenanthrene during microwave treatment with additives. The results showed that adding a suitable amount of additives for microwave treatments fairly increased the efficiency of removing semi-volatile soil organic contaminants.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2010년도 춘계학술발표대회
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• pp.48.1-48.1
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• 2010

Cu has been used for metallic interconnects in ULSI applications because of its lower resistivity according to the scaling down of semiconductor devices. The resistivity of Cu lines will affect the RC delay and will limit signal propagation in integrated circuits. In this study, we investigated the characteristics of electroplated Cu films according to the variation of concentration of organic additives. The plating electrolyte composed of $CuSO_4{\cdot}5H_2O$, $H_2SO_4$ and HCl, was fixed. The sheet resistance was measured with a four-point probe and the material properties were investigated with XRD (X-ray Diffraction), AFM (Atomic Force Microscope), FE-SEM (Field Emission Scanning Electron Microscope) and XPS (X-ray Photoelectron Spectroscopy). From these experimental results, we found that the organic additives play an important role in formation of Cu film with lower resistivity by EPD.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
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• pp.265-266
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• 2002

Nano materials have great potential for development of advanced lubricating and protecting materials. Nano-particles capped by organic compound such as organic acid, dialkyldithiophosphate (DDP) are capable to disperse stably in lubricating oils, and are able to reduce wear and to increase load-carrying capacity.

• Journal of Magnetics
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• 제10권3호
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• pp.118-121
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• 2005

We have investigated the magnetic properties of electroplated thin Cu/Co multilayers by using electrolytes made of copper sulphate and cobalt sulphate and by applying alternating plating voltage. While the multilayers plated with pure electrolyte showed superparamagnetism, those plated with organic additives showed ferromagnetic behavior. These changes are attributed to the so-called 'self-annealing' effect and reduction of grain size caused by the organic additives.

• 한국재료학회지
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• 제13권11호
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• pp.725-731
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• 2003

The effect of organic processing parameters on the dispersion stability of the BaTiO$_3$-based dielectric particles and borosilicate glass particulate suspensions was investigated in a system where organic solvents, dispersant, binder and modifier were used as processing additives in a low temperature cofired ceramic fabrication processes. Two- and three-component organic solvents were used to disperse ceramic particles and it was found the better stability in the particulate suspension prepared in a bi-solvent, which was consists of toluene and ethanol in a non-azeotropic composition. The addition amount of organic additives had a great impact on dispersion in the present investigation. The flow curves of the suspensions prepared with binder and modifier were fitted according to the power-law equation, which indicates that the internal structure of the suspension could be disturbed under the applied shear stress. Finally, the LTCC green tapes were successfully tape-cast based upon the optimum formulation of LTCC suspension and its microstructure was compared with that of the hard-agglomerates.

• 한국표면공학회지
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• 제43권6호
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• pp.297-303
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• 2010

The effect of solution acidity and organic additives, polyethylene glycol (PEG), on the trivalent chromium electroplating was systematically investigated in the view point of electroreduction of trivalent chromium ions and solution stability. It was found that solution acidity controlled at pH 2.5 showed the widest current range for bright electrodeposits in the presence of PEG additives, which reduced the local current intensification at high current densities. Through complex interaction between PEG additives and hydrogen ion, that is, solution acidity, electrode potential was moved in the negative direction in the bulk solution, while it shifted in the positive when electric potential was scanned. In conjunction with electrochemical quartz crystal microbalance (EQCM), it was found that PEG additives had a role in promoting the electron transfer to trivalent chromium ion complexes in bulk solution and their adsorption at the electrode surface as well as interfering with hydrogen ion reduction process below pH 2.5. The PEG additives developed the nodular morphology during electroreduction of trivalent chromium ions with the increase of solution acidity and enhanced its current efficiency by maintaining the consumption of complexant, formic acid, at low speed.

• 한국표면공학회지
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• 제33권5호
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• pp.339-348
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• 2000

The study was conducted on the effect of bath composition on the surface appearance, the hardness and the crystal orientation of zinc electrodeposits from the chloride bath. (1) The hardness of the zinc electrodeposits from the chloride bath was increased by suppressing mass transfer of zinc through adding the organic additives and the chlorine ion in the electrolyte. (2) The surface whiteness of zinc deposits was decreased due to the change of the preferred orientation from (002) , (103) to (101) , (100) through increasing the organic additives and chlorine ion in the electrolyte. (3) The addition of Cu, Sn, Ni or Co in the chloride bath elevated the hardness of the zinc deposits but darkened the surface whiteness. (4) The optimum condition of the organic additives and the chlorine ion for increasing the hardness of zinc deposits and preventing dark surface ranges 0.3 m1/1 to 0.4 m1/1 and 6.5 mol/1 to 6.8mol/l respectively.

• 한국세라믹학회지
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• 제36권2호
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• pp.210-219
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• 1999

Alcohols, hydrocarbons, ketones 그리고 ethers와 같은 다양한 유기용매에서 질화규소 및 소결첨가제로 사용되는 AlN, Nd2O3 입자의 분산특성을 연구하였다. 분산안정화기구 및 유기공정첨가제와의 상호작용에 관한 연구를 수행하여 비수계 시스템에서 세라믹 입자의 분산성을 규명하였다. 현탁액의 물성특성은 산술된 Hamaker 상수 뿐 아니라 electrokinetic sonic amplitude 측정 및 유동학적 결과로부터 얻어진 흐름곡선을 이용하여 평가하였다. 유기용매 내에서 Si3N4, AlN 그리고 Nd2O3 분산안정화에 기여하는 정전기적 척력은 예상보다 컸으며, 이것은 유기용매의 물리화학적 특성에 의존함을 알 수 있었다.

• Corrosion Science and Technology
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• 제6권4호
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• pp.154-158
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• 2007

For the application of flexible printed circuit board (FPCB), electroplated copper is required to have low surface roughness and residual stress. In the paper, the effects of surface roughness and residual stress of electroplated copper as thick as $8{\mu}m$ were studied on organic additives such as inhibitor, leveler and accelerator. Polyimide film coated with sputtered copper was used as a substrate. Surface roughness and surface morphology were measured by 3D-laser surface analysis and FESEM, respectively. Residual stress was calculated by Stoney's equation after measuring radius curvature of specimen. The addition of additives except high concentration of accelerator in the electrolyte decreased surface roughness of electroplated copper film. Such a tendency was explained by the function of additives among which the inhibitor and the leveler inhibit electroplating on a whole surface and prolusions, respectively. The accelerator plays a role in accelerating the electroplating in valley parts. The inhibitors and the leveler increased residual stress, whereas the accelerator decreased it. It was thought to be related with entrapped additives on electroplated copper film rather than the preferred orientation of electroplated copper film. The reason why additives lead to residual stress remains for the future work.

• 환경위생공학
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• 제16권2호
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• pp.79-90
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• 2001

Commercial liquid seeds are used for supplying active microbial flora to organic wastewater treatment plants of high feed-to-microorganism ratio and to maintain optimal microbial condition during unsteady state operation of the biological wastewater treatment plant. In addition to bacterial cells, the liquid weeds contain various additives for special purposes as well as organic substrates for energy supply. The additives give physical stability for the maintenance of microbial decomposition activity and ability to control the overgrowth of seed strains. In this work, the effects of addition of two kinds of typical substrate additives, poly aluminum chloride(PAC) and poly aluminum sulfate(PAS) on the consitutional total cell counts(CFU/ml) of four kinds of reorganization liquid seeds(RLS I, RLS II, RLS III and RLS IV) were studied experimentally. The addition of PAC and PAS gave negative effect on TCC constitution for the four seeds studied.