• International Journal of Precision Engineering and Manufacturing
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• 제3권4호
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• pp.43-53
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• 2002

Polishing a die that has free-form surfaces is a time-consuming and tedious job, and requires a considerable amount of high-precision skill. In order to reduce the polishing time and cope with the shortage of skilled workers, a user-friendly automatic polishing system was developed. The polishing system is composed of two subsystems, a three-axis machining center and a two-axis polishing robot. The system has five degrees of freedom and is able to keep the polishing tool in a position normal to the die surface during operation. A sliding mode control algorithm with velocity compensation was proposed to reduce tracking errors. Trajectory tracking experiments showed that the tracking error can be reduced prominently by the proposed sliding mode control compared to a PD (proportional derivative) control. To evaluate the polishing performance of the polishing system and to and the optimal polishing conditions, the polishing experiments were conducted.

• 한국정밀공학회지
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• 제14권10호
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• pp.58-67
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• 1997

Generally, die polishing process occupies about 30 .approx. 50% of the whole die manufacturing time. However, die polshing has not been automated yet, since it needs a great deal of experience and skill. This study aims at development of an expert system for die polishing which gives such optimal parameters as tool and polishing conditions. Through experiments, polishing characteristics such as surface roughness, stock removal and scratch were analyzed quantitatively for each polishing tool, and a knowledge base for the expert system was established. Evaluation tests show that the developed system works well to suggest the optimal polishing conditions and it is very promising.

• 한국기계가공학회지
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• 제12권2호
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• pp.100-106
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• 2013

Stainless steel has some excellent properties as the material for the mechanical component. Purpose of this study is carried out to obtain mirror surface on the surperfinishing of stainless steel with high efficiency. To achieve this, we have conducted a series of polishing experiment for stainless steel using abrasive film from the perspective of oscillation speed, the rotational speed of workpiece, contact roller hardness, contact pressure and feed rate. Abrasive film used this study is a micro-finishing film and a lapping film. Furthermore, the polishing characteristics and efficiency of stainless steel is discussed through measuring optimal polishing time and surface roughness. From the obtained results, it was confirmed that efficient superfinishing conditions and polishing characteristic of Stainless steel can be determined.

• 한국기계가공학회지
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• 제11권1호
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• pp.26-32
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• 2012

Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study will report the characteristic of wafer according to processing time, machining speed and pressure which have major influence on the abrasion of Si wafer polishing. It is possible to evaluation of wafer abrasion by load cell and infrared temperature sensor. The characteristic of wafer surface according to processing condition is selected to use a result data that measure a pressure, machining speed, and the processing time. This result is appeared by the characteristic of wafer surface in machining condition. Through that, the study cans evaluation a wafer characteristic in variable machining condition. It is important to obtain optimal condition. Thus the optimum condition selection of ultra precision Si wafer polishing using load cell and infrared temperature sensor. To evaluate each machining factor, use a data through each sensor. That evaluation of abrasion according to variety condition is selected to use a result data that measure a pressure, machining speed, and the processing time. And optimum condition is selected by this result.

• 한국공작기계학회논문집
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• 제16권5호
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• pp.90-95
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• 2007

Single side final polishing is a very important role to stabilize a wafer finally before the device process on the wafer is executed. In this study, the machining variables, such as pressure, machining time, and the velocity of pad table were adopted. These parameters have the major influence on the characteristics of wafer polishing. We investigated the surface roughness changing these variables to find the optimal polishing condition. Pad, slurry, slurry quantity, and oscillation distance were set to the fixed variables. In order to reduce defects and find a stable machining condition, a hall sensor was used on the polishing process. AE sensor was attached to the polishing machine to verify optimal condition. Applying data analysis of the sensor signal, experiments were performed. We can get better surface roughness from loading the quasi static force and improving wafer-holding method.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.609-613
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• 2004

On this study, electrochemical polishing is adapted to ultra-fine surface for semiconductor large radius gas-tube. The system which buffing and electrochemical polishing can be performed simultaneously was constructed in connection with developing exclusive system. Based on existing papers and the research of background, electrode gap and electrolyte flow were fixed. Current density and electrochemical precision time were chosen as variables. On this study, it is objected to find optimal precision condition and precision variables on the in-process electrochemical polishing.

• 한국정밀공학회지
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• 제16권7호
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• pp.73-84
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• 1999

An advanced expert system for supporting automatic polishing operation of mold and die has been developed. The goal of this system is to minimize the polishing time, the number of polishing and tools used. Also, this paper proposes the advanced concept of the polishing method to perform polishing operation of mold and die, and it has adapted to the orthogonal array method. as a statistical technique, to choose an optimal polishing condition. An expert system consists of the polishing machining database that includes the information of workpiece and polishing tools, and the input/output module.

• 한국기계가공학회지
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• 제13권5호
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• pp.76-81
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• 2014

The Engineering ceramics have some excellent properties as materials for modern mechanical and electrical components. It is, however, not easy to polish them efficiently because they are strong and hard. This study is carried out to obtain a mirror surface on engineering ceramics by surperfinishing with high efficiency. To achieve this, we conducted a series of polishing experiments using representative engineering ceramics, such as $Al_2O_3$, SiC, $Si_3N_4$ and $ZrO_2$, using diamond abrasive film from the perspective of oscillations peed, the rotational speed of the workpiece, contact roller hardness, contact pressure and feed rate. Furthermore, the polishing efficiency and characteristics for engineering ceramics are discussed on the basis of optimal polishing time and surface roughness. Our results confirmed that efficient superfinishing conditions and polishing characteristics of engineering ceramics can be determined.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1996년도 춘계학술대회 논문집
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• pp.124-131
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• 1996

The use of small hemispherical high-speed precision bearing has increased drastically these days in the field of computer disk driver, highteech devices as well as communication and electronic device drivers. It was suggested that the new polishing process adopting the diamond grinding wheel and polishing tool instead of multi stage lapping processes, which enables the mass production of the bearing by reduction of polishing time. Polishing mechanism was analysed and the results were applied to the design and manufacturing of the polishing system. Experiments for selection of optimal polishing conditions were carried out using the polishing system.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.89-90
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• 2008