• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.6
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• pp.34-40
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• 2004

This paper presents studies on curvature radius measurement using the laser interferometer. It is a general practice to measure to $10^{-10}$m in length with the recent improvement and innovations in measurement technology and the processor used. The measurement methods can generally be categorized as these two: the contactual method and non-contactual method; and in this study, we will find ways to lower the cost for a CMM, or a coordinate measurement machine, and try to find an alternative. Furthermore, we will discuss some of the ways to improve the non-contactual measurement methods-optical interferometer method and the optical triangulation method. We will measure an object using a laser distance measuring device and Set the Point-contact result with the ball-bearing type and line-contact result with the bearing type, to decide on which probe type will be used.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.2 s.191
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• pp.58-63
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• 2007

This paper proposes a novel method of projecting a multiple stripe pattern whose intensity profile is sinusoidal. The sinusoidal stripe patterns are plated with chromium on a piece of glass, and the glass is placed within an optical projection system. By linearly moving the glass along the direction of the stripe pattern, the projection system generates the motion blurring effect, and as a result, produces a blurred stripe pattern whose intensity profile is sinusoidal along the perpendicular direction of the stripe pattern. The sinusoidal pattern improves the measurement accuracy of phase-shifting method. Experimental results are provided for three different types of stripe patterns: rectangle, diamond, and sinusoid.

• Proceedings of the IEEK Conference
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• 2003.07e
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• pp.2375-2378
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• 2003

In manufacture of printed circuit boards, one important issue is precisely to measure the three-dimensional shape of the solder paste silk-screened prior to direct surface mounting of chips. This paper presents the 3D shape reconstruction of solder paste using the optical triangulation method based on structured light or slit beam and the measurement algorithm for height, volume. area, and coplanarity on component pads from the 3D range image. Futhermore, statistical process control function is incorporated for process capability analysis.

• 제어로봇시스템학회:학술대회논문집
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• 1993.10b
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• pp.440-445
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• 1993

A two dimensional large scale laser digitizer with a cordless cursor was developed. The coordinate detecting scheme of this digitizer is fundamentally based on the triangulation method, in which two laser-rays are scanned by the rotating plane mirros, reflected backward by the cursor, reflected again by the rotating mirrors, and detected by optical sensors. From angles in which the cursor reflections are detected, we can determine the position of the cursor. But this method involves several problems about optical alignment and its calibration especially when it is applied to a large scale digitizer. In this paper, especially we propose simulation for error analysis with connection to angles measured at five control points which are needed to decide an appropriate model for calculating coordinates and optimal simulation for deciding the position of five control points to give the better coordinate accuracy. In this way, we realized the on-site calibration and on-site insurance of measurement accuracy with our appropriate model for calculating coordinates. The time required for on-site calibration is within 5 minutes and the average accuracy of 4m * 3m digitizer is about .+-.0.12mm.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.9
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• pp.799-805
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• 2015

The further development of information, communication and digital media technologies requires the use of advanced, miniaturized semiconductor chips that operate at a high frequency. Die bonding and wire bonding methods for semiconductor packaging have been replaced by direct attachment to the substrate after forming a bump on the chip. However, the height of the bump or ball is an important factor for defects during assembly. This paper proposes an algorithm to measure the height of the bumps or balls in semiconductor packaging with greater accuracy. The performance of the proposed algorithm is experimentally validated. Non-contact 3D measurements of a shiny round ball is quite difficult, and it is not easy to obtain accurate data. This paper thus proposes an optical method and technique to improve the measurement accuracy.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.5
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• pp.1182-1191
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• 1994

This paper presents an enhanced method of slit beam projection intended for the rapid measurement of 3-dimensional surface profiles of dies and molds. Special emphasis is given to optimizing the design of optical system so that the measuring accuracy can be maximized by adopting two-plane camera calibration together with sub-pixel image processing techniques. Finally, several measurement examples are discussed to demonstrate that an actual measuring accuracy of $\pm$ 0.2 mm can be achieved over the measuring range of 500 mm{\times}300mm{\times}200mm$.

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.118.4-118
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• 2001

An Inspection system, composed of sensor head and controller, is presented which is a 3-D laser vision system using principles of optical triangulation for weld quality and chamfer quality. The sensor head id composed of laser diode, micro CCD camera, filter and several optical components. This systems can be used in welding bead and undercut inspection and chamfer quality inspection as well. It is mech more convenient to use and the inspection time is to be greatly shortened compared with conventional inspection method. Furthermore, data saved in controller can be used for statistics afterwards. This system has been begin used in Koje Shipyard of Samsung Heavy Industries and the need is being increased.

• Journal of Institute of Control, Robotics and Systems
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• v.22 no.10
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• pp.811-816
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• 2016

In light of recently developed 3D printers for rapid prototyping, there is increasing attention on the 3D scanner as a 3D data acquisition system for an existing object. This paper presents a prototypical 3D scanner based on a striped laser light image. In order to solve the problem of shadowy areas, the proposed 3D scanner has two cameras with one laser light source. By using a horizontal rotation table and a rotational arm rotating about the latitudinal axis, the scanner is able to scan in all directions. To remove an additional optical filter for laser light pixel extraction of an image, we have adopted a differential image method with laser light modulation. Experimental results show that the scanner's 3D data acquisition performance exhibited less than 0.2 mm of measurement error. Therefore, this scanner has proven that it is possible to reconstruct an object's 3D surface from point cloud data using a 3D scanner, enabling reproduction of the object using a commercially available 3D printer.

• Journal of Welding and Joining
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• v.21 no.1
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• pp.60-65
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• 2003

At present. welding of most pipes with large diameter is carried out by the manual process. Automation of the welding process is necessary f3r the sake of consistent weld quality and improvement in productivity. In this study, two vision sensors, based on the optical triangulation, were used to obtain the information for seam tracking and detecting the weld defects. Through utilization of the vision sensors, noises were removed, images and 3D information obtained and positions of the feature points detected. The aforementioned process provided the seam and leg position data, calculated the magnitude of the gap, fillet area and leg length and judged the weld defects by ISO 5817. Noises in the images were removed by using the gradient values of the laser stripe's coordinates and various feature points were detected by using an algorithm based on the iterative polygon approximation method. Since the process time is very important, all the aforementioned processes should be conducted during welding.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.3
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• pp.292-299
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• 2013

The measurement in the manufacturing process of curved ship hull plates still depends on wooden templates as a standard instrument. The metrology-enabled automation in the shipbuilding process has been challenged instead of line measurement with wooden templates. The developed measurement system consists of a CCD camera, multiple structured laser sources and 3-DOF motion device. The system carries out measurement of curved profiles for large scale plates by an optical triangulation method. The results of experiment conducted in a manufacturing shop demonstrate the accurate and robust performance.