• 한국광학회:학술대회논문집
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• 한국광학회 2008년도 하계학술발표회 논문집
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• pp.265-266
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• 2008

The environmental and mechanical reliability of planar lightwave circuit (PLC)-type optical splitter modules is investigated with references [1, 3]. The module is composed of Y-branching silica-based waveguides on Si connected to optical fiber with UV-curable adhesives and is packaged in a metal case which is filled with humidity-resistant resin. High optical performance such as low loss, low reflection, and thermal stability are obtained through the use of this fiber connection technique. Ten reliability tests including long-term environmental and mechanical and ALT test were carried out for more then ten $1{\times}32$ channel PLC splitter modules.

• JSTS:Journal of Semiconductor Technology and Science
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• 제4권3호
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• pp.189-195
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• 2004

A 10 Gb/s limiting amplifier IC with the emitter area of $1.5{\times}10{\mu}m^2$ for optical transmission system was designed and fabricated with a AIGaAs/GaAs HBTs technology. In this stud)', we evaluated fine pitch bump using WL-CSP (Wafer Level-Chip Scale Packaging) instead of conventional wire bonding for interconnection. For this we developed WL-CSP process and formed fine pitch solder bump with the $40{\mu}m$ diameter and $100{\mu}m$ pitch on bonding pad. To study the effect of WL-CSP, electrical performance was measured and analyzed in wafer and package module using WL-CSP. In a package module, clear and wide eye diagram openings were observed and the riselfall times were about 100ps, and the output" oltage swing was limited to $600mV_{p-p}$ with input voltage ranging from 50 to 500m V. The Small signal gains in wafer and package module were 15.56dB and 14.99dB respectively. It was found that the difference of small signal gain in wafer and package module was less then 0.57dB up to 10GHz and the characteristics of return loss was improved by 5dB in package module. This is due to the short interconnection length by WL-CSP. So, WL-CSP process can be used for millimeter wave GaAs MMIC with the fine pitch pad.

• 마이크로전자및패키징학회지
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• 제14권3호
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• pp.7-13
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• 2007

광통신용 광모듈에서 광소자와 광섬유 또는 도파로를 정밀하게 정렬 및 접합하기 위하여 플립칩본딩 방법 이 널리 이용되고 있다. 이때 광소자를 정확한 위치에 정렬시키기 위하여 기판과 광소자 양쪽에 정렬용 마크를 제작하고 플립칩본더 등을 사용하여 정렬마크를 관찰하며 광소자를 정렬 및 본딩하게 된다. 본 연구에서는 이러한 정렬마크의 제작비용을 줄이고 광섬유와 수광소자(PD 칩)의 수동정렬을 용이하게 하기 위하여 He-Ne 레이저(파장 633nm)인 가시광을 이용한 정렬 및 플립칩본딩 방법을 연구하였다. 광섬유에서 방출되는 레이저 광을 육안으로 관찰하면서 수광소자를 정렬하므로써 패키징에 소요되는 시간과 경비를 절감하고 광모듈의 저가격화를 실현 할 수 있는 새로운 방법이다. 광섬유에 가공되어 있는 V-노치를 경유하여 가시광이 광섬유에 대해 직각방향으로 방출되고 이것을 수광소자와 정렬하는 방법이다. 본 연구결과 광정렬을 위해 입사된 633 nm파장의 가시광 레이저와 통신용 레이저인 1550 nm 파장사이의 파장 차이에 의한 광경로 차이는 약 4m으로 무시가능하고 최대 광세기 지점에서 ${\pm}20\;{\mu}m$ 범위내에서는 광결합효율 변화는 약 2%이었으며 최대 광결합효율은 약 23.3%이었다.

• Journal of the Optical Society of Korea
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• 제17권6호
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• pp.518-524
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• 2013

This study presents a new design method for a zoom lens, in which real lens groups are designed successively to combine to form a lens modules zoom system. The lens modules and aberrations are applied to the initial design for a four-group inner-focus zoom system. An initial design with a focal length range of 4.2 to 39.9 mm is derived by assigning the first-order quantities and third-order aberrations to each module along with the constraints required for optimum solutions. After obtaining the lens module zoom system, the real lens groups are successively, not separately, designed to get a zoom lens system. Compared to the separately designed real lens groups, this approach can give a better starting zoom lens and save time. The successively designed groups result in a zoom system that satisfies the basic properties of the zoom system consisting of the original lens modules. In order to have a slim system, we directly inserted the right-angle prism in front of the first group. This configuration resulted in a compact zoom system with a depth of 12 mm. The finally designed zoom lens has an f-number of 3.5 to 4.5 and is expected to fulfill the requirements for a mobile zoom camera having high zoom ratio of 10x.

• 대한전자공학회논문지SD
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• 제42권3호
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• pp.25-34
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• 2005

본 논문에서는 이더넷 광 네트워크 구현을 위한 핵심 부품인 1.25 Gbps 광전 트라이플렉스 트랜시버 모듈(Opto-electric triplex transceiver module)의 동작성능 안정화를 위하여 모듈내에서 발생되는 전기적 혼신을 해석 및 측정하였으며, 혼신 감소를 위한 가상접지선(Dummy ground line)이 포함된 신호선 구조를 제안하였다. 광전 트라이플렉스 트랜시버 모듈은 전기신호를 광신호로 바꾸어 전송하는 송신부(Laser diode), 디지털 변조되어 입력된 광신호를 전기신호로 변환하는 디지털 수신부 (Digital photodetector)와 고해상도의 CATV (Community antenna or access television) 신호를 수신하는 아날로그 수신부 (Analog photodetector)가 실리콘 기판(Silicon substrate) 상에 하이브리드 집적되어 구성된다. 디지털 수신부와 아날로그 수신부의 수신감도는 각각 BER(Bit error rate) : $10^-{12}$에서 -24 dBm과 44 dB의 신호대잡음비(Signal-to-noise ratio, SNR)에서 -7.7 dBm을 만족해야하므로 모듈 내의 전기적 혼신은 DC에서 3 GHz까지 - 86 dB이하로 유지되어야한다. 전기적 혼신의 해석 및 측정 결과, 실리콘 기판상의 광원과 디지털 광검출기, 디지털 광검출기와 아날로그 광검출기 사이의 거리를 4 mm 이상 확보하며, 가상접지선을 디지털 광검출기와 아날로그 광검출기의 신호선과 $100\;{\mu}m$ 간격으로 설치하였을 경우, -86 dB 이하의 전기적 혼신 레벨을 만족할 수 있음을 확인하였다. 본 논문에서 제안한 가상접지선을 사용하는 방법은 실리콘 기판상에 신호선을 형성할 때 동시에 형성할 수 있으므로 별도의 추가비용 없이 구현할 수 있으며, 단순히 광원 및 광 검출기의 사이간격을 충분히 확보하는 방법에 비하여 실리콘 기판의 크기를 감소시켜 최종 모듈의 크기를 약 $50\%$ 감소시킬 수 있다는 장점이 있다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 A
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• pp.609-610
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• 2006

As developing the information society, Lighting Emitted diode(LED) which is light source for illumination of next generation is attracted public attention. LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. So, many researches have continued in a illumination as LED module type. in this problem, heating problem is very important and difficult and that is caused in decreasing phenomenon of brightness and drift phenomenon of color coordinate. so the problem of heating is urgent question for illumination of LED. In this paper, structural design of PCB changed as two type for solving the heating problem. also the properties of heating is analysed and optical properties is measured with heating image camera and spectrometer according to change in this design.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 D
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• pp.2241-2242
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• 2006

As developing the information society, Lighting Emitted diode(LED) which is light source for illumination of next generation is attracted public attention. LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. So, many researches have continued in a illumination as LED module type. in this problem, heating problem is very important and difficult and that is caused in decreasing phenomenon of brightness and drift phenomenon of color coordinate. so the problem of heating is urgent question for illumination of LED. In this paper, structural design of PCB changed as two type for solving the heating problem. also the properties of heating is analysed and optical properties is measured with heating image camera and spectrometer according to change in this design.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 B
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• pp.1275-1276
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• 2006

As developing the information society, Lighting Emitted diode(LED) which is light source for illumination of next generation is attracted public attention. LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. So, many researches have continued in a illumination as LED module type. in this problem, heating problem is very important and difficult and that is caused in decreasing phenomenon of brightness and drift phenomenon of color coordinate. so the problem of heating is urgent question for illumination of LED. In this paper, structural design of PCB changed as two type for solving the heating problem. also the properties of heating is analysed and optical properties is measured with heating image camera and spectrometer according to change in this design.

• 반도체디스플레이기술학회지
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• 제14권4호
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• pp.67-71
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• 2015

Product of technology developed in this study is an external interface for controlling the equipment of pendant key remote control system circuit board, and it is used in the electronic component test equipment system. Main control system module is in the role as a device for controlling the various control devices that make up the integrated system for microscopic examination at the request of the host computer engineers to control the inspection equipment. The pentane-key interface module to its role as a device for controlling the various control devices that make up the integrated system for microscopic examination at the request of the host computer for the engineer to control the inspection equipment. Development of the control system can be expected in the configuration of a system for efficient and accurate inspection of high-precision parts.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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• pp.1669-1670
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• 2006

LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. But, with the development of blue LEDs and the improvement of LED brightness, color variation are becoming more and more popular as lighting and application devices in this page, 1 used the Light Tools which was a simulation program in order to recognize optical a few characteristic of LEDs arrangement along reflector matrial and designed LED Arranged 5 phi LED in 5mm interval In the square that was $10{\times}10$ And designs a reflection board on pcb, structural design of PCB changed as five type. - Aluminum, Gold. Chromium, Nickel, Copper.