• 한국광학회:학술대회논문집
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• 한국광학회 1997년도 Advance Program of 14th optics andquantum Electronics conference, 1997제14 회 광학 및 양자전자 학술 발표회 논문 요약집
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• pp.92-92
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• 1997

• 한국광학회:학술대회논문집
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• 한국광학회 2006년도 동계학술발표회 논문집
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• pp.135-136
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• 2006

We present a new binary data encryption and transmission technique based on 4-step phase-shifting interferometry for a security system. Phase-shifting interferometry is used for recording phase and amplitude information on CCD device. 4-step phase-shifting is implemented by moving the PZT mirror with equidistant phase steps of ${\pi}/2$. The basic idea is that we reuse a 256 gray-level digital hologram to encrypt binary data with 4-step phase-shifting interferometry.

• 한국광학회:학술대회논문집
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• 한국광학회 2005년도 하계학술발표회
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• pp.2-3
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• 2005

• 한국광학회:학술대회논문집
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• 한국광학회 2005년도 하계학술발표회
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• pp.246-247
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• 2005

• 한국광학회:학술대회논문집
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• 한국광학회 2008년도 동계학술발표회 논문집
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• pp.451-452
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• 2008

• 전기전자학회논문지
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• 제25권1호
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• pp.42-46
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• 2021

본 논문은 사용자의 개인키로써 생체 지문을 사용하는 새로운 개인키 교환 암호화 방법을 제안한다. 각각의 사용자의 지문은 광학적 위상천이 간섭 원리에 의해 암호화되어 두 개의 암호문으로 변환되고, 이것은 비밀키 공유를 위해 공중 통신망을 통하여 상대방 사용자와 교환된다. 전송된 암호문은 복소 홀로그램을 생성하고, 이는 각각의 사용자에게 공유비밀키를 계산하는데 사용된다. 제안한 방법은 비밀키 공유 암호화 시스템에 적용하였을 때 매우 높은 보안을 제공할 것이다.

• Journal of the Optical Society of Korea
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• 제18권3호
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• pp.236-243
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• 2014

Surface profiling and film thickness measurement play an important role for inspection. White light interferometry is widely used for engineering surfaces profiling, but its applications are limited primarily to opaque surfaces with relatively simple optical reflection behavior. The conventional bucket algorithm had given inaccurate surface profiles because of the phase error that occurs when a thin-film exists on the top of the surface. Recently, reflectometry and white light scanning interferometry were combined to measure the film thickness and surface profile. These techniques, however, have found that many local minima exist, so it is necessary to make proper initial guesses to reach the global minimum quickly. In this paper we propose combing reflectometry and white light scanning interferometry to measure the thin-film thickness and surface profile. The key idea is to divide the measurement into two states; reflectometry mode and interferometry mode to obtain the thickness and profile separately. Interferogram modeling, which considers transparent thin-film, was proposed to determine parameters such as height and thickness. With the proposed method, the ambiguity in determining the thickness and the surface has been eliminated. Standard thickness specimens were measured using the proposed method. Multi-layered film measurement results were compared with AFM measurement results. The comparison showed that surface profile and thin-film thickness can be measured successfully through the proposed method.

• 대한공간정보학회지
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• 제10권5호
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• pp.53-65
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• 2002

The most widespread techniques for DEM generation are stereoscopy for optical sensor images and SAR interferometry(InSAR) for SAR images. These techniques suffer from certain sensor and processing limitations, which can be overcome by the synergetic use of both sensors and DEMs respectively. This study is associated with improvements of accuracy with consistency of image's characteristics between two different DEMs coming from stereoscopy for the optical images and interferometry for SAR images. The MWD(Multiresolution Wavelet Decomposition) and HPF(High-Pass Filtering), which take advantage of the complementary properties of SAR and stereo optical DEMs, will be applied for the fusion process. DEM fusion is tested with two sets of SPOT and ERS-l/-2 satellite imagery and for the analysis of results, DEM generated from digital topographic map(1 to 5000) is used. As a result of an integration of DEMs, it can more clearly portray topographic slopes and tilts when applying the strengths of DEM of SAR image to DEM of an optical satellite image and in the case of HPF, the resulting DEM.

• Journal of the Optical Society of Korea
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• 제18권5호
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• pp.531-537
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• 2014

Through-silicon vias (TSVs) are fine, deep holes fabricated for connecting vertically stacked wafers during three-dimensional packaging of semiconductors. Measurement of the TSV geometry is very important because TSVs that are not manufactured as designed can cause many problems, and measuring the critical dimension (CD) of TSVs becomes more and more important, along with depth measurement. Applying white-light scanning interferometry to TSV measurement, especially the bottom CD measurement, is difficult due to the attenuation of light around the edge of the bottom of the hole when using a low numerical aperture. In this paper we propose and demonstrate four bottom CD measurement methods for TSVs: the cross section method, profile analysis method, tomographic image analysis method, and the two-dimensional Gaussian fitting method. To verify and demonstrate these methods, a practical TSV sample with a high aspect ratio of 11.2 is prepared and tested. The results from the proposed measurement methods using white-light scanning interferometry are compared to results from scanning electron microscope (SEM) measurements. The accuracy is highest for the cross section method, with an error of 3.5%, while a relative repeatability of 3.2% is achieved by the two-dimensional Gaussian fitting method.

• Nuclear Engineering and Technology
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• 제48권1호
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• pp.259-267
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• 2016

Most manufacturing processes, including welding, create residual stresses. Residual stresses can reduce material strength and cause fractures. For estimating the reliability and aging of a welded structure, residual stresses should be evaluated as precisely as possible. Optical techniques such as holographic interferometry, electronic speckle pattern interferometry (ESPI), Moire interferometry, and shearography are noncontact means of measuring residual stresses. Among optical techniques, ESPI is typically used as a nondestructive measurement technique of in-plane displacement, such as stress and strain, and out-of-plane displacement, such as vibration and bending. In this study, ESPI was used to measure the residual stress on the welded part of butt-welded American Society for Testing and Materials (ASTM) A36 specimens with $CO_2$ welding. Four types of specimens, base metal specimen (BSP), tensile specimen including welded part (TSP), compression specimen including welded part (CSP), and annealed tensile specimen including welded part (ATSP), were tested. BSP was used to obtain the elastic modulus of a base metal. TSP and CSP were used to compare residual stresses under tensile and compressive loading conditions. ATSP was used to confirm the effect of heat treatment. Residual stresses on the welded parts of specimens were obtained from the phase map images obtained by ESPI. The results confirmed that residual stresses of welded parts can be measured by ESPI.