• Journal of the Korean Geotechnical Society
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• v.23 no.4
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• pp.15-24
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• 2007

Two kinds of temperature monitoring technology have been introduced in this study, which can measure coincidently temperatures at many points along a single length of cable. One is to use a thermal sensor cable comprizing of addressable thermal sensors. The other is to use an optic fiber sensor with Distributed Temperature Sensing (DTS) system. The differences between two technologies can be summarized as follows: A thermal sensor cable has a concept of "point sensing" that can measure temperature only at a predefined position. The accuracy and resolution of temperature measurement are up to the capability of the individual thermal sensor. On the other hand, an optic fiber sensor has a concept of "distributed sensing" because temperature is measured practically at all points along the fiber optic cable by analysing the intensity of Raman back-scattering when a laser pulse travels along the fiber. Thus, the temperature resolution depends on the measuring distance, measuring time and spatial resolution. The purpose of this study is to investigate the applicability of two different temperature monitoring techniques in technical and economical sense. To this end, diverse experiments with two techniques were performed and two techniques are applied under the same condition. Considering the results, the thermal sensor cable will be well applicable to the assessment of groundwater flow, geothermal distribution and grouting efficiency within about loom distance, and the optic fiber sensor will be suitable for long distance such as pipe line inspection, tunnel fire detection and power line monitoring etc.

• Korean Chemical Engineering Research
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• v.45 no.5
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• pp.466-472
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• 2007

A technology platform for wafer-level three-dimensional integration circuits (3D-ICs) is presented, and that uses wafer bonding with low-k polymeric adhesives and Cu damascene inter-wafer interconnects. In this work, one of such technical platforms is explained and characterized using a test vehicle of inter-wafer 3D via-chain structures. Electrical and mechanical characterizations of the structure are performed using continuously connected 3D via-chains. Evaluation results of the wafer bonding, which is a necessary process for stacking the wafers and uses low-k dielectrics as polymeric adhesive, are also presented through the wafer bonding between a glass wafer and a silicon wafer. After wafer bonding, three evaluations are conducted; (1) the fraction of bonded area is measured through the optical inspection, (2) the qualitative bond strength test to inspect the separation of the bonded wafers is taken by a razor blade, and (3) the quantitative bond strength is measured by a four point bending. To date, benzocyclobutene (BCB), $Flare^{TM}$, methylsilsesquioxane (MSSQ) and parylene-N were considered as bonding adhesives. Of the candidates, BCB and $Flare^{TM}$ were determined as adhesives after screening tests. By comparing BCB and $Flare^{TM}$, it was deduced that BCB is better as a baseline adhesive. It was because although wafer pairs bonded using $Flare^{TM}$ has a higher bond strength than those using BCB, wafer pairs bonded using BCB is still higher than that at the interface between Cu and porous low-k interlevel dielectrics (ILD), indicating almost 100% of bonded area routinely.

• Journal of Astronomy and Space Sciences
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• v.22 no.4
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• pp.393-408
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• 2005

We developed and compared two automatic algorithms for moving object detections in the YSTAR-NEOPAT sky survey program. One method, called starlist comparison method, is to identify moving object candidates by comparing the photometry data tables from successive images. Another method, called image subtraction method, is to identify the candidates by subtracting one image from another which isolates sources moving against background stars. The efficiency and accuracy of these algorithms have been tested using actual survey data from the YSTAR-NEOPAT telescope system. For the detected candidates, we performed eyeball inspection of animated images to confirm validity of asteroid detections. Main conclusions include followings. First, the optical distortion in the YSTAR-NEOPAT wide-field images can be properly corrected by comparison with USNO-B1.0 catalog and the astrometric accuracy can be preserved at around 1.5 arcsec. Secondly, image subtraction provides more robust and accurate detection of moving objects. For two different thresholds of 2.0 and $4.0\sigma$, image subtraction method uncovered 34 and 12 candidates and most of them are confirmed to be real. Starlist comparison method detected many more candidates, 60 and 6 for each threshold level, but nearly half of them turned out to be false detections.