• Title/Summary/Keyword: Optical inspection

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Real-Time Textile Dimension Inspection System Using Zone-Crossing Method, Distortion Angle Classifier and Gray-Level Co-occurrence Matrix Features (영역교차법, 왜곡각 분류자 및 명암도 상관행렬 특징자를 이용한 실시간 섬유 성량 검사 시스템)

  • 이응주;이철희
    • Journal of Korea Multimedia Society
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    • v.3 no.2
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    • pp.112-120
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    • 2000
  • In this paper, we implement a real-time textile dimension inspection system. It can detect various types of real defects which determine the quality of fabric product, defect positions of textile, classify the distortion angel of moving textile and the density. In the implemented system, we measure the density of textile using zone-crossing method with optical lens to solve the noise and real-time problems. And we compensate distortion angel of textile with the classification of distortion types using gaussian gradient and mean gradient features. And also, it detecs real defects of textile and its positions using gray level co-occurrence matrix features. The implemented texile demension inspection systemcan inspect textile dimensions such as density, distortion angle, defect of textile and defect position at real-time. In the implemented proposed texitile dimension inspection system, It is possible to calculate density and detect default of textile at real-time dimension inspection system, it is possible to calculate density and detect default of textile at textile states throughout at all the significant working process such as dyeing, manufacturing, and other texitle processing.

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An optical sensor of a probing system for inspection of PCBs (인쇄회로기판 검사용 프로브시스템의 광학센서)

  • 심재홍;조형석;김성권
    • 제어로봇시스템학회:학술대회논문집
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    • 1997.10a
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    • pp.1742-1745
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    • 1997
  • We have developed a highly responsible probing system for inspection of electrical properties of assemble PCB$_{s}$ (printed circuit boards). However, as the duration of the impact occurring between a probe and a solder joint on PCB is very short, it is very difficult to control the harmful peak impact force and the slip motion of the probe to sufficient level only by its vorce feedback control with high gains. To overcome these disadvantages of the prototype, it needs ot obtain some information of the solder joint in advance before the contact. In addition, to guarantee the reliability of the probing task, the probing system is required to measure several points around the probale target point at high speed. There fore, to meet such requirements, we propose a new noncontaet sensor capable of detecting simultaneously position and normal vectors of the multiple points around the probable target point in real time. By using this information, we can prepare a control strategy for stable contact motion on impact. In this paper, we described measuring priniciple, design, and development of the sensor. The effectiveness of the proposed sensor is verified through a series of experiments.s.

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Determination of Sampling Points Based on Curvature distribution (곡률 기반의 측정점 결정 알고리즘 개발)

  • 박현풍;손석배;이관행
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.11a
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    • pp.295-298
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    • 2000
  • In this research, a novel sampling strategy for a CMM to inspect freeform surfaces is proposed. Unlike primitive surfaces, it is not easy to determine the number of sampling points and their locations for inspecting freeform surfaces. Since a CMM operates with slower speed in measurement than optical measuring devices, it is important to optimize the number and the locations of sampling points in the inspection process. When a complete inspection of a surface is required, it becomes more critical. Among various factors to cause shape errors of a final product, curvature characteristic is essential due to its effect such as stair-step errors in rapid prototyping and interpolation errors in NC tool paths generation. Shape errors are defined in terms of the average and standard deviation of differences between an original model and a produced part. Proposed algorithms determine the locations of sampling points by analyzing curvature distribution of a given surface. Based on the curvature distribution, a surface area is divided into several sub-areas. In each sub-area, sampling points are located as further as possible. The optimal number of sub-areas. In each sub-area, sampling points are located as further as possible. The optimal number os sub-areas is determined by estimating the average of curvatures. Finally, the proposed method is applied to several surfaces that have shape errors for verification.

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Error propagation in 2-D self-calibration algorithm (2차원 자가 보정 알고리즘에서의 불확도 전파)

  • 유승봉;김승우
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.434-437
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    • 2003
  • Evaluation or the patterning accuracy of e-beam lithography machines requires a high precision inspection system that is capable of measuring the true xy-locations of fiducial marks generated by the e-beam machine under test. Fiducial marks are fabricated on a single photo mask over the entire working area in the form of equally spaced two-dimensional grids. In performing the evaluation, the principles of self-calibration enable to determine the deviations of fiducial marks from their nominal xy-locations precisely, not being affected by the motion errors of the inspection system itself. It is. however, the fact that only repeatable motion errors can be eliminated, while random motion errors encountered in probing the locations of fiducial marks are not removed. Even worse, a random error occurring from the measurement of a single mark propagates and affects in determining locations of other marks, which phenomenon in fact limits the ultimate calibration accuracy of e-beam machines. In this paper, we describe an uncertainty analysis that has been made to investigate how random errors affect the final result of self-calibration of e-beam machines when one uses an optical inspection system equipped with high-resolution microscope objectives and a precision xy-stages. The guide of uncertainty analysis recommended by the International Organization for Standardization is faithfully followed along with necessary sensitivity analysis. The uncertainty analysis reveals that among the dominant components of the patterning accuracy of e-beam lithography, the rotationally symmetrical component is most significantly affected by random errors, whose propagation becomes more severe in a cascading manner as the number of fiducial marks increases

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A High-Speed White-Light Scanning Interferometer for Bump Inspection of Semiconductor Manufacture (반도체 Bump 검사를 위한 백색광 주사 간섭계의 고속화)

  • Ko, Kuk Won;Sim, Jae Hwan;Kim, Min Young
    • Journal of the Korean Society for Precision Engineering
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    • v.30 no.7
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    • pp.702-708
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    • 2013
  • The white-light scanning interferometer (WSI) is an effective optical measurement system for high-precision industries (e.g., flat-panel display and electronics packaging manufacturers) and semiconductor manufacturing industries. Its major disadvantages include a slow image-capturing speed for interferogram acquisition and a high computational cost for peak-detection on the acquired interferogram. Here, a WSI system is proposed for the semiconductor inspection process. The new imaging acquisition technique uses an 'on-the-fly' imaging system. During the vertical scanning motion of the WSI, interference fringe images are sequentially acquired at a series of pre-defined lens positions, without conventional stepwise motions. To reduce the calculation time, a parallel computing method is used to link multiple personal computers (PCs). Experiments were performed to evaluate the proposed high-speed WSI system.

Research and Development of Electrode Surface Inspection System (전극 표면 검사 장치 연구 개발)

  • Oh, Choonsuk
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.16 no.3
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    • pp.123-128
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    • 2016
  • In manufacturing processing of a secondary battery, the visual inspection system is studied and developed to check the surface defects of the electrode plates. It consists of two parts, one is the hardware control and the other software implementation. The former is made up to the system configuration and the design of the optical system, the illuminations and the controllers. The latter is the detection algorithms of the surface defects. This system achieves the quality improvement of the electrode process and the price competitiveness. By using the proposed defects detection algorithms this system demonstrates the high reliability of spot, line, manhole, extraneous substance, scratch, and crater defect of a electrode plate surface.

Assessment of London underground tube tunnels - investigation, monitoring and analysis

  • Wright, Peter
    • Smart Structures and Systems
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    • v.6 no.3
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    • pp.239-262
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    • 2010
  • Tube Lines has carried out a "knowledge and investigation programme" on the deep tube tunnels comprising the Jubilee, Northern and Piccadilly lines, as required by the PPP contract with London Underground. Many of the tunnels have been in use for over 100 years, so this assessment was considered essential to the future safe functioning of the system. This programme has involved a number of generic investigations which guide the assessment methodology and the analysis of some 5,000 individual structures. A significant amount of investigation has been carried out, including ultrasonic thickness measurement, detection of brickwork laminations using radar, stress measurement using magnetic techniques, determination of soil parameters using CPT, pressuremeter and laboratory testing, installation of piezometers, material and tunnel segment testing, and trialling of remote photographic techniques for inspection of large tunnels and shafts. Vibrating wire, potentiometer, electro level, optical and fibre-optic monitoring has been used, and laser measurement and laser scanning has been employed to measure tunnel circularity. It is considered that there is scope for considerable improvements in non-destructive testing technology for structural assessment in particular, and some ideas are offered as a "wish-list". Assessment reports have now been produced for all assets forming Tube Lines' deep tube tunnel network. For assets which are non-compliant with London Underground standards, the risk to the operating railway has to be maintained as low as reasonably practicable (ALARP) using enhanced inspection and monitoring, or repair where required. Monitoring techniques have developed greatly during recent years and further advances will continue to support the economic whole life asset management of infrastructure networks.

3-Dimensional Shape Measurement System for BGA Balls Using PMP Method (PMP 방식을 이용한 BGA 볼의 3차원 형상측정 시스템)

  • Kim, Hyo Jun;Kim, Joon Seek;Joo, Hyonam
    • Journal of Institute of Control, Robotics and Systems
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    • v.22 no.1
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    • pp.59-65
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    • 2016
  • As modern electronic devices get smaller and smaller, high-resolution, large Field-Of-View (FOV), fast, and cost-effective 3-dimensional (3-D) measurement is requested more and more. In particular, defect inspection machines using machine-vision technology nowadays require 3-D inspection as well as the conventional 2-D inspection. Phase Measuring Profilometry (PMP) is one of the fast non-contact 3-D shape measuring methods currently being extensively investigated in the electronic component manufacturing industry. The PMP system is well known and is successfully applied to measuring complex surface profiles with varying reflectance properties. However, for highly reflective surfaces, such as Ball Grid Arrays (BGAs), it has difficulty accurately measuring 3-D shapes. In this paper, we propose a new fast optical system that can eliminate the highly reflective saturated regions in BGA ball images. This is achieved by utilizing four Low Intensity Grating (LIG) images together with the conventional High Intensity Grating (HIG) images. Extensive experiments using BGA samples show a repeatability of under ${\pm}20um$ in standard deviation, which is suitable for most 3-D shape measurements of BGAs.

An Experimental Study on Characteristic Analysis of Deflection Response of RC Structures using Measured Strain (측정변형률을 이용한 RC 구조물의 변위 응답 특성분석에 관한 실험적 연구)

  • Park, Hung-Seok;Park, Ki-Tae;Lee, Kyu-Wan
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.5 no.3
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    • pp.173-180
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    • 2001
  • In the past few years, the nondestructive inspection technology has greatly developed due to the increased necessity to gain a complete understanding of the bridge behavior. Especially, the deformations of bridges contain a lot of informations about its health state. By measuring these deformations it is possible to analyze the loading and aging behavior of the structure. However, the current, methods (such as LVDT, dial gage, optical displacement transducer, etc) are often of changeable application on site and have the limitations of installation. In this paper, the classical beam theory was reviewed and the deflections of structure are estimated using measured strain which is easy to acquire. The applicability of this algorithm is verified by laboratory(simple reinforced concrete beam) and field test. By this test, we proposed correction factor to estimate deflection of reinforced concrete beam after cracking, and analyze about the generation of correction factor. Also fiber optic sensors as well as resistive strain gages were installed in the concrete beams to establish the applicability of fiber optic sensors in the field of civil engineering.

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Statistical Approach to 3-Dimensional Shape Inspection of Micro Solder Balls (통계적 방법에 의한 마이크로솔더볼의 3차원형상검사)

  • Kim, Jee Hong
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.4
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    • pp.19-23
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    • 2021
  • A statistical approach to inspection of the 3-D shape of micro solder balls is proposed, where an optical method with spatially arranged LED and specular reflection is used. The reflected image captured by a vision system was analyzed to calculate the relative displacements of LED's in the image. Also, the statistics of displacements for the solder balls contained in a captured image are used to detect existing defects, and the usefulness of the proposed method is shown via experiments.