• Proceedings of the Optical Society of Korea Conference
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• 2009.02a
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• pp.387-388
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• 2009

Biophotonics is an emerging area in a fusion of biology and photonics, especially in advanced bioimaging, optical biosensors, photomodulation, and biochip optical read-out, and optical manipulation. This emerging area also creates many opportunities for interdisciplinary study of biology and photonics. Micro-Electro-Mechanical-System(MEMS) is an attractive technology in miniaturizing sensors and actuactors. For last decade, it has contributed to the development for active and passive small and integrated optical components in optical communication. Recently, this technology is also merging into biology for high sensitive biosensing and high resolution and fast bioimaging in small form factor. In this talk, some key advantages of small optical components and recent biophotonic MEMS achievement will be discussed for miniaturized advanced biophotonic systems.

• Korean Journal of Optics and Photonics
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• v.28 no.4
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• pp.153-157
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• 2017

An infrared camera and laser common-path optical system is applied to DIRCM (directional infrared countermeasures), to increase boresighting accuracy and decrease weight. Thermal effects of a laser beam in a common-path optical system are analyzed and evaluated, to predict any degradation in image quality. A laser beam with high energy density is absorbed by and heats the optical components, and then the surface temperature of the optical components increases. The heated optical components of the common-path optical system decrease system transmittance, which can degrade image quality. For analysis, the assumed simulation condition is that the laser is incident for 10 seconds on the mirror (aluminum, silica glass, silicon) and lens (sapphire, zinc selenide, silicon, germanium) materials, and the surface temperature distribution of each material is calculated. The wavelength of the laser beam is $4{\mu}m$ and its output power is 3 W. According to the results of the calculations, the surface temperature of silica glass for the mirror material and sapphire for the lens material is higher than for other materials; the main reason for the temperature increase is the absorption coefficient and thermal conductivity of the material. Consequently, materials for the optical components with high thermal conductivity and low absorption coefficient can reduce the image-quality degradation due to laser-beam thermal effects in an infrared camera and laser common-path optical system.

• Transactions of Materials Processing
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• v.11 no.2
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• pp.103-107
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• 2002

With the great demand for WDM (Wavelength Division Multiplexing) optical communications, optical switches are expected to become one of the dominant components in future networks. Conventional mechanical switches suffer from poor reliability and large size; however, many micromachined optical switches with moving mirrors have been proposed for high scale OXC (Optical Crossconnect) or ADM (Add/Drop Multiplex) because of the low power consumption and high reliability of these switches. In this paper, we introduce the technological trends of optical switches using MEMS, related micromachining technologies and their characteristics.

• Publications of The Korean Astronomical Society
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• v.20 no.1 s.24
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• pp.151-161
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• 2005

The reimaging optics of the KASINICS (KASI Near Infrared Camera System) includes many transparent components like an entrance window, band-pass filters, and blocking filters. As observational targets or in-field background objects, bright stars may cause optical ghosts that can significantly degrade the system performance of the KASINICS. We estimated analytically the relative brightness of ghost components with respect to a point source and examined the effects of tilting optical components as a method of suppressing ghosts. We also performed numerical ray tracings including all the optical components and found the results are consistent with those of the analytic estimations. We conclude that the KASINICS will not suffer from significant ghost effects with appropriate anti-reflection coatings and fittings for the optical components.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.9 no.6
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• pp.1-6
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• 2010

Patterned optical components are widely used for optical products such as LCD and lighting. Since CCFL was used as a light source in the products, prism films having linear continuous optical patterns were widely used. However, LED which is a dot light source is popular recently, therefore, the optical products need new optical components having non-continuous optical patterns. Indentation machining method is a powerful method for machining of non-continuous pattern. When a copper mold and a brass mold were machined by this method, severe plastic deformation called pile-up was observed around the patterns. Since pile-up has negative relationship to ductility, this deformation can be eliminated by annealing treatment which makes the materials ductile. No plastic deformation occurred when machined after annealing at $600{^{\circ}C}$ and $575{^{\circ}C}$ for copper and brass, respectively. Finally, non-continuous optical patterns with high quality were machined on a copper mold and a brass mold successively.

• Electronics and Telecommunications Trends
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• v.34 no.5
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• pp.81-90
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• 2019

The data rate for transmission through fiber-optic cables has increased to 400 Gbps in single-wavelength channels. However, speeds up to 1 Tbps are required now to meet the ever-increasing bandwidth demand driven by the diverse requirements of contemporary applications for high-quality on-demand video streaming, cloud services, various social media, and emerging 5G-enabled applications. Because the data rates of the per-channel optical interfaces depend strongly on the operational speed of the optoelectronic devices used in optical transceivers, ultrahigh-speed photonic devices and components, and eventually, chip-level transmitter and receiver technologies, are essentially required to realize futuristic optical transceivers with data rates of 1 Tbps and beyond. In this paper, we review the recent progress achieved in high-speed optoelectronic devices, such as laser diodes, optical modulators, photodiodes, and the transmitter-receiver optical subassembly for optical transceivers in data centers and in metro/long-haul transmission.

• ETRI Journal
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• v.28 no.1
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• pp.9-16
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• 2006

In this paper, we analyzed and measured the electrical crosstalk characteristics of a 1.25 Gbps triplexer module for Ethernet passive optical networks to realize fiber-tothe-home services. Electrical crosstalk characteristic of the 1.25 Gbps optical triplexer module on a resistive silicon substrate should be more serious than on a dielectric substrate. Consequently, using the finite element method, we analyze the electrical crosstalk phenomena and propose a silicon substrate structure with a dummy ground line that is the simplest low-crosstalk layout configuration in the 1.25 Gbps optical triplexer module. The triplexer module consists of a laser diode as a transmitter, a digital photodetector as a digital data receiver, and an analog photodetector as a cable television signal receiver. According to IEEE 802.3ah and ITU-T G.983.3, the digital receiver and analog receiver sensitivities have to meet -24 dBm at $BER=10^{-12}$ and -7.7 dBm at 44 dB SNR. The electrical crosstalk levels have to maintain less than -86 dB from DC to 3 GHz. From analysis and measurement results, the proposed silicon substrate structure that contains the dummy line with $100\;{\mu}m$ space from the signal lines and 4 mm separations among the devices satisfies the electrical crosstalk level compared to a simple structure. This proposed structure can be easily implemented with design convenience and greatly reduce the silicon substrate size by about 50 %.

• Current Optics and Photonics
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• v.7 no.5
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• pp.529-536
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• 2023

The Morlet wavelet transform method is proposed to analyze a single interferogram with spatial carrier frequency that is captured by an optical interferometer. The method can retain low frequency components that contain the phase information of a measured optical surface, and remove high frequency disturbances by wavelet decomposition and reconstruction. The key to retrieving the phases from the low-frequency wavelet components is to extract wavelet ridges by calculating the maximum value of the wavelet transform amplitude. Afterwards, the wrapped phases can be accurately solved by multiple iterative calculations on wavelet ridges. Finally, we can reconstruct the wave-front of the measured optical element by applying two-dimensional discrete cosine transform to those wrapped phases. Morlet wavelet transform does not need to remove the spatial carrier frequency components manually in the processing of interferogram analysis, but the step is necessary in the Fourier transform algorithm. So, the Morlet wavelet simplifies the process of the analysis of interference fringe patterns compared to Fourier transform. Consequently, wavelet transform is more suitable for automated programming analysis of interference fringes and avoiding the introduction of additional errors compared with Fourier transform.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.167-172
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• 2002

Recent years, optical components'are widely used in optical communication industry for high speed and mass storage data processing. Micro grooving of planar lightwave circuit and glass, those are widely used in optical component, are realized by polycrystalline diamond tool with ultrasonic vibration. To know the characteristics of brittle materials cutting, ultrasonic vibration cutting tool and machining system are built for the experiment. Grooving on planar lightwave circuit and glass experiments are performed and their shape are measured by photograph with microscope. It reveals that better groove shape with low chipping of planar lightwave circuit and glass are obtained by micro grooving machining with ultrasonic vibration. These experiments are considered as a possibility to the micro grooving of optical communication components.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1586-1589
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• 2007

The influence of optical components constituting the backlight of TV on the luminance property of backlight was analyzed. The variation of luminance when the light emitted from light source passes each optical part was evaluated.