• Journal of the Korean Society for Precision Engineering
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• v.15 no.5
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• pp.9-18
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• 1998

The components with J-lead. which are more integrated and smaller than ones with Gull-wing. are rapidly being used in electronic board such as the PCB, for they have the advantage of occupying a small space compared to the other components. However, the development of inspection system for these new components is not so rapid as component development. Component-inspection with J-lead using vision system is difficult because they are hidden from camera optical axis. X-ray inspection, which has the advantage of inspecting the inside of solder state, is used to J-lead inspection. However. it is high cost and dangerous by leaking out X-ray compared to vision system. Therefore, in this paper, we design vision system suited to J-lead inspection and then propose algorithm which have flexibility in mount and rand error.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2004.05a
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• pp.342-345
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• 2004

We design a new actuator in order to achieve 3-axes motion for high performance optical device. The actuator makes it possible to control the tilting motion by using moving magnet and PCB-coil, which have benefits in terms of prices and manufacturing. To predict the features of actuator, especially the effect of moving magnet, finite element method and electro-magnetic analysis are used From comparing simulated data with experimental results, we verified the accuracy of the simulation and the superiority of the present actuator.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.15 no.2 s.95
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• pp.156-160
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• 2005

We design a new actuator of 3-axis motion for high performance optical devices. The actuator makes it possible to control the tilting motion by using moving magnet and PCB-coil, which have benefits in price and manufacturing. To predict the characteristics of the actuator, especially the effect of moving magnet, finite element method and electro-magnetic analysis were used. By comparing simulation data with experimental results, we verified the accuracy of the simulation and the superiority of the present.

• Proceedings of the Optical Society of Korea Conference
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• 2005.02a
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• pp.64-65
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• 2005

• Journal of Korea Multimedia Society
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• v.24 no.8
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• pp.988-999
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• 2021

AOI (Automatic Optical Inspection) of PCB (Printed Circuit Board) is a very important step to guarantee the product performance. The process of registering components called teaching mode is first perform, and AOI is then carried out in a testing mode that checks defects, such as recognizing and comparing the component mounted on the PCB to the stored components. Since most of registration of the components on the PCB is done manually, it takes a lot of time and there are many problems caused by mistakes or misjudgement. In this paper, A components classifier is proposed using YOLO (You Only Look Once) v2's object detection model that can automatically register components in teaching modes to reduce dramatically time and mistakes. The network of YOLO is modified to classify small objects, and the number of anchor boxes was increased from 9 to 15 to classify various types and sizes. Experimental results show that the proposed method has a good performance with 99.86% accuracy.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.7 s.349
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• pp.13-19
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• 2006

A 5Gb/s cross coupled transimpedance amplifier (TIA) & limiting amp(LA), regulated cascode(RGC) is realized in a 0.18$\mu$m CMOS technology for optical printed circuit board applications. The optical receiver demonstrates $92.8db{\Omega}$ transimpedance and limiting amplifier gain, 5Gb/s bandwidth for 0.5pF photodiode capacitance, and 9.74mW power dissipation from 1.8V, 2.4V supply. Input stage impedance is $50{\Omega}$. The circuit was implemented on an optical PCB, and the 5Gb/s data output signal was measured with a good data eye opening.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.14 no.9 s.90
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• pp.891-896
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• 2004

'Coil' occupies very much important position in delivering driving force of optical pick-up actuators. Up to now the main stream has been a winding coil type actuator, but actuators using FP-Coil(fine pattern coil) have been considered for the more compacted and simple manufacturing process and have variously spreaded the application fields by product. We have tried to design actuators using PCB-Coil(printed circuit board coil) which has benefits in terms of price and manufacturing process. Especially this research has two main things to reduce the vibration of sub-resonance and to assure the DC sensitivity among the performances of asymmetric optical pick-up actuator with PCB-Coil.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.23 no.4
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• pp.507-514
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• 2012

This paper proposed the analysis method of the cavity resonance characteristics for a metallic enclosure with a PCB trace source. In order to calculation the electromagnetic fields inside the cavity, coupled integral equations for a current distribution on the PCB trace and an aperture electric field distribution on the boundary of the PCB dielectric are derived and solved by applying Galerkin's method of moments. The result show that the resonant characteristics of the metallic enclosure are fairly good agreement with the simulation(HFSS) and the measured results. The resonant frequencies of the metallic enclosure with the PCB trace are changed by the PCB trace location inside of the cavity. In order to check the validity of the theoretical analysis, the calculated return losses are compared with the measured results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.297-298
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• 2009

대부분의 반도체 소자의 고장 원인은 85%정도가 열로 인한 것이며, 고출력 LED는 인가된 에너지의 20%정도의 광으로 출력되며 나머지 80%가 열로 전환된다. 본 논문에서는 PMS-50과 KEITHLEY 2430을 이용하여 PCB 구조와 Via hole 구성에 따른 LED 패키지의 열적 광학적 특성을 분석하였다. 0.6mm의 Via hole을 가진 FR4 PCB의 열특성이 가장 우수하였으며, Via hole 0.6mm FR4 PCB의 경우 McPCB에 상응하는 광출력 특성을 보였다.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.6
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• pp.88-95
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• 2003

This paper presents the measurement and correction method of PCB alignment errors for PCB screen printer. Electronic equipment is getting smaller and yet must satisfy high performance standard. Therefore, there is a great demand for PCB with high density. However conventional PCB screen printer doesn't have enough accuracy to accommodate the demand fur high-resolution circuit pattern and high-density mounting capacity of electronic chips. It is because the alignment errors of PCB occur when it is loaded to the screen printer. Therefore, this study focuses on the development of the system which is able to measure and correct alignment errors with high-accuracy. An automatic optical inspection part measures the PCB alignment errors using machine vision, and the high-accuracy 3-axis stage makes correction for these errors. This system used two CCD cameras to get images of two fiducial marks of PCB. The geometrical relationship between PCB, cameras, and xy$\theta$ stage is derived, and analytical equations for alignment errors are also obtained. The unknown parameters including camera declining angles and etc. can be obtained by initialization process. Finally, the proposed algorithm is verified by experiments by using test bench.