• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 영호남학술대회 논문집
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• pp.7-12
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• 2000

This paper presents the electrochemical etch-stop characteristics of single-crystal silicon in a tetramethyl ammonium hydroxide(TMAH):isopropyl alcohol(IPA):pyrazine solution. Addition of pyrazine to a TMAH:IPA etchant increases the etch-rate of (100) silicon, thus the elapsed time for etch-stop was shortened. The current-voltage (I-V) characteristics of n- and p-type silicon in a TMAH:IPA:pyrazine solution were obtained, respectively. Open circuit potential(OCP) and passivation potential(PP) of n- and p-type silicon, respectively, were obtained and applied potential was selected between n- and p-type silicon PP. The electrochemical etch-stop is applied to the fabrication of 801 microdiaphragms having $20{\mu}m$ thickness on a 5-inch silicon wafer. The averge thicknesses of 801 microdiaphragms fabricated on the one wafer were $20.03{\mu}m$ and standard deviation was ${\pm}0.26{\mu}m$. The silicon surface of the etch-stopped microdiaphragm was extremely flat without noticeable taper or other nonuniformities. The benefits of the electrochemical etch-stop in a TMAH:IPA:pyrazine solution become apparent when reproducibility in the microdiaphragm thickness for mass production is considered. These results indicate that the electrochemical etch-stop in a TMAH:IPA:pyrazine solution provides a powerful and versatile alternative process for fabricating high-yield silicon microdiaphragms.

• Corrosion Science and Technology
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• 제7권1호
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• pp.61-67
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• 2008

In this paper, electrochemical and microstructural characteristics of nickel-plated Alloy 600 were investigated in order to identify the performance of electroless Ni-plating on Alloy 600 in high-temperature aqueous condition with the comparison of electrolytic nickel-plating. For high temperature corrosion test of nickel-plated Alloy 600, specimens were exposed for 770 hours to typical PWR primary water condition. During the test, open circuit potentials (OCP's) of all specimens were measured using a reference electrode. Also, resistance to flow accelerated corrosion (FAC) test was examined in order to check the durability of plated layers in high-velocity flow environment at high temperature. After exposures to high flow rate aqueous condition, the integrity of surfaces was confirmed by using both scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). For the field application, a remote process for electroless nickel-plating was demonstrated using a plate specimen with narrow gap on a laboratory scale. Finally, a practical seal design was suggested for more convenient application.

• Transactions on Electrical and Electronic Materials
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• 제2권2호
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• pp.26-31
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• 2001

This paper presents the electrochemical etch-stop characteristics of single-crystal Si(001) wafers in tetramethyl ammonium hydroxide(TMAH):isopropyl alcohol(IPA):pyrazine solutions. The addition of pyrazine to TMAH:IPA solutions increased the etch rate of (100) Si, thus the etching time required by the etch-stop process shortened. The current-voltage(I-V) characteristics of n- and p-type Si in TMAH:IPA:pyrazine solutions were obtained, respectively. Open circuit potential(OCP) and passivation potential(PP) of n- and p-type Si, respectively, were obtained and applied potential was selected between n- and p-type Si PPs. The electrochemical etch-stop method was used to fabricate 801 microdiaphragms of 20 ${\mu}{\textrm}{m}$ thickness on a 5-inch Si wafer. The average thickness of fabricated 801 microdiaphragms on one Si wafer was 20.03 ${\mu}{\textrm}{m}$ and the standard deviation was $\pm$0.26 ${\mu}{\textrm}{m}$. The Si surface of the etch-stopped microdiaphragm was extremely flat with no noticeable taper or nonuniformity.

• Corrosion Science and Technology
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• 제22권3호
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• pp.137-152
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• 2023

Polarization behavior and corrosion inhibition of copper in acidic chloride solutions containing benzotriazole were studied. Pourbaix diagrams constructed for copper in NaCl solutions with different BTAH concentrations were used to understand the polarization behavior. Open circuit potential (OCP) depended not only on chloride concentration, but also on whether a CuBTA layer was formed on the copper surface. Only when the (pH, OCP) was located well in the CuBTA region of the Pourbaix diagram, a stable corrosion inhibiting CuBTA layer was formed, which was confirmed by X-ray Photoelectron Spectroscopy (XPS) and a long-term corrosion test. The OCP for the CuBTA layer decreased logarithmically with increasing [Cl^-] activity in the solution. A minimum BTAH concentration required to form a CuBTA layer for a given NaCl concentration and pH were determined from the Pourbaix diagram. It was found that 320 ppm BTAH solution could be used to form a corrosion-inhibiting CuBTA layer inside the corrosion pit in the sprinkler copper tube, successfully reducing water leakage rate of copper tubes. These experimental results could be used to estimate water chemistry inside a corrosion pit.

• Bulletin of the Korean Chemical Society
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• 제25권12호
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• pp.1822-1828
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• 2004

Electrochemical, in situ electrochemical scanning tunneling microscope (EC-STM), and attenuated total reflectance-FTIR (ATR-FTIR) spectroscopic methods were employed to investigate the preparation of atomically flat Si(111)-H surface in ammonium fluoride solutions. Electrochemical properties of atomically flat Si(111)-H surface were characterized by anodic oxidation and cathodic hydrogen evolution with the open circuit potential (OCP) of ca. -0.4 V in concentrated ammonium fluoride solutions. As soon as the natural oxide-covered Si(111) electrode was immersed in fluoride solutions, OCP quickly shifted to near -1 V, which was more negative than the flat band potential of silicon surface, indicating that the surface silicon oxide had to be dissolved into the solution. OCP changed to become less negative as the oxide layer was being removed from the silicon surface. In situ EC-STM data showed that the surface was changed from the initial oxidecovered silicon to atomically rough hydrogen-terminated surface and then to atomically flat hydrogenterminated surface as the OCP moved toward less negative potentials. The atomically flat Si(111)-H structure was confirmed by in situ EC-STM and ATR-FTIR data. The dependence of atomically flat Si(111)-H terrace on mis-cut angle was investigated by STM, and the results agreed with those anticipated by calculation. Further, the stability of Si(111)-H was checked by STM in ambient laboratory conditions.

• Journal of Electrochemical Science and Technology
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• 제14권4호
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• pp.311-319
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• 2023

This work was performed to characterize the electrochemical behavior of AZ31 Mg alloy in neutral aqueous solutions where Cl^-, SO₄^2-, PO₄^3-, and F^- ions were present and pH was adjusted to 6 to exclude the contribution of H⁺ and OH^- ions. Open-circuit potential (OCP) transient, electrochemical impedance spectroscopy (EIS) and potnetiodynamic polarization curves were employed. The OCP value appeared to decrease in the order of F^- > Cl^- > SO₄^2- > PO₄^3- ions while corrosion current density increased in the same order. Electrochemical impedance spectroscopy (EIS) data showed two capacitive arcs in all the solutions and one more inductive arc appeared in PO₄^3--containing solution. By fitting of two capacitive arcs, capacitance of dense film (C_df), resistance of porous film (R_pf) and double layer capacitance (C_dl) and charge transfer resistance (R_ct) beneath the porous films were obtained. A simplified model in which various thicknesses and coverages of dense and porous films are assumed to be present on the AZ31 Mg alloy surface, is suggested to explain the effects of four different anions on the electrochemical behavior of AZ31 Mg alloy.

• Journal of Electrochemical Science and Technology
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• 제3권4호
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• pp.185-189
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• 2012

A.c. impedances of mechanically polished CP-Ti specimens were measured at open-circuit potential (OCP) with immersion time and under applied anodic potentials between -0.2 and 1 $V_{Ag/AgCl}$ in 0.1 M NaOH solution. Capacitances of native oxide films ($C_{ox,na}$) grown naturally and capacitances of anodic oxide films ($C_{ox,an}$) formed under applied anodic potentials were obtained to examine the growth of native and anodic oxide films in 0.1 M NaOH solution and how to use $C_{ox,na}$ for the surface area measurement of Ti specimen. $1/C_{ox,na}$ and $1/C_{ox,an}$ appeared to be linearly proportional to OCP and applied potential ($E_{app}$), with proportional constants of 0.086 and 0.051 $uF^{-1}\;V^{-1}$, respectively. The $C_{ox,na}$ also appeared to be linearly proportional to geometric surface area of the mechanically polished CP-Ti fixture specimen, with proportional constants of 11.3 and $8.5{\mu}F\;cm^{-2}$ at -0.45 $V_{Ag/AgCl}$ and -0.25 $V_{Ag/AgCl}$ of OCPs, respectively, in 0.1 M NaOH solution. This linear relationship between $C_{ox,na}$ and surface area is suggested to be applicable for the measurement of real surface area of Ti specimen.

• Corrosion Science and Technology
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• 제20권2호
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• pp.45-51
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• 2021

In this work, we describe the effect of pulse anodizing duty ratio on the corrosion resistance of anodic films in magnesium AZ31B. The process involves the application of square pulse potential for a constant period with a duty ratio varying from 40, 60 and 80%. In several samples, a sealing treatment for 30 minutes was conducted after anodization in order to seal the pores available in the anodic layer. After anodizing, the surface morphology of the anodic layer was examined using a scanning electron microscope (SEM Hitachi SU3500). The corrosion characteristics of the sample were evaluated through an open circuit potential (OCP) and potentiodynamic polarization test using potentiogalvanostat. SEM observation shows that the increase of anodization duty ratio (α) results in a more uniform anodic layer, with fewer pores and cracks. The increase of duty ratio (α) decreases the OCP value from approximately -1.475 to about -1.6 Volt, and significantly improves the corrosion resistance of the anodic coating by 68%. The combination of anodization and sealing treatment produces an anodic coating with a very low corrosion rate of 4.4 mpy.

• Carbon letters
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• 제4권2호
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• pp.64-68
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• 2003

A study on the electrosorption of uranium ions onto a porous activated carbon fiber (ACF) was performed to treat uraniumcontaining lagoon sludge. The result of the continuous flow-through cell electrosorption experiments showed that the applied negative potential increased the adsorption kinetics and capacity in comparison to the open-circuit potential (OCP) adsorption for uranium ions. Effective U(VI) removal is accomplished when a negative potential is applied to the activated carbon fiber (ACF) electrode. For a feed concentration of 100 mg/L, the concentration of U(VI) in the cell effluent is reduced to less than 1 mg/L. The selective removal of uranium ions from electrolyte was possible by the electrosorption process.

• The Journal of Advanced Prosthodontics
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• 제12권3호
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• pp.114-123
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• 2020

PURPOSE. The aim of this study was to evaluate the corrosion resistance of the specimens produced by five different commercial metal laser sintering (MLS) systems with their recommended Co-Cr alloy powders. MATERIALS AND METHODS. The MLS machines and the alloy powders used were, ProX 100-ST2724G (St-Pro), Mysint 100-EOS SP2 (SP2-Mys), EOSINT 270-EOS SP2 (SP2-EOS), SLM 100-Starbond CoS (SB-SLM), and MLab Cusing-Remanium^® Star (RS-MLab), respectively. Eight specimens from each group were prepared. Open circuit potential (E_ocp) and electrochemical impedance spectroscopy (EIS) measurements of polished surfaces of the specimens were conducted in a three-electrode cell using a potentiostat-galvanostat in Fusayama-Meyer artificial saliva (AS). Specimens from each group were immersed in AS and de-ionized water for seven days. E_ocp, charge transfer resistance (R_ct) values, and released ions (㎍/㎠ × 7d) in different solutions were determined. The specimen surfaces were observed with SEM/EDS. Results were analyzed statistically. RESULTS. E_ocp values have shifted to potentials that are more positive over time. Steady-state E_ocp values were from high to low as follows, SB-SLM, SP2-Mys, SP2-EOS, RS-MLab, and ST-Pro, respectively. After 60 mins, RS-MLab specimens had the highest R_ct value, followed by SP2-Mys, SB-SLM, SP2-EOS, and ST-Pro. In all groups, ion release was higher in AS than that in de-ionized water. CONCLUSION. There were small differences among the corrosion resistances of the Co-Cr alloy specimens produced with MLS systems; meanwhile, the corrosion resistances were quite high for all specimens.