• Bulletin of the Korean Chemical Society
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• v.30 no.2
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• pp.368-372
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• 2009

The trace polymer and additives in used stripper solutions were analyzed by a combination of Py-GC/MS and ESI-MS. In the comparison of the pyrolysates produced by the pyrolysis of the pure stripper and photoresist at $500{^{\circ}C}$, the presence of novolac polymer in the used stripper was confirmed by the presence of the characteristic peaks of its pyrolysates, such as those of the methylphenol, di-methylphenol and methylenebis(methylphenol) isomers. The intact trace polymer was measured by ESI-MS, which showed the distribution of oligomers at intervals of 120 Da, indicating di-methylphenol to be the repeat unit. Additional MS/MS measurements demonstrated that the end group is methylphenol and the repeat groups are di-methylphenol. Some modified oligomers caused by the methylation or di-methylation of the repeat unit were also identified. Although the polymer is only present at a trace level in the used stripper, these combined analytical methods provided the means to qualify the stripper solution through the identification and structural determination of the polymer.

• Journal of the Korean Applied Science and Technology
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• v.33 no.4
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• pp.634-646
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• 2016

In this work, modified epoxy resins which were well melted in mild solvent were synthesized and solubility assessment was carried out for synthesized epoxy resins. Bisphenol-A type, phenol novolac type and ortho-cresol novolac type epoxy resins were used and fatty acid, dodecyl phenol (DP) and toluene diisocyanate (TDI) were added for synthesis of modified epoxy resins containing fatty acid (MEFA). Composition was epoxy resin/fatty acid = 1.0/0.5 and fatty acid/DP = 0.25/0.25 by equivalent weight and twelve MEFAs were synthesized according to epoxy resins. Viscosity and solubility were measured for twelve MEFAs. As a result, solubility of MEFA was excellent for mild solvent according to increasement of contents of benzene ring, glycidyl group and carbon number of alkyl group. And physical properties were measured for each coating of paints after preparing transparent paints of MEFA to melt well in mild solvent among twelve MEFAs. As a result, they showed an optimal performance on conditions of equivalent ratio of bisphenol-A type epoxy resin/fatty acid/DP/TDI; 1.0/0.25/0.25/0.5 and equivalent ratio of phenol novolac type epoxy resin/fatty acid/DP; 1.0/0.25/0.25 for drying time, adhesion, hardness, impact resistance and alkali resistance.

• Fibers and Polymers
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• v.5 no.2
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• pp.156-159
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• 2004

Novoloid fibers have high chemical, flame and thermal resistance; however they have low tensile properties. Effects of gamma irradiation on the tensile properties of novoloid fibers have been investigated. Loop and knot resistance have also been examined. Maximum tenacity of the single fiber increased with an increase of the radiation dose applied. According to the loop and knot tenacity results it is found that brittleness has been also affected by the amount of radiation dose.

• Journal of the Semiconductor & Display Technology
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• v.3 no.1
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• pp.27-30
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• 2004

In this work, the variation of the sidewall profile of a thick photoresist on the wavelength and proximity gap was investigated. PMER P-LA900PM, DNQ (DiazoNaphthoQuinone) novolac type photoresist, is used for experiments. The calculated results agreed well with the experimental results.

• Journal of the Korean Ceramic Society
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• v.29 no.6
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• pp.471-479
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• 1992

AlN powder was synthesized by carbothermal reduction and nitridation using Al2(SO4)3.18H2O as the starting material. The synthesized AlN powder was fine but contained oxygen. Therefore carbonaceous material (carbon black or phenol novolac) was added teogether with the sintering aids (CaO, CaF2, CaCl2, Y2O3 and YF3). It was found that pressureless sintering at 1700~180$0^{\circ}C$ after deoxidation at 150$0^{\circ}C$ suppressed the formation of second phase (27R) and reduced the contents of lattice oxygen within AlN ceramics.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1999.11a
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• pp.213-218
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• 1999

Friction and wear characteristics of novolac resin-based friction materials reinforced with aramid pulp and potassium titanate were investigated by using a pad-on-disk type friction tester. Friction properties such as friction stability, surface morphology, and wear rate varied according to the relative amount of aramid pulp and potassium titanate. The friction materials reinforced with both aramid pulp and potassium titanate showed superior friction stability and wear resistance due to the formation of durable transfer layer.

• Carbon letters
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• v.5 no.3
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• pp.127-132
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• 2004

Chop molding composites and 2D carbon/carbon composites were manufactured by hot press molding method. Phenol resin of novolac type was used for matrix precursor and PAN-based carbon, PAN-based graphite and pitch-based carbon fiber were used for reinforcement and boron oxide was used for oxidation retardant. All of the composites were treated by $2000^{\circ}C$ and $2400^{\circ}C$ graphitization process, respectively. After graphitization process, amount of a boron residue in carbon/carbon composites is much according to irregularity of used raw materials. Under the presence of boron in carbon/carbon composites, catalytic effect of boron was a little at $2000^{\circ}C$ graphitization temperature. However, it was quite at $2400^{\circ}C$ graphitization.

• Journal of the Semiconductor & Display Technology
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• v.16 no.2
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• pp.19-26
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• 2017

The cure properties of ethoxysilyl bisphenol A type epoxy resin (Ethoxysilyl-DGEBA) systems with different hardeners were investigated, comparing with DGEBA and Diallyl-DGEBA epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The Ethoxysilyl-DGEBA epoxy resin system showed lower cure conversion rates than DGEBA and Diallyl-DGEBA epoxy resin systems. The conversion rates of these epoxy resin systems with DDM hardener are lower than those with HF-1M hardener. It can be considered that the optimum hardener for Ethoxysilyl-DGEBA epoxy resin system is Phenol Novolac type. These lower cure conversion rates in the Ethoxysilyl-DGEBA epoxy resin systems could be explained by the retardation of reaction molecule movements according to the formation of organic-inorganic hybrid network structure by epoxy and ethoxysilyl group in Ethoxysilyl- DGEBA epoxy resin system.

• Applied Chemistry for Engineering
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• v.9 no.6
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• pp.884-888
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• 1998

Effects of heating time under high temperature on the thermal and mechanical properties of neutron shielding materials based on modified (KNS-102), hydrogenated(KNS-106) bisphenol-A type epoxy resin and phenol-novolac(KNS-611) type epoxy resin for radioactive material shipping casks have been investigated. At early stages, the initial decomposition temperatures of the shielding materials of KNS-102, KNS-106 and KNS-611 increased with the heating time under high temperature, but it was rarely affected by the heating time in the later stages. In addition, the thermal conductivities of KNS-102 and KNS-106 decreased with heating time, but that of KNS-611 increased with the heating time. On the contrary, the thermal expansion coefficients of neutron shielding materials decreased with increase of heating time. At the high temperature, the tensile strength and flexural strength of the shielding materials of KNS-102 and KNS-611 increased with heating time, but those of KNS-106 decreased with increase of heating time. And the heating time under high temperature on the neutron shielding materials did not show measurable loss of weight and hydrogen content.

• Journal of the Korean Chemical Society
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• v.40 no.1
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• pp.81-86
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• 1996

The physical properties of epoxy molding compound (EMC) according to the change of softening point of epoxy resin have been investigated in order to study the relationship between the properties of o-cresol novolac epoxy resin, which is main component of EMC for semiconductor encapsulation, and EMC. The softening points of used epoxy resin are 65.1 $^{\circ}C$, 72.2 $^{\circ}C$, and 83.0 $^{\circ}C$, respectively. The flexural strength and flexural modulus as mechanical properties were measured, and thermal expansion coefficient, thermal conductivity and glass transition temperature (Tg) as thermal properties, and spiral flow as moldability have been investigated to see the change of physical properties of EMC. The flexural modulus, thermal expansion coefficients in the glass state (${\alpha}_1$), and thermal conductivity of EMC were found to be keep constant value irrespective of the change of softening point, but Tg increased with softening point of epoxy resin, and the spiral flow decreased with that. It can be considered that these phenomena are due to the increase of crosslinking density of EMC according to the increase of softening point. The transition points were found out in the thermal expansion coefficient data in the rubbery state (${\alpha}_2$) and the flexural strength data. These can show the decrease of filler dispersion according to increase of epoxy resin viscosity.