• 한국염색가공학회지
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• 제35권4호
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• pp.274-283
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• 2023

Conductive polymers are polymers that conduct electricity like metal conductors. Unlike typical organic polymers, they are polymers that have the electrical, magnetic, and optical properties of metals or semiconductors. For Example, these conductive polymers include Polypyrrole (PPy), Polyaniline (PANI), and Polythiophene (PT). On the other hand, Insulating polymers do not conduct electricity well while providing insulation, which is the opposite of conductivity. With the exception of conductive polymers, most polymers are non-conductors. Insulating polymers include polyimide (PI), polystyrene (PS), and poly(vinyl alcohol) (PVOH, PVA, or PVAl). Although many different polymers exist, we have simply illustrated the properties and recent developments of conductive and insulating polymers, which have opposite properties.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.205-206
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• 2008

The transparent conductive film was prepared by bar coating method of poly (3, 4-ethylenedioxythiophene) (PEDOT) and poly (sodium 4-stylenesulfonate) grafted multi-walled carbon nanotubes (MWNT-PSS) nanocomposites solution on the polyethylene terephthalate (PET) film. In this case, multi-wall carbon nanotubes was treated by chemical methods to obtain water soluble MWNT-PSS and then blending with PEDOT. The non-covalent bonding of polymer to the MWNT surface was confirmed by Fourier transform infrared (FT-IR), thermal gravimetric analysis (TGA) and Transmission electro microscope (TEM) investigation also showed a polymer-wrapped MWNT structure. Furthermore, the electrical, transmission properties of the transparent conductive film were investigated and compared with control samples are raw PEDOT films.

• 마이크로전자및패키징학회지
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• 제14권1호
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• pp.33-38
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• 2007

본 실험에서는 Non-Conductive Adhesive (NCA) 와 고분자 범프를 이용한 COG (Chip-on-glass) 접합에 대하여 연구하였다. 산화막이 증착된 Si 기판 위에 고분자 범프를 사진식각 방법으로 형성하고, 고분자 범프 위에 직류 마그네트론 스퍼터링 방법으로 금속 박막층을 증착하였다. 기판으로는 Al을 증착한 유리기판을 사용하였다. 두 종류의 NCA를 사용하여 $80^{\circ}C$에서 하중을 변화시켜가며 접합을 실시하였다. 접합부의 특성을 평가하기 위하여 4단자 저항 측정법을 이용하여 접합부의 접속 저항을 측정하였으며, 주사전자현미경을 이용하여 접합부를 관찰하였다. 신뢰성은 $0^{\circ}C$ 와 $55^{\circ}C$ 사이에서 열충격 실험을 2000회까지 실시하여 평가하였다. 신뢰성 측정 전 접합부의 저항 값은 $70-90m{\Omega}$을 나타내었다. 200MPa 이상의 접합 압력에서는 고분자 범프가 NCA 의 필러 파티클에 의해 손상된 것을 관찰하였다. 신뢰성 측정 후 일부 범프가 fail 되었는데 범프의 fail 원인은 범프의 윗부분보다 상대적으로 금속층이 얇게 증착된 범프의 모서리 부분의 금속층의 끊어졌기 때문이었다.

• Composites Research
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• 제20권6호
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• pp.1-7
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• 2007

본 연구에서는 팽창흑연/탄소섬유 혼합 보강 전도성 고분자 복합재료를 2단계 성형 공법으로 제조하였으며, 탄소섬유의 첨가가 전도성 고분자 복합재료의 전기적, 기계적 특성에 미치는 영향을 고찰하였다. 전도성 충진재들은 고분자 수지와 기계적으로 혼합되었으며 이를 통하여 복합재료가 전기적 특성을 가지도록 하였다. 팽창흑연은 입자 간 접촉 면적이 넓기 때문에 복합재료 내 전도성 네트워킹의 형성에 매우 유리하지만, 팽창흑연과 고분자 수지만을 사용하여 상기 공정으로 복합재료를 제조할 경우 우수한 기계적 강도를 얻기가 어렵다. 따라서 이를 보완하기 위하여 탄소섬유를 복합재료에 첨가하였으며 전기적 기계적 물성을 바탕으로 탄소섬유의 혼합 비율을 최적화하였다. 굽힘 강도는 탄소섬유의 충친 비율이 증가할수록 섬유에 의한 강화 효과에 의하여 증가 하지만, 32wt.% 이상에서는 오히려 감소하였다. 이는 여분의 탄소섬유들이 공극을 발생시켜 응력집중이 발생하기 때문으로 판단된다. 전기 전도도는 탄소섬유의 비율이 증가할수록 전도성 공백이 발생하고 팽창흑연의 전도성 네트워킹이 저해되기 때문에 계속 감소한다.

• Composites Research
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• 제19권2호
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• pp.7-12
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• 2006

본 연구에서는 탄소섬유의 첨가가 흑연 보강 전도성 고분자 복합재료의 전기적, 기계적 특성에 미치는 영향을 고찰하였다. 압축성형법을 이용하여 흑연입자/탄소섬유 혼합 보강 전도성 고분자 복합재료를 제조하였으며 흑연입자의 고비율 충진은 복합재료 내에서 입자 사이의 직접 접촉을 통해 높은 전기 전도도(>100S/cm)를 얻는 것을 가능하게 하였다. 하지만 흑연입자의 비율이 높아짐에 따라 소재의 강도가 점차 떨어지게 되므로 이를 보완하기 위해 탄소섬유를 첨가하여 그에 따른 소재의 전기적, 기계적 특성 변화를 연구하였다. 탄소섬유의 충진 비율이 증가함에 따라 소재의 굽힘 강도는 증가하였으나 탄소섬유의 클러스터 형성으로 인해 탄소섬유 사이에 비전도성 영역이 발생하여 복합재료의 전기 전도도는 감소함을 확인하였다. 탄소섬유의 충진 비율이 전체 시스템의 20wt.%인 경우에는 굽힘 강도는 12% 증가한 반면 전기 전도도가 27% 감소하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• 한국재료학회지
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• 제30권10호
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• pp.522-532
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• 2020

Conductive polymer composites with high electrical and mechanical properties are in demand for bipolar plates of phosphoric acid fuel cells (PAFC). In this study, composites based on natural graphite/fluorinated ethylene propylene (FEP) and different ratios of carbon black are mixed and hot formed into bars. The overall content of natural graphite is replaced by carbon black (0.2 wt% to 3.0 wt%). It is found that the addition of carbon black reduces electrical resistivity and density. The density of composite materials added with carbon black 3.0 wt% is 2.168 g/㎤, which is 0.017 g/㎤ less than that of non-additive composites. In-plane electrical resistivity is 7.68 μΩm and through-plane electrical resistivity is 27.66 μΩm. Compared with non-additive composites, in-plane electrical resistivity decreases by 95.7 % and through-plane decreases by 95.9 %. Also, the bending strength is about 30 % improved when carbon black is added at 2.0 wt% compared to non-additive cases. The decrease of electrical resistivity of composites is estimated to stem from the carbon black, which is a conductive material located between melted FEP and acts a path for electrons; the increasing mechanical properties are estimated to result from carbon black filling up pores in the composites.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1666-1669
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• 2006

Plextronics develops conductive polymer technology (trademarked $Plexcore^{TM}$) that will enable the broad market commercialization of printed electronic devices. This talk will emphasize advances to our $Plexcore^{TM}$ HIL technology - a soluble non-acidic hole injection layer (HIL) technology for OLEDs . which is designed to dramatically improve device efficiency and lifetime of flat panel displays and solid state white-lighting.