• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.439-442
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• 2003

The test method of ASTM E 756 and JIS G 0602 to estimate vibration-damping properties is presented. Measurement method depending on specimen support, exciting method and calculation method for loss factor is used. Half-power bandwidth method and vibration decay method is used in the calculation method for loss factor, and Young's modulus is decided by geometric character and density for specimen and resonance frequency. Vibration measurement sensor is compared by using non-contact displacement detector, velocity detector and accelerometer. The cause of measurement error is also presented.

• 동력기계공학회지
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• 제13권1호
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• pp.33-38
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• 2009

In this study, the nose of cam in the automobile engine was modelled into circular disk to analyze the torsional vibration of the cam shaft. The distance between disks was fixed, but the diameter of disks was changed. The torsional vibration of the cam shaft was studied experimentally by the motion of the modelled disk with changing the disk diameter. And the sizes of the modelled disk were selected not to show the natural frequencies over all the experimental ranges. The torsional vibration meter used in this study has a laser system with non-contact measurement method, which can measure both torsional angular vibration velocity and torsional angular vibration displacement simultaneously. The Experimental analysis shows that the characteristics of the torsional vibration in the horizontal rotating shaft can be considerably affected by the arrangement of the modelled disks.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 춘계학술대회 논문집
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• pp.91-95
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• 1997

ESPI(Electronic Speckle Pattern Interferometry) is new optical measuring method to be able to measure the surface deformations of engineering components and materials in industrial areas. Conventional measuring method of surface deformation such as the strain gauge have many demerits because it is contact and point-to-point measuring one. But ESPI that is non-contact, whole field measuring method can overcome previous disadvantages. The speckle pattern to be formed with interference phenomena of scattering light from rough surfaces illuminated by laser light have phase information of surface In this study we used this interference phenomena and the phase shifting method to measure the in- plane deformation, together with the use of digital equipment to process the information contained in the speckle pattern and to display consequent inter ferograms. Finally we obtained good agreement between the experimenta results and those of FEM..

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 춘계학술대회 논문집
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• pp.408-413
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• 1995

Nowadays, manufacturing system is trending toward integrated circumstance by helping of CAD/CAM/CAT. To use this system effectively, it is necessary to get exact 3 dimensional surface data of an object. We have been using contact method to measure 3 dimensional object profile. But his method has demerit of leaving scrach or small distortion on the object. To improve this, a non-contact measuring method using optical system is adopted. In this paper, We propose optical ring method. Withthis system, We could measure displacement of the object in the range of 45mm having 150mm having 150 .mu. m resolution with no scratch or distortion.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 춘계학술대회 논문집
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• pp.61-67
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• 1997

The electronic speckle pattern interferometer (ESPI) has been applied to many technical problems such as deformation and displacement measurement, strain visualization and surface roughness monitoring. In this study, we used an ESPI system based on the dual beam speckle interferometer method in order to measure in-plane displacement and vibration mode using the ESIP technique. This research was carried out for the purpose of applying the vibration analysis method employing Electro-Optic holographic interference technique to the vibration analysis of uniform rectangular cantilevers plate(SS400,STS304) with cantilevers span to breadth ratio of 150 by 75. And thickness of 1mm and 0.8mm respectively. We improved the ESPI technique in order to obtain the distribution of displacement component resolved in one direction through a CCD camera combined with an image processing system. To certify and to assess the accuracy in measuring by this ESPI, the results obtained with the speckle method and vibration mode analysis are to be compared with those results by Warbuton's Theoretical expression and vibration made in FEM analysis.

• 한국정밀공학회지
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• 제26권1호
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• pp.97-104
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• 2009

There is a many kinds with nondestructive testing such as RT and UT representatively. Referred before two testing methods there is a limit which is spatial such as nuclear pipe, small vessel, sealing up vessel. So a new technique needs to overcome the limit which is spatial. shearography will be able to overcome the limit which is spatial. This paper introducing shearography which was known as non-contact full-field testing method and It is an interferometric technique for measurement of surface deformation such as displacement or displacement gradient. Also, a research about internal defect of the flange welding zone was accomplished. About variation with method pressurized with the Gaseous Nitrogen. Phase map where is various were measured according to changing a sheared direction, size of crack and loaded pressure. Consequently, crack quantitatively to be detected qualitatively was measured by using shearography.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1993년도 추계학술대회 논문집
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• pp.267-272
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• 1993

This paper presents the performance and problems in analysis method and testing system of Electronic Speckle Pattern Interferometry (ESPI) method, in measuring two-dimensional in-plane displacement. The anyalysis result of measurement by ESPI is quite comparable to that of measurement by strain gauge method. This implieds that the method of ESPI is a very effective tool in non-contact two-dimensional in-planc strain analysis. But there is a controversal point,measurment error. This error is discussed to be affected not by ESPI method itseif, but by its analysis scheme of the interference fringe,where the first-order interpolation has been applied to the points of strain measured. In this case, it is turned out that the more errors would be occured in the large interval of fringe. so, this paper describes a computer method for drawing when the height is available only for some arbitary collection of points, the method is based on a distance-weighted, least-squares approximation technique, with the weight varying with the distance of the data points.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2003년도 추계학술대회논문집
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• pp.700-703
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• 2003

The test method of ASTM E 756 and KS D 0076 to estimate vibration-damping properties is compared. Comparison method depending on specimen support, exciting method and calculation method for loss factor is used. Half-power bandwidth method and vibration decay method is used in the calculation method for loss factor, and Young's modulus is decided by geometric character and density for specimen and resonance frequency. Vibration measurement sensor is compared by using non-contact displacement detector, velocity detector and accelerometer. This paper is also presented the matter which is able to cause error in the measurement

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 추계학술대회
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• pp.1442-1447
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• 2003

Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

• 한국기계가공학회지
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• 제19권2호
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• pp.69-74
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• 2020

In this study, we proposed a method for surface profiling aspheric lens molds using a precision displacement sensor with a spatial scanning mechanism. The precision displacement sensor is based on the confocal principle using a broadband light source, providing a 10 nm resolution over a 0.3 mm measurable range. The precision of the sensor, depending on surface slope, was evaluated via Allan deviation analysis. We then developed an automatic surface profiling system by measuring the cross-sectional profile of a lens mold. The precision of the sensor at the flat surface was 10 nm at 10 ms averaging time, while 200 ms averaging time was needed for identical precision at the steepest slope at 25 deg. When we compared the measurement result of the lens mold to a commercial surface profiler, we found that the accuracy of the developed system was less than 90 nm (in terms of 3 sigmas of error) between the two results.