• Journal of the Korean Ceramic Society
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• v.46 no.5
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• pp.478-483
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• 2009

Thermal shock and hot corrosion resistance of silicon nitride ceramics are investigated in this study. Silicon nitrides are fabricated by nitride pressureless sintering (NPS) process, which process is the continuous process of nitridation reaction of Si metal combined with subsequent pressureless sintering. The results of thermal shock test show it sustains 400MPa of initial strength during test in the designated condition of ${\Delta}T=700{\sim}25^{\circ}C$ up to maximum 4,800 cycles. Hot corrosion tests also reveal that the strength degradation of NPS silicon nitride did not occur at $700^{\circ}C$ with an exposure in Ar, $H_2$, Na and K for 1,275 h.

• Journal of the Korean Ceramic Society
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• v.41 no.12 s.271
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• pp.893-899
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• 2004

The mechanical properties and microstructure and thermal properties of Nitrided Pressureless Sintering(NPS) silicon nitride ceramics, containing three type of $Al_{2}O_3,\;Y_{2}O_3$ sintering additives, were investigated. Also, we have investigated the effect of silicon metal content changing with 0, 5, 10, 15, and $20wt\%$ Si in each composition. In $5wt\%\;Al_{2}O_3,\;5wt\%\;Y_{2}O_3,\;and\;5wt\%$ Si composition, silicon nitride sintered body was successfully densified to a high density. The average 4-point flexural strength and relative density of these specimens were 500 MPa and 98% respectively. Also, Thermal expansion coefficient and thermal conductivity of specimens at room temperature were $2.89{\times}10^{-6}/^{\circ}C\;and\;28W/m^{\circ}C$, respectively. The flexural strength of sintered specimens after thermal shock test of 20,000 cycles was maintained as-received value of 500 MPa.

• Proceedings of the Korean Ceranic Society Conference
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• 2004.04b
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• pp.45.2-45.2
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• 2004

• Journal of the Korean Ceramic Society
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• v.42 no.1
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• pp.62-68
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• 2005

Oxidtion behavior of $Si_{3}N_{4}$ ceramics with the different porosity by the Nitrided Pressureless Sintering (NPS) were investigated in pure oxygen gas atmosphere at 1000 to $1300^{circ}C$. The thickness of formed oxide film on the surface of silicon nitride ceramics was increased with oxidation time and temperature. The oxide film thickness of 5A5Y5Si and 5A5Y10Si specimens for 100 h at 1300^{circ}C$ was about 10 $\mu$m and 20 $\mu$m, respectively. The oxidation of 5A5Y5Si and 5A5Y10Si specimens follows the parabolic behavior with an apparent activation energy of 215 kJ/mol and 104 kJ/mol, respectively. The flexural strength of 5A5Y5Si specimens after oxidation test for 500 h at 1300^{circ}C were maintained as-received value of 500 ma. On the other hand, that of 5A5Y10Si specimens were decreased about 100 MPa in as-received value.

• Proceedings of the Korean Ceranic Society Conference
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• 2003.10a
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• pp.118.2-118
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• 2003