• Journal of the Korean institute of surface engineering
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• v.29 no.6
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• pp.720-723
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• 1996

The behavior of electrodeposition of amorphous nickel-phosphorus has been studied from the point of deposition mechanism, kinetic parameters, morphology and formation of alloy films. The electorode reaction and electrode kinetics of deposition of nickel were significantly influenced by the content of phosphorus. The cathodic deposition of nickel-phosphorus alloy might be governed by the diffusion process of phosphorous acid. The direction of growth layer of the nickel-phosphorus alloy was different with substrate material. The formation of nickel-phosphorus alloy films was affected considerably by the solution compositions, electrolytic conditions and properties of the material as an underlayer.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.7
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• pp.621-628
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• 2009

Nickel-phosphorus alloys are attractive materials for diamond turning applications such as fabrication of large optics and other high precision parts. It is also well-known that the higher phosphorus content of the alloys minimizes the diamond tool wear. Due to the weakness of electoless nickel plating that the phosphorus contents is limited to 13-14% (wgt), increased attention has been paid at electro-nickel plating which enables the alloys with 15-16% phosphorus. In this study, experiments were carried out to observe the wear characteristic of single crystal diamond tools in micro-grooving of electro-nickel plated drums. The experiments shows that long distance (50km) machining of micro-grooving on electro-nickel plated drum is possible with a single crystal diamond tool without any significant tool wear and defective machined surface.

• Journal of the Korean Ceramic Society
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• v.26 no.1
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• pp.73-80
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• 1989

Preparation and characteristics of electroless Ni-P and Ni-B systems for semiconducting ceramics have been investigated as a function of deposit rate, reducing agent and pH variation. The effect of DMAB as ruducing agent is greater than that of sodium hypophosphite. The nickel electrode prepared from the nickel-phosphorus system with sodium hypophosphite shows low contact resistance of 0.99ohm compared with the resistance of 10chm in the electrode prepared from the nickel-boron system with DMAB. The contact resistance increases with increasing pH valuein the nickel-phosphorus system with sodium hypophosphite. The ratio of Ni to P is about 76.0/24.0 for the contact resistance of 0.99ohm in the above system.

• Journal of the Korean Electrochemical Society
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• v.3 no.4
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• pp.196-199
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• 2000

Electroless plating is the desirable surface treatment method which is being widely used to all kinds of material such as requiring corrosion resistance, wear resistance and conductivity, especially plating of nonconductive material. Electroless nickel deposit has particular characteristics including non-magnetic property, amorphous structure, wear resistance, corrosion protection and thermal stability. In this study, electroless nickel plating was studied with an change in hardness and corrosion resistance of electroless nickel-phosphorus deposit depending on heat treatment. The highest hardness value was obtained by heat treatment at $500^{\circ}C$ Corrosion resistance of deposit, which had been heated at $300^{\circ}C$, was excellent when it was immersed in 1M $H_2SO_4$ solution for 60 hrs.

• Journal of the Korean institute of surface engineering
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• v.33 no.2
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• pp.126-134
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• 2000

This study investigated the bath compositions and plating conditions and crystal structure used for achieving nickel-thallium-phosphorus deposits by means electroless plating. The electroless nickel-thallium-phosphorus deposits were achieved with a bath using sodium hypophosphite as the reducing agent and sodium citrate as the complexing agent. The depositing rate was 10.5mg.$cm^{2-1}$ .$hr^{-1 }$ from the optimistic bath composition, 0.1M nickel sulfate, 0.005M thallium sulfate, 0.2M sodium hypophosphite, and 0.05M sodium citrat and the recommended plating conditions, pH 5.5 and $90^{\circ}C$. The composition of alloy deposits determined by X-ray analysis (EDS) that the Thallium was increased with major increasing concentration of complexing agent and thallium ion in bath solution, it decreased according to the increasing concentrations of reduction agent in the bath solution, Bit Phosphorus showed a contrary to the thallium. It was observed from X-ray diffraction analysis, Scanning Electron Microscopy and Transmission Electron Microscopy. The crystalline structure of deposits was amorphous at the first deposited state but it was changed $Ni-T1-Ni_{5}$ $P_2$ polycrystalline when subjected to 1 hour heat treatment of more than $350^{\circ}C$. TEM observation demonstrated that the microstructure was identical to the result of the XRD at as deposited but it became $Ni-Tl-Ni_{5}$ $P_2$ polycrystalline when heated. And grain size was 10-50nm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.625-628
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• 1999

Recently. high-density printed circuit boards(PCB) become indispensable with the minaturization of components. Nickel is deposited on the copper patterns and followed by the gold deposition for improving connection reliability between the printed circuit boards and electronic components. Conventionally electrodeposition has been applied to metalization of copper patterns. However metalization by this method is not applicable for the isolated fine and concentrated patterns. Therefore, metalization technology of the fine patterns by electroless plating is required in place of electrodeposition. The application of electroless nickel plating for interconnection with solder strongly relies on the solderability and the interactions between nickel and solder. Factors such as phosphorus content of the deposit additive and bath temperature may influence solderability of the electroless nickel deposit. So solderability of electroless nickel/ gold deposits was investigated with substrates plated changing the condition of nickel solution.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.05a
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• pp.82-82
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• 1998

• Journal of the Korean institute of surface engineering
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• v.56 no.5
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• pp.299-308
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• 2023

In this study, phosphorus (P)-doped nickel cobaltite (P-NiCo₂O₄) and nickel-cobalt layered double hydroxide (P-NiCo-LDH) were synthesized on nickel (Ni) foam as a conductive support using hydrothermal synthesis. The thermal properties, crystal structure, microscopic surface morphology, chemical distribution, electronic state of the constituent elements on the sample surface, and electrical properties of the synthesized P-NiCo₂O₄ and P-NiCo-LDH samples were analyzed using thermogravimetric analysis-differential scanning calorimetry (TGA-DSC), X-ray diffraction (XRD), field-emission scanning electron microscopy (FE-SEM), energy dispersive X-ray spectroscopy (EDS), X-ray photoelectron spectroscopy (XPS), cyclic voltammetry (CV), galvanostatic charge-discharge (GCD), and electrochemical impedance spectroscopy (EIS). The P-NiCo₂O₄ electrode exhibited a specific capacitance of 1,129 Fg^-1 at a current density of 1 Ag^-1, while the P-NiCo-LDH electrode displayed a specific capacitance of 1,012 Fg^-1 at a current density of 1 Ag-1. When assessing capacity changes for 3,000 cycles, the P-NiCo₂O₄ electrode exhibited a capacity retention rate of 54%, whereas the P-NiCo-LDH electrode showed a capacity retention rate of 57%.

• Journal of the Korean institute of surface engineering
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• v.29 no.6
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• pp.714-719
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• 1996

For the fabrication of the circuits, contact or terminal areas are usually coated with nickel and gold. Usually, diluted palladium solution is applied to initiate electroless nickel plating on the copper circuits. However, the trace amounts of palladium remains on the resin and it causes the extraneous deposition. We confirmed that selectivity was greatly improved by the treatment with the strong reducing agents such as SBH or DMAB. Bondability was greatly influenced by the contents of phosphorus in the deposited nickel. Stabilizers in the electroless gold plating were also influenced the bonding strength. The baths containing cupferron or potassium nickel cyanide as a stabilizer showed superior bondability. The gold deposits having strong orientation with Au(220) and Au(311) showed good bond ability.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.43-48
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• 2011

Electroless nickel platings on carbon substrate were investigated for porous MCFC electrode applications. Acidic bath and alkaline bath were used in electroless nickel plating on carbon substrates. The rate of electroless plating in alkaline bath was faster than that in acidic bath. As pH was increased, the deposition rate was increased in both baths and the content of phosphorus in nickel deposit was decreased. The residual stresses of nickel deposit from acidic bath showed the compressive stress and on the other hand those from alkaline bath showed the high tensile stress. High tensile internal stress in nickel deposit caused the cracks over pH 11. Thiourea was added to both acidic and alkaline bath. The deposition rate of nickel was increased upto 0.5 ppm of thiourea and decreased. The maximum concentration of thiourea for the electroless nickel plating on carbon substrate was 1.5 ppm in both acidic and alkaline bath. Succinic acid was added to acidic bath. Addition of succinic acid up to 5 g/L increased the deposition rate of nickel and beyond which the deposition rate was decreased and maintained.