• Journal of the Korean Society for Precision Engineering
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• v.25 no.8
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• pp.88-95
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• 2008

Young's modulus of electroplated nickel thin film is systematically investigated using the resonance method of atomic force microscope. Thin layers of nickel to be measured are electroplated onto the surface of an AFM silicon cantilever and Young's modulus of plated nickel film is investigated as a function of process conditions such as the plating temperature and applied current density. It is found that Young's modulus of plated nickel thin film is as high as that of bulk nickel at low plating temperature or low current density, but decreases with increasing plating temperature or current density. The results imply that the plating rate increases as increasing the plating temperature or current density, therefore, slow plating rate produces a dense plating material due to the sufficient time fur nickel ions to form a dense coating.

• Journal of the Korean Graphic Arts Communication Society
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• v.29 no.3
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• pp.133-142
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• 2011

We produce a photosensitive convex plate to research a Nickel metal relief printing plate using galvanic process. A Method for preparing DLC convex plate that is metalized on Nickel metal relief printing plate using CVD(Chemical Vapor Deposition) process and $N_2DLC$-convex plate that is DLC metalized thin film layer of $N_2$ plasma surface treatment are comprised. DLC thin film layers on Nickel surface are fragile. The results of the research indicate that the coefficient of friction on DLC metalized thin film layer is relatively low than Nickel surface and the durability of Nickel surface coated DLC metalized thin film layer is superior to Nickel surface. A relative evaluation of three form plate wetting properties using varnish liquid-drop plate indicates superior printing aptitudes for $N_2DLC$, DLC, Nichel plate order as above.

• KIEE International Transactions on Electrophysics and Applications
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• v.4C no.5
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• pp.247-251
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• 2004

We report highly improved yield strength of nickel thin film, prepared using electroplating. The micro-scaled nickel cantilever is found to have significantly higher yield strength than bulk nickel. For the yield strength test, the heights of the micro-scaled cantilever were varied up to 60 ${\mu}{\textrm}{m}$ and electrostatic force was used for actuation. Stress of the bent cantilever was estimated using the FEM large deflection model. The yield strength of the thin nickel film is found to be over five times higher than that of the bulk nickel previously published. Results from this study indicate that metal microstructures can be used for MEMS applications requiring large deflection.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.163.2-163.2
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• 2010

In this work, nano-flake shaped nickel oxide (NiO) films were synthesized by chemical bath deposition technique for electrochemical capacitors. The deposition was carried out for 1 and 2 h at room temperature using nickel foam as the substrate and the current collector. The structure and morphology of prepared NiO film were characterized by X-ray diffraction (XRD) and scanning electron microscopy (SEM). And, electrochemical properties were characterized by cyclic voltammetry, galvanostatic charge-discharge, and AC impedence measurement. It was found that the NiO film was constructed by many interconnected NiO nano-flakes which arranged vertically to the substrate, forming a net-like structure with large pores. The open macropores may facilitate the electrolyte penetration and ion migration, resulted in the utilization of nickel oxide due to the increased surface area for electrochemical reactions. Furthermore, it was found that the deposition onto nickel foam as substrate and curent collector led to decrease of the ion transfer resistance so that its specific capacitance of a NiO film had high value than NiO nano flake powder.

• Journal of Korean Ophthalmic Optics Society
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• v.7 no.2
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• pp.155-161
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• 2002

We studied the formation of nickel nano thin film that have various electrochromic properties. Nickel thin film having various thickness will apply photoelectronic devices, specially, electrochromic devices. These devices will apply lens, battery, glass and solar cell that have light, thin, simple and small that applied nanotechnology and quantum dot. Nickel thin film was coated by electrochemical method on ITO electrode. We studied the thin film properties by Cyclic voltammetry, Chronoamperometry. Impedance. X-ray diffraction analysis and Atomic force microscopy.

• Composites Research
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• v.28 no.3
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• pp.94-98
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• 2015

This paper reports the effects of nickel film interleaves on the interlaminar shear strength(ILSS) of carbon fiber reinforced epoxy composites(CFRPs). A nickel thin film was deposited onto the prepreg by radio frequency(RF) sputtering at room temperature. The ILSS of the nickel film interleaved hybrid composites was increased compared to that of the composites without interleaves. To understand the mechanism of enhancement of the ILSS, the fracture surface of the tested specimens was examined by scanning electron microscopy(SEM). The metal interleaves were acted as a reinforcement for the matrix rich interface and the shear property of their composites improved by enhancing the resistance to matrix cracking.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1321-1325
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• 2003

Nickel thin film is one of the most important materials used in micromachined structure. To measure the mechanical properties of electroplated nickel thin film, two techniques are adopted and compared quantitatively with. One is nano-indentation test to measure the elastic modulus. The other is tensile test to measure not only elastic modulus but also yield strength and plastic deformation, ultimate strength. To perform the tensile test, the test apparatus was constructed with linear guided servo motor for actuation, load cell for force measurement and dual microscope for strain measurement.

• Journal of Korean Ophthalmic Optics Society
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• v.7 no.2
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• pp.163-167
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• 2002

Improved optical switching property of electrochromic nickel hydroxide/nickel glass thin film is reported. Nickel metal film was deposited on glass by e-beam evaporation before following electrochemical redox cycling to form nickel hydroxide for electrochromic activation. Without ITO (indium tin oxide) layer as electrical conductor, this electrode showed more rapid coloration rate than nickel hydroxide film on ITO substrate in the change of the electric voltage and optical transmittance. XPS analysis confirmed the existence of ultra-thin nickel metal layer (${\sim}10{\AA}$) between electrochemically grown nickel hydroxide and the glass substrate. It is concluded that the remained nickel metal nano-layer attribute to the conduction layer and the enhanced response time.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.287-292
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• 1999

This study is object to thermal analysis of continuous casting nickel-coated mold. A two-dimensional transient finite element model was developed to compute the temperature distribution and stress behavior for continuous casting nickel-coated mold. For thermal analysis using analysis result from FEM code. In other to thermal analysis of continuous casting nickel-coated mold, many variables such as casting speed, cooling condition, film coefficient, convection and load condition are considered.

• Journal of the Korean institute of surface engineering
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• v.25 no.3
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• pp.107-116
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• 1992

The optimum thickness of Pd-Ni plated layers used as an electrical contact film was investigated by evaluating mechanical, thermal and environmental characteristics. The variations of morphologies and chemical compositions were studied by using SEM, EDS and ESCA. As a result of wear test, the wear resistance behavior of the gold plated layers was not changed with the sliding velocity changes. The palladium-nickel plated layer showed better wear resistance than the gold plated layer at low sliding velocity, but it showed poor wear resistance at high sliding velocity. Under the thermal condition of $400^{\circ}C$ in air, the gold thickness of $2\mu\textrm{m}$ without underplate on phosphorous bronze formed copper oxide on the surface layer by rapid diffusion of copper whereas the gold thickness of $0.8\mu\textrm{m}$ deposited on nickel and palladium-nickel underplate was stable at $400^{\circ}C$. Under the sulfur dioxide environments, the gold thickness of $0.3\mu\textrm{m}$ deposited on the nickel thickness of$ 3\mu\textrm{m}$ and the palladium-nickel thickness of $2\mu\textrm{m}$ underplate was more corrosion-resistant than the gold thickness of $2\mu\textrm{m}$ without underplate on phosphorous bronze. Under the nitric acid vapor environment, corrosion resistance of the gold film was superior to an equivalent thickness of the palladium-nickel film.