• 통합자연과학논문집
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• 제4권2호
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• pp.130-136
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• 2011

This study investigated the adsorption characteristics of nickel, zinc and cadmium ions from the aqueous solution onto the alginate bead. Adsorption equilibrium capacities of the heavy metal ions increased with increasing initial pH of the solution. The adsorption equilibrium isotherm of the heavy metal ions was well represented by Langmuir equation. The magnitude of adsorption capacity of the heavy metal ions onto alginate bead was the order of cadmium > zinc > nickel. Kinetic parameters were measured in a batch adsorber to analyze the adsorption rates of the heavy metal ions. The internal diffusion coefficient of the heavy metal ions in the intraparticle were determined by comparing the experimental concentration curves with those predicted from the surface diffusion model (SDM) and pore diffusion model (PDM). The internal diffusion of the heavy metal ions in the intraparticles was explained by PDM.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.252.1-252.1
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• 2013

Hexagonal boron nitride (h-BN) is a two dimensional material which has high band-gap, flatness and inert properties. This properties are used various applications such as dielectric for electronic device, protective coating and ultra violet emitter so on. 1) In this report, we were growing h-BN sheet directly on sapphire 2"wafer. Ammonia borane (H3BNH3) and nickel were deposited on sapphire wafer by evaporate method. We used nickel film as a sub catalyst to make h-BN sheet growth. 2) During annealing process, ammonia borane moved to sapphire surface through the nickel grain boundary. 3) Synthesized h-BN sheet was confirmed by raman spectroscopy (FWHM: ~30cm-1) and layered structure was defined by cross TEM (~10 layer). Also we controlled number of layer by using of different nickel and ammonia borane thickness. This nickel film supported h-BN growth method may propose fully and directly growing on sapphire. And using deposited ammonia borane and nickel films is scalable and controllable the thickness for h-BN layer number controlling.

• 한국세라믹학회지
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• 제14권2호
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• pp.73-77
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• 1977

The surface diffusion coefficients for nickel, nickel oxide, cuppric oxide, cobalt oxide, alumina and ferric oxide have been determined at various temperatures using the sintering technique. This investigation is based on the model accounting for the sum of the contribution of volume and surface diffusion to the overall shrinkage rate during the initial stage of sintering. Simultaneous measurements of shrinkages and shrinkage rates of the materials compacts were conducted for various annealing times, the results of which were then correlated to the diffusion coefficient.

• 한국표면공학회지
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• 제15권3호
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• pp.146-151
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• 1982

The electrochemical reaction behavior of nickel electrode of the nickel-cadium battery system in potassium hydroxide solution has been studied by cyclic voltammetry, controlled potential electrolysis and X-ray diffraction method. It has been found that the reaction mechanism of positive nickel electrode for charging was assumed to be proten transfer step with a rate controlling diffusion process and char-ging state of positive electrode was amorphous $\beta$-NiOOH.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.1304-1309
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• 2004

Synthesis of carbon nanotubes and nanofibers on a catalytic metal substrate, using an ethylene fueled inverse diffusion flame, was investigated. Multi-walled carbon nanotubes, with diameters of 20 - 60nm, were formed on the substrate coated with nickel-nitrate in the region of 5 - 6mm from the flame center along the radial direction. The gas temperature for this region was ranging from about 1400 to 900K. Nickel particles originated from the coated nickel-nitrate on the substrate were the major catalyst for the formation of the nanomaterials. HR-TEM and Raman spectrum revealed that synthesized carbon nanotubes had multi-walled structures with some defective graphite layers at walls.

• 한국표면공학회지
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• 제23권3호
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• pp.173-182
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• 1990

In order to prevent the thermal and enviromenatal degradation of contact materials a nickel layer was plated as an undercoat of gold plating on the surface phosphorous bronze. The thickness of nikel and gold coating and chemical resistance of the coatings were measured at various conditions. Variation of morphology and chemical composition was studied by SEM, EDS and ESCA, respectively. Nickel layer was found to act as a thermal diffusion barrier and to retard the diffusion of copper from substrate to gold coating in the temperature $200^{\circ}C$~$400^{\circ}C$. below $200^{\circ}C$gold coated contacts showed a stable and low contanct resistance, while above $200^{\circ}C$ rapid diffusion of copper formed copper oxide on the surface layer and raised the contact resistance. With the nickel thinkness of abount 5$\mu$m as an undercoat the gold thinkness of $0.5\mu$m, showed satistactory (less than 1 m$\Omega$) contact resistance below 20$0^{\circ}C$ and corresponding gold thinkness increased to 1.0 m at $300^{\circ}C$~$400^{\circ}C$.

• Journal of Electrochemical Science and Technology
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• 제3권1호
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• pp.50-56
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• 2012

Nickel modified NiOOH electrodes were used for the electrocatalytic oxidation of ethanol in alkaline solutions where the methods of cyclic voltammetry (CV) and chronoamperometry (CA) were employed. In CV studies, in the presence of ethanol, an increase in the current for the oxidation of nickel hydroxide is followed by a decrease in the corresponding cathodic current. This suggests that the oxidation of ethanol is being catalysed through mediated electron transfer across the nickel hydroxide layer comprising of nickel ions of various valence states. Under the CA regime the reaction followed a Cottrellian behavior and the diffusion coefficient of ethanol was found to be $1{\times}10^7cm^2s^{-1}$.

• 한국표면공학회지
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• 제29권6호
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• pp.720-723
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• 1996

The behavior of electrodeposition of amorphous nickel-phosphorus has been studied from the point of deposition mechanism, kinetic parameters, morphology and formation of alloy films. The electorode reaction and electrode kinetics of deposition of nickel were significantly influenced by the content of phosphorus. The cathodic deposition of nickel-phosphorus alloy might be governed by the diffusion process of phosphorous acid. The direction of growth layer of the nickel-phosphorus alloy was different with substrate material. The formation of nickel-phosphorus alloy films was affected considerably by the solution compositions, electrolytic conditions and properties of the material as an underlayer.

• 한국기계가공학회지
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• 제14권2호
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• pp.25-30
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• 2015

This study involved the fabrication of precision machine tools using a polycrystalline diamond tip [sintered PCD and cemented carbide (WC-Co) tip] and WC-Co shanks via diffusion bonding with a paste-type nickel alloy filler metal. Diffusion bonding is a process whereby two materials are pressed together at high temperature and high pressure for a sufficient period of time to allow significant atomic diffusion to occur. For smooth progress, a filler metal of nickel alloy was used at the interface. Optical microscopy images were used to observe the copula of the bonded layer. It was confirmed that cracks occurred near the junction in all cases. The tensile strength of the bond was measured using a universal testing machine (UTM) with WC-Co proportional test specimens.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.260-260
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• 2009

In high-efficiency crystalline silicon solar cell, If high-efficiency solar cells are to be commercialized, It is need to develop superior contact formation method and material that can be inexpensive and simple without degradation of the solar cells ability. For reason of plated metallic contact is not only high metallic purity but also inexpensive manufacture. It is available to apply mass production. Especially, Nickel, Copper are applied widely in various electronic manufactures as easily formation is available by plating. Ni is shown to be a suitable barrier to Cu diffusin as well as desirable contact metal to silicon. Nickel monosilicide has been suggested as a suitable silicide due to its lower resistivitym lower sintering temperature and lower layer stress than $TiSi_2$. In this paper, Nickel as a seed layer and diffusion barrier is plated by electroless plating to make nickel monosilicide.