• Title/Summary/Keyword: Nickel Electroless Plating

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Fabrication and Microstructure of Metal-Coated Carbon Nanofibers using Electroless Plating (무전해 도금을 이용한 금속 코팅된 탄소나노섬유의 제조 및 미세조직)

  • Park, Ki-Yeon;Yi, Sang-Bok;Kim, Jin-Bong;Lee, Jin-Woo;Lee, Sang-Kwan;Han, Jae-Hung
    • Composites Research
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    • v.20 no.5
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    • pp.43-48
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    • 2007
  • The absorption and the interference shielding of electromagnetic wave have been very important issues for commercial and military purposes. The stealth technique is one of the most typical applications of electromagnetic wave absorption technology. This study has started for the development of composite fillers containing dielectric and magnetic lossy materials. To improve the electromagnetic characteristics of conductive nano fillers, carbon nanofibers (CNFs) with nickel-phosphorous (Ni-P) or nickel-iron (Ni-Fe) have been fabricated by the electroless plating process. Observations by the electron microscopy (SEM/TEM) and element analyzer (EDS/ELLS) showed the uniform Ni-P and Ni-Fe coated CNFs. The compositions of the plating layers were about Ni-6wt%P and Ni-70wt%Fe, respectively. The average thicknesses of the plating layers were about $50\;{\sim}\;100\;nm$.

Electroless Nickel-Boron Plating on p-type Si Wafer by DMAB (DMAB에 의한 P형 실리콘 기판 무전해 니켈-붕소 도금)

  • 김영기;박종환;이원해
    • Journal of the Korean institute of surface engineering
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    • v.24 no.4
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    • pp.206-214
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    • 1991
  • In the basic study of selective electroless Ni plating of Si wafers, plating rate and physical properties are investigated to obtain optimum conditions of contact hole filling. Si wafers are excellently activated in the concentration of 0.5M IF, 1mM PdCl2, 2mM EDTA at $70^{\circ}C$, 90sec. The optimum condition of Ni-B deposition on p-type Si wafers is 0.1M NiSO4, 0.11M Citrate, $70^{\circ}C$, pH6.8, 8mM DMAB. The main factor in the sheet resistences variation of films is amorphous and on heat treating matrix was transformed into a stable phase (Ni+Ni3B) at $300-400^{\circ}C$. But pH or DMAB concentration in the plating solution doesn't play role of heat-affected phase change.

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Improvement of Plating Characteristics Between Nickel and PEEK by Plasma Treatment and Chemical Etching

  • Lee, Hye W.;Lee, Jong K.;Park, Ki Y.
    • Corrosion Science and Technology
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    • v.8 no.1
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    • pp.15-20
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    • 2009
  • Surface of PEEK(poly-ether-ether-ketone) was modified by chemical etching, plasma treatment and mechanical grinding to improve the plating adhesion. The plating characteristics of these samples were studied by the contact angle, plating thickness, gloss and adhesion. Chemical etching and plasma treatment increased wettability, adhesion and gloss. The contact angle of as-received PEEK was $61^{\circ}$. The contact angles of chemical etched, plasma treated or both were improved to the range of $15{\sim}33^{\circ}$. In the case of electroless plating, the thickest layer without blister was $1.6{\mu}m$. The adhesion strengths by chemical etching, plasma treatment or both chemical etching and plasma treatment were $75kgf/cm^2$, $102kgf/cm^2$, $113kgf/cm^2$, respectively, comparing to the $24kgf/cm^2$ of as-received. In the case of mechanically ground PEEKs, the adhesion strengths were higher than those unground, with the sacrifice of surface gloss. The gloss of untreated PEEK were greater than mechanically ground PEEKs. Plating thickness increased linearly with the plating times.

The Effect of Complexing Agents on the Deposit Characteristics in the Electroless Nickel-Tungsten-Phosphorus Plating (무전해 Ni-W-P 도금에서 착화제의 종류가 피막특성에 미치는 영향)

  • Cho, Jin Ki;Park, Sang Wook;Kang, Seung Goon;Son, Seong-Ho
    • Korean Journal of Metals and Materials
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    • v.46 no.11
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    • pp.725-729
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    • 2008
  • Deposition characteristics of electroless plated Ni-W-P films were investigated for various complexing agents. Used complexing agents are sodium citrate, sodium gluconate and sodium malonate. In this study, the existing mixed potential theory could explain the overall mechanism of Ni-W-P electroless plating for all complexing agents. The deposition rate could be also expected by the theory. The deposited Ni-W-P films were evaluated in term of surface hardness and corrosion resistance. Microhardness of the deposit increased about 1,000 Hv after heat treatment for one hour at $400^{\circ}C$, because it was above the crystallization temperature of $Ni_3P$. The deposited Ni-W-P films can exhibit excellent corrosion resistance in using sodium malonate as a complexing agent, the other hand the using sodium gluconate was the worst corrosion resistance. The worst corrosion resistance was due to a large number of nano-sized pin-holes or small pores. The plating current at the mixed potential increases when the using sodium malonate as a complexing agent, it was explained by the cross section.

Preparation of Ni-PTFE Electrode using Nickel Plating for Alkaline Fuel Cell (니켈도금기술을 이용만 알칼리형 연료전지용 Ni-PTFE전극의 개발)

  • Kim, Jae-Ho;Lee, Young-Seak
    • Transactions of the Korean hydrogen and new energy society
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    • v.20 no.4
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    • pp.291-299
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    • 2009
  • Ni-plated polytetrafluoroethylene(Ni-PTFE) particles($25{\mu}m$, $500{\mu}m$) were prepared by using nickel electroless plating. The Ni content in Ni-PTFE particles increased with increasing the amount of reduction agent. At about 53 wt% Ni content, $25{\mu}m$ Ni-PTFE particles showed conductivity of 320S/m. The Ni-PTFE particles were formed into the Ni-PTFE plate using heat treatment at $350^{\circ}C$ under $10{\sim}1000kg/cm^2$. The Ni-PTFE plate displayed the high conductivity of 5100S/m due to the formation of 3-dimentional Ni network. The plate was used as an electrode in an alkaline fuel cell(AFC). In terms of the current density, the Ni-PTFE electrode having higher Ni content(53 wt%) showed improved performance.

Residual Strain Characteristics of Nickel-coated FBG Sensors (니켈이 코팅된 FBG 센서의 잔류 변형률 특성)

  • Cho, Won-Jae;Hwang, A-Reum;Kim, Sang-Woo
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.41 no.7
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    • pp.613-620
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    • 2017
  • A metal-coated FBG (fiber Bragg grating) sensor has a memory effect, which can recall the maximum strains experienced by the structure. In this study, a nickel-coated FBG sensor was fabricated through electroless (i.e., chemical plating) and electroplating. A thickness of approximately $43{\mu}m$ of a nickel layer was achieved. Then, we conducted cyclic loading tests for the fabricated nickel-coated FBG sensors to verify their capability to produce residual strains. The results revealed that the residual strain induced by the nickel coating linearly increased with an increase in the maximum strain experienced by the sensor. Therefore, we verified that a nickel-coated FBG sensor has a memory effect. The fabrication methods and the results of the cycle loading test will provide basic information and guidelines in the design of a nickel-coated FBG sensor when it is applied in the development of structural health monitoring techniques.

Feasible waste liquid treatment from electroless nickel-plating by intense magnetic field of HTS bulk magnets

  • Oka, T.;Furusawa, M.;Sudo, K.;Dadiel, L.;Sakai, N.;Seki, H.;Miryala, M.;Murakami, M.;Nakano, T.;Ooizumi, M.;Yokoyama, K.;Tsujimura, M.
    • Progress in Superconductivity and Cryogenics
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    • v.23 no.3
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    • pp.37-40
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    • 2021
  • Nickel (Ni) is a kind of the rare earth resources. Since Ni-containing waste is drained after several plating operations in the factories, the effective recycling technique has been expected to be introduced. An actual magnetic separation technique using HTS bulk magnet generating the strong magnetic field has succeeded in collecting the paramagnetic slurry containing Ni-sulphate coarse crystals which were fabricated from the Ni-plating waste. The Ni compound in the collected slurry was identified as NiSO4/6H2O, showing slight differences in the particle size and magnetic susceptibility between the samples attracted and not-attract to the magnetic pole. This preferential extraction suggests us a novel recycling method of Ni resource because the compound is capable of recycling back to the plating processes as a raw material.