• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.384.1-384.1
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• 2014

대면적 그래핀을 합성하는 방법으로 주로 화학기상증작법, SiC 기판을 고온 열처리하는 방법 그리고 최근에는 고체소스를 활용하여 그래핀을 합성하는 방법 등이 보고되고 있다. 이에, 본 연구에서는 폴리머 용액들을 원하는 기판에 스핀코팅하여 건조시킨 후, 후 열처리 공정을 통해 그래핀을 합성하고 물성을 평가해보았다. 그래핀 합성을 위해서 사용된 폴리머 탄소원은 Vinyl계 폴리머 용액으로, polystyrene (PS), polyacrylonitrile (PAN), 그리고 polymethylmetacrylate (PMMA) 등으로 2wt%의 폴리머 용액을 $SiO_2$기판에 스핀 코팅을 하고, 그 위에 Nickel이나 Copper와 같은 catalytic metal을 capping layer로 증착하고, 고진공에서 후열처리 공정에 의해 그래핀을 성장하였다. 이때, 탄소원으로 쓰인 PS, PMMA 폴리머는 pristine graphene 합성을 위해, PAN 폴리머는 질소가 도핑된(n-type) 그래핀 합성을 위해 사용되었다. 그래핀의 물성은 폴리머 종류, 코팅된 두께, 촉매 금속층 종류와 두께, 그리고 후열처리 공정 온도와 시간에 따라서 조절이 가능하였다. 우리는 Raman spectroscopy, AFM, SEM 등을 활용하여 그래핀의 층수, 결함, 표면양상 등을 평가하였고, 또한 전사된 그래핀을 기반으로 제작된 FET의 게이트 전압에 따른 I-V 곡선을 측정하여 캐리어 종류 및 전하 이동도 등을 평가하였다. 더욱 상세한 내용은 프레젠테이션에서 논하겠다.

• Korean Chemical Engineering Research
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• v.58 no.2
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• pp.301-306
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• 2020

We investigated the individual biosorption removal of lead, copper, and nickel ions from aqueous solutions using Chara sp. algae powder in a batch mode. The impact of several parameters, such as initial concentration of the metal ions, contacting time, sorbent dose, and pH on the removal efficiency, was investigated. The maximum removal efficiency at optimum conditions was found to be 98% for Pb(II) at pH = 4, 90% for Cu(II) at pH = 5, and 80% for Ni(II) at pH = 5. The isotherm study was done under the optimum conditions for each metal by applying the experimental results onto the well-known Freundlich and Langmuir models. The results show that the Langmuir is better in describing the isotherm adsorption of Pb(II) and Ni(II), while the Freundlich is a better fit in the case of Cu(II). Similarly, a kinetic study was performed by using the pseudo-first and second-order equations. Our results show that the pseudo-second-order is better in representing the kinetic adsorption of the three metal ions.

• Journal of the Korean Chemical Society
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• v.43 no.5
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• pp.511-516
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• 1999

Shiff Base ligand such as [NOIPH] have been synthesized from 2-hydroxy-1-naphthaldehyde and arometic amine. Co(II), Ni(II), and Cu(II) complexes from the reaction metal salts with Tridentate Schiff Base [NOIPH] were sythesized. The ligand and metal(II) complexes were characterized by the elementary analysis, IR, UV-Vis, NMR spectra, and thermogravimetric analysis. Metal(II) complexes in solid state have been shown that the mole raio of Schiff base [NOIPH] as $N_2O$ type to Metal(II) is 2:1 and the metal(II) complexes of $N_2O$ ligand type were four-coordinated configuration.

• Korean Journal of Materials Research
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• v.25 no.11
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• pp.642-646
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• 2015

Super alloys, which can be divided into three categories, i.e. Ni-base, Co-base, and Fe-base alloys, are widely used for high temperature applications. Since superalloys contain many alloying elements and precipitates, their chemistry and processing parameters need to be carefully designed. In this study, we designed a new Ni alloy to prevent corrosion due to water vapor and gases at high temperatures. The new alloy was designed using the theoretical value of the resulting energy electronic state calculation($DV-X{\alpha}$ method). The components that were finally used were Cr, Mo, and Ti, with Ni as a base. For these alloys, elements were selected in order to compare their values with that of the average theoretical basis for an Inconel 625 alloy. Finally, two kinds of Ni alloy were designed: Ni-28Cr-4Mo-2Ti and Ni-20Cr-10Mo-1Ti.

• Journal of the Korean institute of surface engineering
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• v.30 no.4
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• pp.262-271
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• 1997

Nickel-matal hydride(Ni-MH) batteries are receiving attention as non-pollunting. high performance rehargeable energy stoage system. The performance of Ni-Mh is significantly influenced by the hydrogen storage alloy materiels used as an anode material. Recently, having discharge capacities higher than the $AB_5$-type hydrogen storage alloys, the Zr-based $AB_2$-Type hydrogen storage alloys has remaining problems regarding cycle life and self-dischareg. These problems need to be solved by improvements in the alloy design and/or surface treatment. This work investiggates the effects the effects of surface property by fluorination on $Zr_{0.7}Ti_{0.3}V_{0.4}Mn_{0.4}Ni{1.2}$ composittion $AB_2$-Type hydrogen storage alloys. EPMA, SEM and AES techniques were used for surface analysis, and the crystal structure was characterized by constant current cycling test and potential sweep methods. Fluorination was found to be effective when La-was incorporated into the alloy, and has unique morphology, higher reactivity, and at the same time formed a protective film. Through, fluorination, the cycle life of an electrode was found to increase significantly, charge/discharge characteristics of the electrode the potential difference between the charge/discharge plateau, i.e polarization(overpotential)were improved.

• Ocean and Polar Research
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• v.23 no.1
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• pp.51-62
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• 2001

The Arctic consists of numerous sedimentary basins containing voluminous natural resources and two of the world's major oil and gas producing areas. The western Siberia Basin in the Arctic region has the largest petroliferous province with an area of 800 ${\times}$ 1,200 km and produces more than 60% of total Russian oil production. The North Slope of Alaska produces about 20% of the U.S. output, i.e., 11% of the total U.S. consumption. Being small compared to those regions, the Canadian Northwest Territories and the Pechora Basin in Russia produce only fair amount of oil and natural gas. There are also many promising areas in the northern continental shelf of Russia. In addition to Russia, Svalbard and Greenland have been investigated for oil and gas. Gas hydrates are widespread in both permafrost regions and arctic continental shelf areas. The reserves of gas hydrates in the Arctic Ocean are about 20${\sim}$32% of total estimated amounts of gas hydrates in the world ocean. Mineral mining is well developed, especially in Russia. The major centers are located around the Kuznetsk Basin and Noril'sk. They are major suppliers of gold, tin, nickel, copper, platinum, cobalt, iron ore, coal as well as apatite. There are also some minings of lead-zinc in Alaska and Arctic Canada.

• Carbon letters
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• v.7 no.1
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• pp.1-8
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• 2006

The activated carbon "C" was obtained by carbonization followed by activation with steam at 40% of burn-off. Oxidized carbons C-N, C-P and C-H were obtained by oxidizing the activated carbon C with concentrated nitric acid, ammonium peroxysulfate and hydrogen peroxide, respectively. The textural properties of the carbons were determined from nitrogen adsorption at 77 K. The acidic surface functional groups were determined by pH titration, base neutralization capacity and electrophoretic mobility measurements. The cation exchange capacities of un-oxidized and oxidized carbons were determined by the removal of Cu(II) and Ni(II) from their aqueous solutions. The surface area and the total pore volume decreased but the pore radius increased by the treatment of activated carbon with oxidizing agents. These changes were more pronounced in case of oxidation with $HNO_3$. The surface pH of un-oxidized carbon was basic whereas those of the oxidized derivative were acidic. The removal of Cu(II) and Ni(II) was pH dependent and the maximum removal of the both ions was obtained at pH of 5-6. Cu(II) was more adsorbed, a phenomenon which was ascribed to its particular electronic configuration.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2004.03a
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• pp.327-334
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• 2004

Spectroscopic and electrostatic probe measurements were made to examine plasma characteristics with or without a metal plate for a 10-㎾-class direct-current arcjet Heat fluxes into the plate from the plasma were also evaluated with a Nickel slug and thermocouple arrangement. Ammonia and mixtures of nitrogen and hydrogen were used. The NH$_3$ and $N_2$+3H$_2$ plasmas in the nozzle and in the downstream plume without a plate were in thermodynamical nonequilibrium states. As a result, the H-atom electronic excitation temperature and the $N_2$ molecule-rotational excitation temperature intensively decreased downstream in the nozzle although the NH molecule-rotational excitation temperature did not show an axial decrease. Each temperature was kept in a small range in the plume without a plate except for the NH rotational temperature for NH$_3$ gas. On the other hand, as approaching the plate, the thermodynamical nonequilibrium plasma came to be a temperature-equilibrium one because the plasma flow tended to stagnate in front of the plate. The electron temperature had a small radial variation near the plate. Both the electron number density and the heat flux decreased radially outward, and an increase in H$_2$ mole fraction raised them at a constant radial position. In cases with NH$_3$ and $N_2$+3H$_2$ a large number of NH radical with a radially wide distribution was considered to cause a large amount of energy loss, i.e., frozen flow loss, for arcjet thrusters.