• Korean Journal of Materials Research
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• v.12 no.12
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• pp.955-961
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• 2002

2.7vol%TiNi/6061 Al composites with TiNi shape memory alloy as reinforcement were fabricated by vacuum hot press. It was investigated by OM, SEM, EPMA and XRD analysis for the behavior of diffusion layer formation on various heat treatment condition. Thickness of diffusion layer was increased proportionally according to heat treatment time. The layer was formed by the mutual diffusion of TiNi and Al. The diffusion rate from TiNi fiber to Al matrix was faster than that of reverse diffusion path. The more diffused layer was formed in Al matrix. The diffusion at interface layer was consisted of $A1_3$Ti, $Al_3$Ni analyzed by EPMA, XRD results.

• Transactions of Materials Processing
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• v.26 no.4
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• pp.216-221
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• 2017

Recently, interest in multifunctional energetic structural materials (MESMs) has grown due to their multifunctional potential, especially in military applications. However, there are few studies about extrinsic factors that govern the reactivity of MESMs. In this paper, a shock compaction process was performed on the nano Ni/Al-mixed powder to investigate the effect of particle size on the shock reaction condition. Additionally, heating the statically compacted specimen was also performed to compare the mechanical properties and microstructure between reacted and unreacted material. The results show that the agglomerated structure of nanopowders interrupts the reaction by reducing the elemental boundary. X-ray diffraction analysis shows that the NiAl and $Ni_3Al$ intermetallics are formed on the reacted specimen. The microhardness results show that the $Ni_3Al$ phase has a higher hardness than NiAl, but the portion of $Ni_3Al$ in the reacted specimen is minor. In conclusion, using Ni/Al composites as a reactive material should focus on energetic use.

• Korean Journal of Materials Research
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• v.2 no.4
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• pp.306-310
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• 1992

Effects of hafnium, boron and zirconium on the ductility of Ni$_3$(Al, Fe) intermetallic compounds were studied using tensile test and SIMS analysis. Ni$_3$(Al, Fe) alloy with 0.1 at.% Hf, 0.05 at.% B and 0.1 at.% Zr additions showed maximum elongations of about 30% at 300K, 10% at 300K and 14% at 473K, respectively. The fracture mode of the alloy without the additive was the mixture of intergranular and transgranular fractures, but the addition of Hf, Zr or B changed the fracture mode to transgranular only. SIMS analysis showed that the beneficial effects of Hf, Zr or B segregation on the grain boundary strength are consistent with the grain boundary cohesion theory.

• Journal of the Korean Society for Heat Treatment
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• v.33 no.1
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• pp.1-12
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• 2020

In this study, thin foil fabrication using Ni/Ni₃Al single crystal was performed by cold-rolling. It was found that the cold-rolling behavior was strongly dependent on the initial crystallographic orientation rather than morphology of Ni₃Al precipitates. The deformation banding was formed in the case of (100)[001]- and (210)[001]-oriented specimens at 83% reduction in thickness. However, the effects of Ni₃Al precipitates morphology on the microstructure evolution of Ni/Ni₃Al single crystals during cold-rolling were not so serious comparing with the effects of initial crystallographic orientation. Therefore, it could be concluded that the deformation behavior of Ni/Ni₃Al single crystals at serious strain level was strongly dependent on the initial crystallographic orientation rather than the morphology of Ni₃Al precipitates, whereas the initial deformation behavior was related to both crystallographic orientation and the morphology of Ni₃Al precipitates.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2004.04a
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• pp.42-43
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• 2004

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1993.11a
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• pp.28-28
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• 1993

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1993.11a
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• pp.29-29
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• 1993

• Proceedings of the Korean Vacuum Society Conference
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• 2002.02a
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• pp.72-73
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• 2002

• Journal of the Korean institute of surface engineering
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• v.24 no.2
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• pp.103-113
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• 1991

Electroless Ni-Cu-P alloy plating of Al base hard disk was performed to investigate some properties according to the change of composition. It was found that the composition of Ni and Cu in deposits changed linearly with increasing the mole ratio of NiSO4.6H2O/CuSO4.5H2O. The increase in hardness by heat - treatment was confirmed to be associated with small size grained crystallization of the amorphous deposits. Acid resistance of all deposits layer. which had been heated up to 30$0^{\circ}C$, was found to be exellent when immersed in 1N-H2SO4 solution, and it showed more superior acid resistance with decreasing Cu content and with increasing P. The resistivity of the deposits heat treated became smaller at temperature more than 50$0^{\circ}C$, and it became largerly with increasing P content. Cu 44.1wt% alloy(C bath) showed the most superior non-magnetically stable characteristics after heat treatment. It was superiorly with higher temperature and with decreasing P content.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.