• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.342-342
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• 2010

We have investigated an Au intercalated monolayer graphene on Ni(111) using angle-resolved photoemission spectroscopy (ARPES), high resolution photoemission spectroscopy (HRPES), and low energy electron diffraction (LEED) at the 3A2 ARUPS beamline in Pohang Accelerator Laboratory. We find the monolayer graphene is well grown on the Ni(111) surface by the adsorption of acetylene. However, the graphene does not show the characteristic $\pi$ band near the Fermi level due to its strong interaction with the underlying substrate. When Au is adsorbed on the surface and then annealed at high temperature, we observe that Au is intercalated underneath the monolayer graphene. The process of the Au intercalation was monitored by HRPES of corresponding Au 4f and C 1s core levels as well as the electronic structure of the $\sigma$, $\pi$ states at $\Gamma$, K points. The $\sigma$, $\pi$ bands of graphene shift towards the Fermi level and the $\pi$ band is clearly observed at K point after the intercalation of full monolayer Au. The full width at half maximum (FWHM) of the C 1s peak narrows to approximately 0.42 eV after intercalation. These results imply that the interaction between the graphene and substrate is considerably weakened after the Au intercalation. We will discuss the graphene is really closer to ideal free standing graphene suggested recently.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1889-1892
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• 2003

The fabrication of micro-size patterning on alumina substrate is generated by laser direct writing, which has high precision and selectivity of various laser beam energies. The depth and width of patterns is affected by laser parameter such as laser power, scan rate. Through the chemical and mechanical polishing Pd seeds was effectively got rid of alumina substrate for selectivity electroless Ni plating. Thermal treatment is good method for changing electrical property of conductor line, because the treatment can control of the grain size.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.87-90
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• 2007

VIATRON TECHNOLOGIES has developed an $\underline{A}$tmospheric $\underline{M}$etal $\underline{D}$oping (AMD) system which uniformly dopes metal species onto a substrate. The AMD system injects metal-organic vapor over substrate using an injection head with a scan motion. One of important application of this system is a metalinduced crystallization of amorphous Si for manufacturing AMOLED poly-Si panels. The AMD system with a use of Ni vapor source produces doping of trace amount of Ni onto amorphous Si, enabling uniform MIC crystallization. Also, the operation without vacuum condition offers advantages such as easy maintenance, low cost production, and large glass processes.

• Journal of Power System Engineering
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• v.18 no.6
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• pp.40-44
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• 2014

The purpose of this paper is to investigate polarization characteristics of WC-based alloy coatings in alkaline solution. The coatings were fabricated with WC-CrC-Ni, WC-Co-Cr and WC-Co composite powders by HVOF process. Corrosion tests of coatings and substrate were carried out using potentiostat/galvanostat at solution with pH 8 and pH 13. Corrosion potential(Ecorr) and corrosion current density(Icorr) could be studied from polarization curve, and corrosion behavior was analyzed by SEM and EDS. WC-Co-Cr coating and WC-CrC-Ni coating showed more favorable anti-corrosion characteristics than WC-Co coating and substrate at solution with pH 8 and pH 13.

• Journal of Hydrogen and New Energy
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• v.31 no.1
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• pp.23-32
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• 2020

The intermittent characteristics of renewable energy complicates the process of balancing supply with demand. Electrolysis technology can provide flexibility to grid management by converting electricity to hydrogen. Alkaline electrolysis has been recognized as established technology and utilized in industry for over 100 years. However, high overpotential of oxygen evolution reaction in alkaline water electrolysis reduces the overall efficiency and therefore requires the development of anode catalyst. In this study, Raney Ni-Zn-Fe electrode was prepared by electroplating and the electrode characteristics was studied by varying electroplating parameters like electrodeposition time, current density and substrate. The prepared Raney Ni-Zn-Fe electrode was electrochemically evaluated using linear sweep voltammetry. Physical and chemical analysis were conducted by scanning electron microscope, energy dispersive spectrometer, and X-ray diffraction. The plating time did not changed the morphology and composition of the electrode surface and showed a little effect on overpotential reduction. As the plating current density increased, Fe content on the surface increased and cauliflower-like structure appeared on the electrode surface. In particular, the overpotential of the electrode, which was prepared at the plating current density of 320 mA/㎠, has showed the lowest value of 268 mV at 50 mA/㎠. There was no distinguishable overpotential difference between the type of substrate for the electrodes prepared at 80 mA/㎠.

• Journal of Hydrogen and New Energy
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• v.21 no.6
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• pp.500-506
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• 2010

The metal monolith catalyst coated with 15wt% Ni/$MgAl_2O_4$ is applied to the natural gas steam reforming for hydrogen production. To address the improvement of adherence between metal monolith and catalyst coating layer, the pre-calcination temperature as well as the coating conditions of $Al_2O_3$ sol are optimized. When the Fe-Cr alloy monolith is pre-calcined at $900^{\circ}C$ for 6 h, $Al_2O_3$ layer was formed uniformly on the entire surface of the metal substrate. It is seen that the formation of $Al_2O_3$ layer on the monolith surface is essential for the uniform coating of $Al_2O_3$ sol onto the monolith substrate. The monolith catalyst coated with 10wt% $Al_2O_3$ sol shows high $CH_4$ conversion and good thermal stability as compared with the monolith catalyst without $Al_2O_3$ sol coating under severe reaction conditions with high GHSV of 30,000 $h^{-1}$ at $700^{\circ}C$. In addition, the metal monolith catalyst shows higher catalytic activity and better thermal conductivity than 15wt% Ni/$MgAl_2O_4$ pellet catalyst.

• Progress in Superconductivity
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• v.7 no.1
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• pp.69-76
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• 2005

Complex single buffer composed of yttrium and samarium oxide was deposited on the metallic substrates by MOCVD (metal organic chemical vapor deposition) method using single liquid source. Two different types of the substrates with in-plane textures of about $8{\sim}10$ degree of Ni and $3at.\%W-Ni$ alloy were used. Y(tmhd: 2,2,6,6-tetramethyl-3,5-heptane dionate)$_3$:Sm(tmhd)$_3$ of liquid source was adjusted to 0.4:0.6 to minimize the lattice mismatch between the complex single buffer and the YBCO. The epitaxial growth of $(Y_{x}Sm_{1-x})_{2}O_3$ was achieved at the temperature higher than $500^{\circ}C$ in $O_2$ atmosphere. However, it was found that the formation of NiO accelerated with increasing deposition temperature. By supplying $H_{2}O$ vapor, this oxidation of the substrate could be suppressed throughout the deposition temperatures. We could get the epitaxial growth on pure Ni substrate without the formation of NiO. The competitive (222) and (400) growths were observed at the deposition temperatures of $650\~750^{\circ}C$, but the (400) growth became dominant above $800^{\circ}C$. The $(Y_{x}Sm_{1-x})_{2}O_3$-buffered metallic substrates can be used as the buffer for YBCO coated conductor.

• Journal of the Korean Society for Heat Treatment
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• v.24 no.5
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• pp.243-250
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• 2011

When alloys are vacuum-deposited on cooled substrates, super-rapidly cooled alloy films in the unequilibrium state can be obtained. As an application of this method, Ag-Cu, Ag-Ni and Ag-C alloys were successfully produced, and their mechanical properties with tempering temperature were investigated. The following results were obtained : (1) In case of Ag-Cu alloys, the solid solution was hardened by tempering at $150^{\circ}C$. The hardening is considered to occur when the solid solution begins to decompose into ${\alpha}$ and ${\beta}$ phases. The Knoop hardness number of a 40 at.%Ag-Cu alloy film deposited on a cooled glass substrate was 390 $kg/mm^2$. The as-deposited films were generally very hard but fractured under stresses below their elastic limits. (2) In case of Ag-Ni and Ag-C alloys, after the tempering of 4 at.%Ni-Ag alloy at $400^{\circ}C$ and of 1 and 2 at.%C-Ag alloys at $200^{\circ}C$, they were hardened by the precipitation of fine nickel and carbon particles. The linear relationship between proof stress vs. $(grain\;diameter)^{-l/2}$ for bulk silver polycrystals can be applied to vacuum-deposited films up to about 0.1 ${\mu}m$ grain diameter, but the proof stress of ultra-fine grained silver with grain diameters of less than 0.1 ${\mu}m$ was smaller than the value expected from the Petch's relation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.4
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• pp.308-317
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• 2007

We fabricated thermally-evaporated 10 nm-Ni/(poly)Si and 10 nm-$Ni_{0.5}Co_{0.5}$/(Poly)Si structures to investigate the microstructure of nickel silicides at the elevated temperatures required lot annealing. Silicides underwent rapid annealing at the temperatures of $600{\sim}1100^{\circ}C$ for 40 seconds. Silicides suitable for the salicide process formed on top of both the single crystal silicon actives and the polycrystalline silicon gates. A four-point tester was used to investigate the sheet resistances. A transmission electron microscope and an Auger depth profilescope were employed for the determination of vortical microstructure and thickness. Nickel silicides with cobalt on single crystal silicon actives and polycrystalline silicon gates showed low resistance up to $1100^{\circ}C$ and $900^{\circ}C$, respectively, while the conventional nickle monosilicide showed low resistance below $700^{\circ}C$. Through TEM analysis, we confirmed that a uniform, $10{\sim}15 nm$-thick silicide layer formed on the single-crystal silicon substrate for the Co-alloyed case while a non-uniform, agglomerated layer was observed for the conventional nickel silicide. On the polycrystalline silicon substrate, we confirmed that the conventional nickel silicide showed a unique silicon-silicide mixing at the high silicidation temperature of $1000^{\circ}C$. Auger depth profile analysis also supports the presence of this mixed microstructure. Our result implies that our newly proposed NiCo-alloy composite silicide process may widen the thermal process window for the salicide process and be suitable for nano-thick silicides.

• Journal of the Korean Magnetics Society
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• v.9 no.3
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• pp.159-165
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• 1999

Structural, magnetic and magnetoresistance behavior of NiFe/Ag multilayers prepared by a magnetron sputter under an Ar and $Ar/H_2$ atmosphere was studied. It was difficult to make a uniform multilayer by using an Ar atmosphere. However, the uniform multilayers could be fabricated by using an $Ar/H_2$ atmosphere. This was thought to be due to decrease in the energy of the sputtered atom and Ar content of the film. Typical magnetoresistance behavior of the discontinuous NiFe/Ag multilayers appeared when the uniform multilayer was formed and annealed. Substrate temperature did not improve the uniformity of the multilayers. Above 20$0^{\circ}C$ of the substrate temperature, the films were almost formed into granular alloys rather than multilayers.