• Proceedings of the KWS Conference
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• 2006.10a
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• pp.181-183
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• 2006

This paper studies the mechanical behaviors of Sn-3.5Ag solder joint against substrate(such as Au/Ni/Cu, Au/cu, Ni/Cu and Cu pad) after induction heating, a new soldering method. It was found that the solder bump formation depends on the time and current of the induction heating system. Also the heating value of the solder bump were found to vary with respect to the thermal conductivity of the pads on the substrate. In case of Au/Ni/Cu pad and Au/Cu pad, solder bump's shear strength were high for the heating time of $1.5{\sim}2sec$. For Ni/Cu pad, solder bump's shear strength were found to increase with time increment.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.4
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• pp.384-386
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• 1999

The distribution coefficients of Ni and Zn to the Cu site in $La_{2-x}Sr_{x}CuO_{4}$(LCO) were investigated to determine the suitable solvent composition ofr crystal growth of $La_{2}{Cu}_{1-x}{M}_{x}{O}_{4}$(M=NI, Zn)(LCMO), and were found to be 4.2 for NI and 0.66 for Zn, respectively. Single crystals of LCO, and LCMO of high homogeneity were grown by traveling solvent floating zone technique using suitable solvents. NO diamagnetic signals were observed for all substituted crystals. This fact suggests that crystals of LCO partially substituted by Ni or Zn are useful as substrate crystals.

• Proceedings of the KWS Conference
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• 2005.11a
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• pp.219-221
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• 2005

Sn-9Zn solder balls were bonded to Cu, ENIG (Electroless Nickel/Immersion Gold) and electrolytic Au/Ni pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Au/Ni/Cu substrate, an $AuZn_{3}$ IMC layer formed at the interface due to the fast reaction between Au and Zn. In addition, the $AuZn_{3}$ IMC layer became detached from the interface after reflow. When the aging time was extended to 100 h, $Ni_{5}Zn_{21}$ IMC was observed on the Ni substrate.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.563-564
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• 2012

• Journal of the Korean Vacuum Society
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• v.16 no.2
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• pp.116-121
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• 2007

TiNi shape memory alloy(SMA) was fabricated by PLD(plused laser deposition) using equiatomic TiNi target. Composition and crystallization of TiNi thin films which were fabricated in ambient Ar gas(200m Torr)and vacuum($5{\times}10^{-6}\;Torr$) were investigated. Composition of TiNi thin films was characterized by energy-dispersive X-ray spectrometry (EDXS) and crystallization was confirmed by X-ray diffraction (XRD). The composition of films depends on the distance between target and substrate but does not sensitively depend on the substrate temperature. It is found that the composition of films can be easily controlled when substrate is placed inside plume in ambient Ar gas. It is also found that the in situ crystallization temperature ($ca.\;400^{\circ}C$) in ambient Ar gas is lowered in comparison with that of TiNi film prepared under vacuum. The low crystallization temperature in ambient Ar gas makes it possible to prepare the crystalline TiNi thin film without contamination.

• Journal of the Korean Ceramic Society
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• v.53 no.1
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• pp.81-86
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• 2016

The effect of substrate rotation speed on the phase forming behavior and microstructural variation of 8 wt% yttria ($Y_2O_3$) stabilized $ZrO_2$ (8YSZ) coatings as a thermal barrier coating has been investigated. 8YSZ coatings with $100{\sim}200{\mu}m$ thickness were deposited by electron beam-physical vapor deposition onto a super alloy (Ni-Cr-Co-Al) substrate with a bond coating (NiCo-CrAlY). The width of the columnar grains of the 8YSZ coatings increased with increasing substrate rotation speed from 1 to 30 rpm at a substrate temperature range of $900{\sim}950^{\circ}C$. In spite of the different growth behaviors of coatings with different substrate rotation speeds, the phases of each coating were not changed remarkably. Even after post heat treatments with various conditions of the coated specimens fabricated at 20 rpm, only a change of color was noticeable, without any remarkable change in the phase or microstructure.

• Proceedings of the KWS Conference
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• 2002.05a
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• pp.282-284
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• 2002

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.10a
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• pp.45-46
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• 2003

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.11a
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• pp.75-76
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• 1998

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.05a
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• pp.85-85
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• 2003