• Progress in Superconductivity
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• v.7 no.2
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• pp.145-151
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• 2006

Nickel and nickel-tungsten alloy were electroplated on a cold rolled and heat treated copper(Cu) substrate. 4 mm-thick high purity commercial grade Cu was rolled to various thicknesses of 50, 70, 100 and 150 micron. High reduction ratio of 30% was applied down to 150 micron. Rolled texture was converted into cube texture via high temperature heat treatment at $400-800^{\circ}C$. Grain size of Cu was about 50 micron which is much smaller compared to >300 micron for the Cu prepared using smaller reduction pass of 5%. 1.5 km-long 150 micron Cu was fabricated with a rolling speed of 33 m/min and texture of Cu was uniform along length. Abnormal grain growth and non-cube texture appeared for the specimen anneal above $900^{\circ}C$. 1-10 micron thick Ni and Ni-W film was electroplated onto an annealed cube-textured Cu or directly on a cold rolled Cu. Both specimens were annealed and the degree of texture was measured. For electroplating of Ni on annealed Cu, Ni layer duplicated the cube-texture of Cu substrate and the FWHM of in plane XRD measurement for annealed Cu layer and electroplated layer was $9.9^{\circ}\;and\;13.4^{\irc}$, respectively. But the FWHM of in plane XRD measurement of the specimen which electroplated Ni directly on cold rolled Cu was $8.6^{\circ}$, which is better texture than that of nickel electroplated on annealed Cu and it might be caused by the suppression of secondary recrystallization and abnormal grain growth of Cu at high temperature above $900^{\circ}C$ by electroplated nickel.

• Journal of the Korean institute of surface engineering
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• v.36 no.3
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• pp.242-250
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• 2003

Electrodeposition of Ni was carried out on copper substrate from Ni Sulfamate bath by DC and high frequency pulse current. During the electroplating, bath temperature was steady $60^{\circ}C$ , agitation was applied. Morphology and surface roughness of electrodeposits was investigated with the AFM. Crystalline structure of electrodeposits was investigated with XRD. Also, surface electric resistivity was investigated with 4-point probe. The result of crystalline structure by X-ray diffractometer, in the case of DC, <200> direction was dominant growing direction. But in the case of PC, the ratio of <200> direction vs. other direction decreased. As the pulse frequency increased, the enhanced properties of deposits were shown. With increasing frequency, the degree of surface properties increased DC more than that of PC, eg surface morphology, roughness and the degree of compactness of grains. With increasing duty cycle, the surface properties such as the degree of the morphology, roughness and electroconductivity was deteriorated.

• Journal of the Korean institute of surface engineering
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• v.48 no.2
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• pp.33-37
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• 2015

High efficiency LED device is being concerned due to its high heat loss, and such heat loss will cause a shorter lifespan and lower efficiency. Since there is a demand for the materials that can release heat quickly into the external air, the organic insulating layer was required to be replaced with high thermal conductive materials such as metal or ceramics. Through anodizing the upper layer of Al, the Breakdown Voltage of 3kV was obtained by using an uniform thickness of $60{\mu}M$ aluminum oxide($Al_2O_3$) and was carried out to determine the optimum process conditions when thermal cracking does not occur. Two Ni layers were formed above the layer of $Al_2O_3$ by sputtering deposition and electroplating process, and saccharin was added for the purpose of minimizing the remain stress in electroplating process. The results presented that the 3-layer film including the Ni layer has an adhesive force of 10N and the thermal conductivity for heat dissipation is achieved by 150W/mK level, and leads to improvement about 7 times or above in thermal conductivity, as opposed to the organic insulation layer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.172-176
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• 2002

This paper describes a MEMS-based micro-fluxgate magnetic sensing element using Ni$\_$0.8/Fe$\_$0.2/ film formed by electroplating. The micro-fluxgate magnetic sensor composed of a thin film magnetic core and micro-structured solenoids for the pick-up and the excitation coils, is developed by using MEMS technologies in order to take advantage of low-cost, small size and lower power consumption in the fabrication. A copper with 20um width and 3um thickness is electroplated on Cr(300${\AA}$)/Au(1500${\AA}$) films for the pick-up(42turn) and the excitation(24turn) coils. In order to improve the sensitivity of the sensing element, we designed the magnetic core into a rectangular-ring shape to reduce the magnetic flux leakage. An electroplated permalloy film with the thickness of 3 $\mu\textrm{m}$ is obtained under 2000Gauss to induce magnetic anisotropy. The magnetic core has the high DC effective permeability of ∼1,100 and coercive field of -0.1Oe. The fabricated sensing element using rectangular-ring shaped magnetic film has the sensitivity of about 150V/T at the excitation frequency of 2MHz and the excitation voltage of 4.4Vp-p. The power consumption is estimated to be 50mW.

• Corrosion Science and Technology
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• v.2 no.1
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• pp.53-57
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• 2003

The MarM247 based superalloy (8wt.%Cr- 9wt.%Co- 3wt.%Ta- 1.5wt.%Hf- 5.6%wt.Al- 9.5wt.%W- Bal. Ni) specimens were diffusion aluminized by for types of pack cementation methods, and their coating structure and their high temperature oxidation resistance were investigated. The coated specimens treated at 973K in high aluminum concentration pack had a coating layer containing large hafunium rich precipitates, which were originally included in substrate alloy. After the high temperature oxidation test in air containing 30 vol.% $H_2O$ at 1273K ~ 323K, the deep localized corrosion which reached to the substrate were observed along with these hafnium rich precipitates. On the other hand, the coated specimens treated at 1323K using low aluminum concentration pack showed the coating layer without the large hafunium rich precipitates, and after the high temperature oxidation test at 1273K for 1800 ksec, it did not show the deep localized corrosion. The nickel electroplating before the aluminizing forms thick hafnium free area, and its high temperature oxidation resistance were comparable to platinum modified aluminizing coatings at 1273K.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.2
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• pp.120-124
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• 2003

This paper describes a MEMS-based micro-fluxgate magnetic sensing element using Ni$\_$0.8/Fe$\_$0.2/ film formed by electroplating. The micro-fluxgate magnetic sensor composed of a thin film magnetic core and micro-structure solenoids for the pick-up and the excitation coils, is developed by using MEMS technologies in order to take advantage of low-cost, small size and lower power consumption in the fabrication. A copper with 20${\mu}$m width and 3${\mu}$m thickness is electroplated on Cr (300${\AA}$) / Au (1500${\AA}$) films for the pick-up (42turn) and the excitation (24turn) coils. In order to improve the sensitivity of the sensing element, we designed the magnetic core into a rectangular-ring shape to reduce the magnetic flux leakage. An electroplated permalloy film with the thickness of 3${\mu}$m is obtained under 2000 gauss to induce magnetic anisotropy. The magnetic core has the high DC effective permeability of ~1,100 and coercive field of ~0.1 Oe. The fabricated sensing element using rectangular-ring shaped magnetic film has the sensitivity of about 150 V/T at the excitation frequency of 2 MHz and the excitation voltage of 4.4 V$\_$p p/. The power consumption is estimated to be 50mW.

• Journal of Soil and Groundwater Environment
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• v.19 no.5
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• pp.26-34
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• 2014

A $1.5m(L){\times}1.0m(W){\times}1.1m(H)$ polypropylene (PP) field scale electroniketic system coupled with stainless steel electrodes was designed to examined metal removal performance applied 0.2-0.35 V/cm potential gradient and 0.05-0.5M lactic acid for 20 day. Electroosmosis permeabilities of $2.2{\times}10^{-5}cm^2/V-s$ to $4.8{\times}10^{-5}cm^2/V-s$ were observed and it increased with the potential gradient increased. The reservoir pH controlled at $7.0{\pm}1.0$ has been effectively diminished the clogging of most metal oxides. The best removal efficiency of Zn, Pb, and Ni was 78.4%, 84.3%, and 40.1%, respectively, in the field scale EK system applied 0.35 V/cm and 0.05M lactic acid for 20 days. Increasing potential gradient would more effectively enhance metal removal than increasing concentration of processing fluid. The reservoir and soil temperatures were majorly related to potential gradient and power consumptio. A $4-16^{\circ}C$ above room temperature was observed in the investigated system. It was found that the temperature increase in soil transported the pore water and metals from bottom to the topsoil. This vertical transport phenomenon is critical for the electrokinetic process to remediate in-situ deep pollution.