• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.275-276
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• 2010

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.204-204
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• 2011

최근 자동차수명의 연장, 고품질, 내식내마모성 향상의 요구에 따라 아연도금 및 합금도금의 친환경화, 아연합금도금특성 향상, 흑색화 실현, 아연-철, 아연-니켈 벤딩성 향상, 주석-아연 합금도금과 무전해 Ni-W-P, Ni-B-W, 전해 NiSiC-PTFE, Ni-Diamond복합도금 등의 도금현장 적용과 도금 후 3가 크로메이트 도장 밀착성에 대한 품질기술지원이 요구되고 있다.

• Journal of the Korean Society for Heat Treatment
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• v.30 no.5
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• pp.222-226
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• 2017

Recently sapphire wafer has expected as smart phone cover material, however, brittle nature of sapphire needed edge grinding processes to prevent early initiation of cracks. Electro-deposited multi-layered groove tools with $35{\mu}m$ diamond particles were studied for sapphire wafer grinding. Solid particle flow behaviors in agitated electrolyte was studied using PIV(Particle Image Velocimetry), and uniform particle distribution in Ni bond were obtained when agitating impeller was located lower part of electrolyte. Hardness values of $400{\pm}50Hv$ were maintained for retention of diamond particles in electro-deposited bond layer. Sapphire wafer edge grinding test was carried out and multi-layered $160{\mu}m$ thick diamond tool showed much greater grinding capabilities up to 2000 sapphire wafers than single-layered $50{\mu}m$ thick diamond electro-deposited tools of 420 wafers. The reason why 3 times thicker multi-layered tools than single-layered tools showed 5 times longer tool lives in grinding processes was attributed to self-dressed new diamond particles in multi-layered tools, and multi-layered diamond tools could be promising for sapphire grinding.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.4
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• pp.1-5
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• 2002

A 110 m diameter aspheric metal secondary mirror for a test model of an earth observation satellite camera was fsbricated by ultra-precision single point diamond turning (SPDT). Aluminum alloy for mirror substrates is known to be easily machinable, but not polishable due to its ductility. A harder material, Ni, is usually electrolessly coated on an A1 substrate to increase the surface hardness for optical polishing. Aspheric metal secondary mirror without a conventional polishing process, the surface roughness of Ra=10nm, and the form error of Ra=λ/12(λ=632.8nm) has been required. The purpose of this research is to find the optimum machining conditions for reflector cutting of electroless-Ni coated A1 alloy and apply the SPDT technique to the manufacturing of ultra precision optical components of metal aspheric reflector.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.1125-1128
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• 2001

A 110mm diameter aspheric metal secondary mirror for a test model of an earth observation satellite camera was fabricated by ultra-precision single point diamond turning(SPDT). Aluminum alloy for mirror substrates is known to be easily machinable, but not polishable due to its ductility. A harder material, Ni, is usually electrolessly coated on an Al substrate to increase the surface hardness for optical polishing. Aspheric metal secondary mirror without a conventional polishing process, the surface roughness of Ra=10nm, and the form error of Ra=λ/12(λ=632nm) has been required. The purpose of this research is to find the optimum machining conditions for reflector cutting of electroless-Ni coated Al alloy and apply the SPDT technique to the manufacturing of ultra precision optical components of metal aspheric reflector.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.952-955
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• 2002

$WC-3%(Cr_3C_2)-2%(Mo_2C)-12%Ni$ carbides were ground with three different types of electroplated diamond wheels with respect to grain friability. The grinding ratio in the case of the highest toughness grains, A becomes the highest at the workpiece speeds of 40 and 70mm/min exhibiting larger effect with smaller workpiece speed. The grinding ratio with the medium toughness grain is higher than that of grain A at higher workpiece speeds than 100mm/min. The surface roughness becomes smaller with increasing the grain friability The increasing rate on surface roughness with the increase of workpiece speed becomes higher with using the grain of lower friability.

• Journal of Powder Materials
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• v.11 no.6 s.47
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• pp.451-461
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• 2004

Dry sliding wear behavior of electro-pressure sintered Co-Fe and Co-Ni compacts was investigated. Pin-on-disk wear tests were performed on the sintered Co-Fe, Co-Ni disks against alumina $(Al_2O_3)$ and silica $(SiO_2)$ balls at various loads ranging from 3N to 12N. A constant sliding speed of 0.1m/sec was employed. Wear rate was calculated by dividing the weight loss of a specimen by the measured specific gravity and sliding dis-tance. Worn surfaces and cross-sections of the specimens were examined using an SEM and EDS to investigate wear mechanism of the compacts. The wear behavior of the compacts were discussed as a function of their com-position. Effects of mechancial properties of the compact as well as oxide layers formed on wearing surface on the wear were also discussed.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2002.05a
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• pp.40-40
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• 2002

• Proceedings of the Korean Society of Laser Processing Conference
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• 2002.05a
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• pp.65-70
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• 2002

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.270-273
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• 2002

Conditioning은 CMP(Chemical Mechanical Planarization)에 필수적인 공정중의 하나이다. Conditioning의 목적은 removal rate와 uniformity를 CMP 공정 중에서 일정하게 유지시키는데 목적이 있다. 예전의 conditioning disks는 stainless steel substrate 위에 diamond 입자를 올리고 Ni전기도금을 결합시켜서 사용하였다. 그러나, CMP 공정 중에 Ni의분해로 인한 금속의 오염과 diamond abrasive의 분리로 인하여 scratch 문제가 발생하였다. 이 문제를 해결하기 위해서 ceramic substrate와 그것을 정밀 가공하는 기술을 응용함으로써 본래의 conditioning disks가 가지고 있는 diamond 입자의 분리와 metals 분해의 문제를 해결할 수 있게 되었다.