• Proceedings of the Materials Research Society of Korea Conference
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• 2001.05a
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• pp.145-145
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• 2001

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1993.11a
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• pp.52-53
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• 1993

• Journal of Powder Materials
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• v.21 no.1
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• pp.34-38
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• 2014

Cu-Ni alloys with unidirectionally aligned pores were prepared by freeze-drying process of CuO-NiO/camphene slurry. Camphene slurries with dispersion stability by the addition of oligomeric polyester were frozen at $-25^{\circ}C$, and pores in the frozen specimens were generated by sublimation of the camphene during drying in air. The green bodies were hydrogen-reduced at $300^{\circ}C$ and sintered at $850^{\circ}C$ for 1 h. X-ray diffraction analysis revealed that CuO-NiO composite powders were completely converted to Cu-Ni alloy without any reaction phases by hydrogen reduction. The sintered samples showed large and aligned parallel pores to the camphene growth direction, and small pores in the internal wall of large pores. The pore size and porosity decreased with increase in CuO-NiO content from 5 to 10 vol%. The change of pore characteristics was explained by the degree of powder rearrangement in slurry and the accumulation behavior of powders in the interdendritic spaces of solidified camphene.

• Applied Microscopy
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• v.46 no.1
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• pp.32-36
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• 2016

The Cu-based bulk glassy alloys in Cu-Zr-Ti-Ni systems were prepared by means of copper mold casting. The Cu-based bulk glassy alloys samples were tested by X-ray diffractomer (XRD), differential scanning calorimeter, scanning electron microscopy (SEM), Instron testing machine and Vickers hardness instruments. The result indicated that the prepared Cu-Zr-Ti-Ni alloys were bulk glassy alloys. The temperature interval of supercooled liquid region (${\Delta}T_x$) was about 45.48 to 70.98 K for the Cu-Zr-Ti-Ni alloy. The Vickers hardness was up to 565 HV for the $Cu_{50}Zr_{25}Ti_{15}Ni_{10}$ bulk glassy alloy. The $Cu_{50}Zr_{25}Ti_{15}Ni_{10}$ bulk glassy alloys were annealed in order to obtain nanocrystals. The results showed that the Vickers hardness was raise up to 630 HV from 565 HV. As shown in XRD results, the amorphous alloys changed to nanocrystals, which were $Cu_8Zr_3$, $Cu_3Ti_2$ and CuZr, improved the hardness. The SEM analysis showed that the compression fractured morphology of amorphous alloys was brittle fracture, and the fracture morphology after annealing was ductile fracture. This proved that annealing of amorphous to nanocrystals can improve the plasticity and toughness of amorphous alloys.

• Journal of the Korean Society for Heat Treatment
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• v.16 no.2
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• pp.90-96
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• 2003

The effect of betatizing temperature on microstructure and transformation characteristics in a Cu-AI-Ni based pseudoelastic alloy fabricated by heated mold continuous casting by using metallography, XRD and calorimetry. The microstructure of cast rod betatized at $600^{\circ}C$ revealed a ${\beta}_1$ parent phase and a ${\gamma}_2$ phase precipitated along the casting direction. When the cast rod was betatized at the elevated temperature above $600^{\circ}C$, the ${\gamma}_2$ phase is completely dissolved into the matrix so that the volume fraction of the ${\gamma}_2$ phase was decreased. The parent phase was stabilized by betatizing at $600^{\circ}C$. However, the ${\beta}_1$ parent phase was transformed to both ${{\beta}_1}^{\prime}$ and ${{\gamma}_1}^{\prime}$ martensites with increasing betatizing temperatures above $600^{\circ}C$, while $M_s$ and $A_s$ temperatures were decreased. The stress-strain curves for compression test were not same with betatizing temperature; the stress-strain curves of the specimen betatized at $600^{\circ}C$ and $700^{\circ}C$ were linear but those of the specimen betatized at $800^{\circ}C$ and $900^{\circ}C$ were not linear.

• Progress in Superconductivity and Cryogenics
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• v.10 no.1
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• pp.24-27
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• 2008

For the development of superconducting fault current limiters(SFCLs) having large current capacity, we fabricated an SFCL element that consists of Bi-2212 superconductor and Cu-Ni alloy tubes. First, Ag was plated on the surface of the Bi-2212 for the enhancement of soldering process. On the Ag-plated Bi-2212 tube, a Cu-Ni alloy tube was soldered using optimized solders and soldering conditions. The BSCCO/Cu-Ni composite was processed mechanically to have a helical shape for the improvement of the SFCL characteristics. The total current path of the SFCL element was 1330 mm long with 12 turns, and had critical current of 340 A at 77 K. Finally, we carried out the fault test using the fabricated SFCL element. It showed successful current limiting performance under the fault condition of 50 $V_{rms}$ and 5.5 kA. From the results, the rated voltage of the SFCL element was decided to be 0.4 V/cm, and the power capacity was 12 kVA at 77 K. The fabrication process of the SFCL and the fault test results will be presented.

• Journal of the Korean Society for Heat Treatment
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• v.24 no.5
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• pp.243-250
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• 2011

When alloys are vacuum-deposited on cooled substrates, super-rapidly cooled alloy films in the unequilibrium state can be obtained. As an application of this method, Ag-Cu, Ag-Ni and Ag-C alloys were successfully produced, and their mechanical properties with tempering temperature were investigated. The following results were obtained : (1) In case of Ag-Cu alloys, the solid solution was hardened by tempering at $150^{\circ}C$. The hardening is considered to occur when the solid solution begins to decompose into ${\alpha}$ and ${\beta}$ phases. The Knoop hardness number of a 40 at.%Ag-Cu alloy film deposited on a cooled glass substrate was 390 $kg/mm^2$. The as-deposited films were generally very hard but fractured under stresses below their elastic limits. (2) In case of Ag-Ni and Ag-C alloys, after the tempering of 4 at.%Ni-Ag alloy at $400^{\circ}C$ and of 1 and 2 at.%C-Ag alloys at $200^{\circ}C$, they were hardened by the precipitation of fine nickel and carbon particles. The linear relationship between proof stress vs. $(grain\;diameter)^{-l/2}$ for bulk silver polycrystals can be applied to vacuum-deposited films up to about 0.1 ${\mu}m$ grain diameter, but the proof stress of ultra-fine grained silver with grain diameters of less than 0.1 ${\mu}m$ was smaller than the value expected from the Petch's relation.

• Journal of Korea Foundry Society
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• v.23 no.5
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• pp.276-285
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• 2003

In the undercooled melt of $Pd_{40}Cu_{30}Ni_{10}P_{20}$ alloy, the solidification behavior including nucleation and growth of crystals at the micrometer level has been observed in-situ by use of a confocal scanning laser microscope combined with an infrared image furnace. The $Pd_{40}Cu_{30}Ni_{10}P_{20}$ alloy specimens were cooled from the liquid state to glass transition temperature. 575 K, at various cooling late under a helium gas flow. According to the cooling rate, the morphologies of the solidification front are changed among various types, irregular jog like front, columnar dendritic front, cellular grain, star like shape jog and fine grain, etc. The velocities of the solid-liquid interface are measured to be $10^{-5}{\sim}10^{-8}$ m/s which are at least two orders higher than the theoretical crystal growth rates. Combining the morphologies observed in terms of cooling rates and their solidification behaviors, we conclude that phase separation takes place in the undercooled molten $Pd_{40}Cu_{30}Ni_{10}P_{20}$ alloy. The continuous cooling transformation (CCT) diagram was constructed from solidification onset time at various linear cooling conditions with different rate. The CCT diagram suggests that the critical cooling rate for glassy solidification is about 1.5 K/s, which is in agreement with the previous calorimetric findings.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.193-200
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• 2007

Micro forming is a suited technology to manufacture very small metallic parts(several $mm{\sim}{\mu}m$). Al5083 superplastic alloy with very small grains has a great advantage in achieving micro deformation under low stress due to its relatively low strength at a specific high temperature range. Micro forming of $Zr_{62}Cu_{17}Ni_{13}Al_8$ bulk Metallic glass(BMG) as a candidate material for this developing process are feasible at a relatively low stress in the supercooled liquid state without any crystallization during hot deformation. In this study, the micro formability of Al5083 superplastic alloy and bulk metallic glass, $Zr_{62}Cu_{17}Ni_{13}Al_8$, was investigated with the specially designed micro vibration forming system using pyramid-shape, V-shape and U-shape micro die pattern. With these dies, micro vibration forming was conducted by varying the applied load, time. Micro formability was estimated by comparing the hight of formed shape using non-contact surface profiler system. The vibration load effect to metal flow in the micro die and improve the micro formability of Al5083 superplastic alloy and $Zr_{62}Cu_{17}Ni_{13}Al_8$ bulk Metallic glass(BMG).

• Progress in Superconductivity
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• v.7 no.2
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• pp.145-151
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• 2006

Nickel and nickel-tungsten alloy were electroplated on a cold rolled and heat treated copper(Cu) substrate. 4 mm-thick high purity commercial grade Cu was rolled to various thicknesses of 50, 70, 100 and 150 micron. High reduction ratio of 30% was applied down to 150 micron. Rolled texture was converted into cube texture via high temperature heat treatment at $400-800^{\circ}C$. Grain size of Cu was about 50 micron which is much smaller compared to >300 micron for the Cu prepared using smaller reduction pass of 5%. 1.5 km-long 150 micron Cu was fabricated with a rolling speed of 33 m/min and texture of Cu was uniform along length. Abnormal grain growth and non-cube texture appeared for the specimen anneal above $900^{\circ}C$. 1-10 micron thick Ni and Ni-W film was electroplated onto an annealed cube-textured Cu or directly on a cold rolled Cu. Both specimens were annealed and the degree of texture was measured. For electroplating of Ni on annealed Cu, Ni layer duplicated the cube-texture of Cu substrate and the FWHM of in plane XRD measurement for annealed Cu layer and electroplated layer was $9.9^{\circ}\;and\;13.4^{\irc}$, respectively. But the FWHM of in plane XRD measurement of the specimen which electroplated Ni directly on cold rolled Cu was $8.6^{\circ}$, which is better texture than that of nickel electroplated on annealed Cu and it might be caused by the suppression of secondary recrystallization and abnormal grain growth of Cu at high temperature above $900^{\circ}C$ by electroplated nickel.