• Journal of Welding and Joining
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• v.28 no.3
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• pp.49-58
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• 2010

Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites (diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature $940^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.

• Journal of Korea Foundry Society
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• v.31 no.6
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• pp.366-370
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• 2011

The influence of aging treatment on the microstructure, mechanical and electrical properties of Cu-Be alloy for connector material applications was investigated. The properties of mechanical strength and electrical conductivity were found to increase with increasing aging temperature. By the way, SEM/EDS and TEM analysis exhibited that beryllides precipitation (CoBe and NiBe) with a size of 50 nm were distributed in grains. It was, therefore concluded that these beryllide precipitates improved the mechanical strength and also it was favor in increasing of electrical conductivity.

• Korean Journal of Materials Research
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• v.12 no.8
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• pp.617-623
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• 2002

In order to improve the hydrogen storage capacity and the activation properties of the hydrogen storage alloys, the rare-earth metal alloy series, $MmNi_{ 4.5}$$Mn_{0.5}$ $Zr_{x}$ (x=0, 0.025, 0.05, 0.1), are prepared by adding the excess Zr in $MmNi_{4.5}$ $Mn_{0.5}$ / alloy for the strong resistance to intrinsic degradation. The hydrogen storage alloys of rare-earth metal such as $LaNi_{5}$ , and $MmNi_{5}$X and $MmNi_{4.5}$ /$_Mn{0.5}$ alloys which substituted La by misch metal properties were characterized as well. The hydrogen storage alloys were produced by melting each metal mixture in arc melting furnace, and the as-cast alloys were heat-treated at $1100^{\circ}C$ for 10 hr. The major elements of misch metal(Mm) were La, Ce, Pr and Nd with some impurities less than 1wt.% determined by ICP-AES. X-ray diffraction indicated that the structure for these samples was a single phase of hexagonal with $CaCu^{5}$ type. As the Zr contents increases, the activation time and the plateau pressure decrease and sloping of the plateau pressure increase. Amount of the 2nd phases increases with increase in Zr contents in $MmNi_{ 4.5}$$Mn_{0.5}$ $Zr_{0.1}$ alloy, This phenomenon indicated that $ZrNi_3$ in this phase, which shows the maximum storage capacity and the strong resistance to intrinsic degradation, is considered as a proper alloy for hydrogen storage..

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.554-554
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• 2000

To improve mechanical properties of Cu-Al-Ni alloy by the grain refinement, Cu-Al-Ni SMA ribbons were fabricated by melt spinning apparatus. The variations of microstructure, mechanical properties and transformation characteristics with the condition of rapid solidification and annealing time-temperature were investigated in Cu-Al-Ni SMA ribbons. The ribbons fabricated by melt spinning obtained around 1.5nm in width and 50-60${\mu}{\textrm}{m}$ in thickness. With increasing wheel speed in order of 10m/s, 15m/s, 20m/s, 30m/s and 3m/s, the grain size was decreased in order of 10${\mu}{\textrm}{m}$, 6.25${\mu}{\textrm}{m}$, 5.5${\mu}{\textrm}{m}$, 3${\mu}{\textrm}{m}$ and 3${\mu}{\textrm}{m}$. $M_{s}$ and $A_{s}$ temperature were decreased with decreasing grain size. By X-ray diffraction test, ordered $\beta$$_1$ phase was observed in all the SMA ribbons and the volume friction of it was increased with increasing wheel speed. With increasing wheel speed, strain was increased from 4.2% to 5.8% and fracture mode has changed from mixture of intergranular and dimple fracture to mixture of fiber structure and dimple fracture. The grain size of ribbon heat-treated at $600^{\circ}C$ was increased with increasing time. In the heat-treated ribbons at 55$0^{\circ}C$, ${\gamma}$$_2$ phases were observed.d.d.

• Journal of the Korean institute of surface engineering
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• v.49 no.5
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• pp.439-446
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• 2016

In 2015, a fin tube (Cu-Ni 70/30 alloy) of package type heat exchanger for navy vessel was perforated through the wall which led to refrigerant leakage. This failure occurred after only one year since its installation. In this study, cause of the failure was determined based on available documents, metallographic studies and computational fluid dynamics simulation conducted on this fin tube. The results showed that dimensional gap between inserted plastic tube and inside wall of fin tube is the cause of the swirling turbulent stream of sea water. As a result of combination of swirling turbulence and continuing collision of hard solid particles in sea water, erosion corrosion has begun at the end of inserted plastic tube area. Crevice corrosion followed later in the crevice between the outer wall of plastic tube and inner wall of fin tube. It was found that other remaining tubes also showed the same corrosion phenomena. Thorough inspection and prompt replacement will have to be accomplished for the fin tubes of the same model heat exchanger.

• Journal of the Korean Society for Heat Treatment
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• v.8 no.1
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• pp.65-74
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• 1995

This research was performed to investigate the effect of ageing on grain refinement of 82wt%Cu-13.5wt%Al-4.5wt%Ni-0.1wt% misch metal alloy with ageing temperature and time. The results obtained in this study are as follows; The variation of transformation temperature with ageing temperature had very influence on ageing time at $300^{\circ}C$. But it had not influence on ageing time at $100^{\circ}C$. The variation of transformation temperature after second reversed transformation cycle was not occured in martensitic phase ageing, but $M_s$ point was appeared equally with third reversed transformation cycle in parent phase ageing. The variation of $M_s$ point was not nearly with ageing time at $100^{\circ}C$ ageing temperature. But it was decreasing with ageing time at $300^{\circ}C$ ageing temperature and $A_s$ point was increasing with ageing time. Structure of parent phase ageing was being M18R martensitic and N2H martensitic phase. It was found that ${\alpha}$ and ${\gamma}_2$ phase were created by ageing of long time at $300^{\circ}C$ ageing temperature.

• Transactions on Electrical and Electronic Materials
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• v.16 no.3
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• pp.112-116
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• 2015

This work studied the thickness and contact angle of solder joints between SAC 305 lead-free solder alloy and a Copper (Cu) substrate. Intermetallic compound (IMC) thickness and contact angle of 3Sn-Ag-0.5Cu (SAC 305) leadfree solder were measured using varying aging times, at a fixed temperature at 30℃. The thickness of IMC and contact angle depend on the aging time. IMC thickness increases as the aging increases. The contact angle gradually decreased from 39.49° to 27.59° as aging time increased from zero to 24 hours for big solder sample. Meanwhile, for small solder sample, the contact angle increased from 32.00° to 40.53° from zero to 24 hours. The IMC thickness sharply increased from 0.007 mm to 0.011 mm from zero to 24 hours aging time for big solder. In spite of that, for small solder the IMC thickness gradually increased from 0.009 mm to 0.017 mm. XRD analysis was used to confirm the intermetallic formation inside the sample. Cu₆Sn₅, Cu₃Sn, Ni₃Sn and Ni₃Sn₂ IMC layers were formed between the solder and the copper substrate. As the aging time increased, the strength of the solder joint mproved due to reduced contact angle.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.192-193
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electro less plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. In this paper, we investigated low-cost Ni/Cu contact formation by electro less and electroplating for crystalline silicon solar cells.

• Proceedings of the Korean Institute of Resources Recycling Conference
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• 1993.03a
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• pp.6.3-7
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• 1993

• 한국초전도학회:학술대회논문집
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• v.15
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• pp.88-88
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• 2005