• Transactions on Electrical and Electronic Materials
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• v.14 no.3
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• pp.133-138
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• 2013

Acrylonitrile-butadiene-styrene (ABS) plastic is a polymer material extensively used in electrical and electronic applications. Nickel (Ni) thin film was deposited on ABS by electroless plating, after its surface was treated and modified with atmospheric plasma generated by means of dielectric barrier discharges (DBDs) in air. The method in this study was developed as a pre-treatment for electroless plating using DBDs, and is a dry process featuring fewer processing steps and more environmentally friendliness than the chemical method. After ABS surfaces were modified, surface morphologies were observed using a scanning electron microscope (SEM) to check for any physical changes of the surfaces. Cross-sectional SEM images were taken to observe the binding characteristics between metallic films and ABS after metal plating. According to the SEM images, the depths of ABS by plasma are shallow compared to those modified by chemically treatment. The static contact angles were measured with deionized (DI) water droplets on the modified surfaces in order to observe for any changes in chemical activities and wettability. The surfaces modified by plasma showed smaller contact angles, and their modified states lasted longer than those modified by chemical etching. Adhesion strengths were measured using 3M tape (3M 810D standard) and by 90° peel-off tests. The peel-off test revealed the stronger adhesion of the Ni films on the plasma-modified surfaces than on the chemically modified surfaces. Thermal shock test was performed by changing the temperature drastically to see if any detachment of Ni film from ABS would occur due to the differences in thermal expansion coefficients between them. Only for the plasma-treated samples showed no separation of the Ni films from the ABS surfaces in tests. The adhesion strengths of metallic films on the ABS processed by the method developed in this study are better than those of the chemically processed films.

• Progress in Superconductivity and Cryogenics
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• v.5 no.3
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• pp.15-19
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• 2003

For the purpose of standardization of the critical current measurement, it is meaningful to describe how $I_{c}$ will behave as the stress/strain level changes. In this study, strain dependencies of the critical current $I_{c}$ in Ag-alloy sheathed multifilamentary Bi(2212) and Bi(2223) superconducting tapes were evaluated at 77K, 0T. The external reinforcement was accomplished by soldering AgMgNi alloy tapes onto single or both sides of the sample. With the external reinforcement to the Bi(2212) tape, the strength of the tapes increased but the critical current at the strain free state, $I_{c0}$ decreased in some cases. The strain for onset of the $I_{c}$ degradation, $\varepsilon$$_{\irr}$, increased with an increase of the reinforcing volume and then saturated to a certain value. The effect of external reinforcement on the degradation of $I_{c}$ due to the bending strain in the Bi(2223) tape was also examined. Contrary to the expectation, it showed a significant $I_{c}$ degradation even at a small strain of 0.4 %. The observations of damage morphologies gave a good explanation to the $I_{c}$ behavior.c/ behavior.r.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.11
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• pp.1241-1245
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• 2004

Continuous physical vapor deposition (PVD) method is one of many processes to fabricate long length coated conductor which is required for successful large-scale application of superconducting power devices. Three film deposition systems (pulsed laser deposition, sputtering, and evaporation) equipped with reel-to-reel(R2R) metal tape moving apparatus were installed and used to deposit multi-layer oxide thin films. Both RABiTS and IBAD texture templates are used. IBAD template consists of CeO$_2$(PLD)/YSZ(IBAD) on stainless steel(SS) metal tape, and RABiTS template has the structure of CeO$_2$/YSZ/Y$_2$O$_3$ which was continuously deposited on Ni-alloy tape using R$_2$R evaporation and DC reactive sputtering in a deposition system designed to do both processes. 0.4 m-long coated conductor with Ic(77 K) of 34 A/cm was fabricated using RABiTS template. 0.5 m and 1.1 m-long coated conductor with Ic(77 K) of 41 A/cm and 26 A/cm were fabricated using IBAD template.

• Resources Recycling
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• v.7 no.4
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• pp.35-42
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• 1998

Surface mount technology is the biggest theme in the area of deιIronic component. To miniatunze an electronic component, s such as ferrite chip inductor, the cer뼈lic wet process for green-sheet lamination and/or screen printing method through a s solvent medium system is widely used. The preparation and characterization of NiCuZn Ferrite (NCZF) shurry and the green s sheet using the water mixed binder system has been studied. The 21 vol% of NCZF slurry was prepared by a ball milling. The p polyacrylic vinyl copolymer (Mw; 60,000) was used as a binder. Th$\xi$ mixture of distilled water, isopropyl alcohol (IPA) and 2l butoxy ethanol was used as a dispersion medium. The water content of medium varied from about 40% to 80%. As the results. Thc disp$\xi$rston stability of the NCZF slurry was attributed to the free polymer rather than the electrostatic force of the particle. T The viscosity of the NCZF slurry was greatly depended on the ratio of water content in the medium.

• Progress in Superconductivity and Cryogenics
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• v.22 no.3
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• pp.13-19
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• 2020

This study presents the experiment and simulation results on the magnetic field response and electrical stability behaviors of no-insulation (NI) and metal insulation with stainless steel tape (MI-SS) which wound in form of racetrack type coils. First of all, the structural design of the racetrack type bobbin was shown along with its parameters. Then, the current-voltage tests were carried out to measure the critical current of both test coils. Also, the sudden discharging and charging tests were performed in the steady state to estimate the decay field time and magnetic field response, respectively. Finally, the overcurrent tests were conducted in the transient state to investigate the electrical stability of these test coils. Based on the experimental results, the contact surface resistances were calculated and applied to the field coils (FCs) of 10-MW-class second generation high temperature superconducting generator (2G HTSG) used in wind offshore environment. The charging delay time and electrical stability for NI and MI-SS HTS FCs of 10-MW-class 2G HTSG are analyzed by the equivalent circuit model and the key parameters which were obtained from the electromagnetic finite element analysis results.

• Journal of the Korean Electrochemical Society
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• v.9 no.3
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• pp.124-131
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• 2006

For commercialization of molten carbonate fuel cell (MCFC), it has some problems to be overcome such as decrease of porosity and thickness of the anode under the operating condition (at $650^{\circ}C$ and working pressure of more than 2 $kg_f/cm^2$). Recently, Ni-Al alloy anode has been proposed to replace the conventional Ni-Cr anode as an alternative material to resist a creep and inhibit the sintering. The objective of this research is to sinter the green sheet of Ni-Al alloy anode during single cell pre-treatment process, which has several advantages like cost down and simplification of manufacturing process. However, the Ni-Al alloy anode prepared with a conventional pre-treatment process showed the phase separation of Ni-Al alloy and formation of micropore(${\leqq}0.4{\mu}m$), resulting in low creep resistance and high electrolyte re-distribution. In order to prevent the Ni-Al alloy anode from phase-separating, nitrogen gas was used in the process of pre-treatment. Introducing the nitrogen, the phase separation from Ni-Al alloy into nickel and alumina was minimized and increased creep resistance. However, there was some micropore formation on the surface of Ni-Al alloy anode during the cell operation due to creation of lithium aluminate. Addition of more amount of electrolyte into a cell, especially at cathode, made the cell performance stable for 2,000 hrs. Consequently, it was possible to make the Ni-Al alloy anode with good creep resistance by the modified in-situ sintering technique.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.181-181
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• 2007

PTCR 세라믹스를 적층형 부품으로 제조할 경우 소형화, 저 저항화 및 과전류 유입 시 빠른 응답특성을 갖는다는 장점을 가지고 있으며, 이러한 적층형 부품제조시에는 내부전극재가 부품소자의 물성에 중요한 영향을 미친다. 특히 우수한 옴성 접촉(Ohmic Contact)을 갖는 Zn, Fe, Sn, Ni 등의 적층 PTC용 전극재는 높은 산화특성으로 인해 재산화 과정에서의 비옴성 접촉(Non-ohmic contact)을 갖게 되어 PTC 특성을 저하시킬 우려가 있다. 따라서 본 연구에서는 적층형 PTCR 세라믹스의 내부전극재와 반도체 세라믹층의 동시소성거동 및 적층 PTCR 세라믹스의 전기적 특성을 평가하였다. 본 연구에 적용된 내부전극재로는 Ni 전극을 사용하였고, Ni 전극용 paste로는 무공제 paste, 반도체 세라믹공제 paste, $BaTiO_3$ 공제 paste의 3종 전극재가 이용되었다. 적층형 PTCR 세라믹스의 제조공정은 테이프 캐스팅(Tape casting), 내부전극인쇄, 적층 및 동시소성을 포함하는 적층화공정을 적용하였다. 각각의 전극 paste를 적용하여 제조된 chip은 미세구조관찰, I-V특성, R-T특성 등을 평가하여 내부전극내 세라믹공제의 영향을 고찰하였다.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2002.02a
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• pp.339-339
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• 2002

In the RABiTS approach to coated conductor development, successful (both economic and technological) depends on the refinement and optimization of each of three important components: the metal tape substrate, the buffer layer(s), and the HTS layer. Here we will report on the ORNL approach and progress in each of these areas. - Most applications will require metal tapes with low magnetic hysteresis, mechanical strength, and excellent crystalline texture. Some of these requirements are competing. We report on progress in obtaining a good combination of these characteristics on metal alloys of Ni-Cr and Ni-W. - The deposition of appropriate buffer layers is a crucial step. Recently, base research has shown that the presence of a stable sulfur superstructure present on the metal surface is needed for the nucleation and epitaxial growth of vapor-deposited seed buffer layers such as YSZ, CeO$_2$ and SrTiO$_3$. We report on the details and control of this superstructure for nickel tapes, as well as recent results for Cu and Ni-13%Cr. - Processes for deposition of the HTS coating must economically provide large values of the figure-of-merit for conductors, current x length. At ORNL, we have devoted efforts to a precursor/post-annealing approach to YBCO coatings, for which the deposition and reaction steps are separate. We describe motivation for and progress toward developing this approach. - Finally, we address some issues for the implementation of coated conductors in real applications, including the need for texture control and electrical stabilization of the HTS coating.

• Progress in Superconductivity and Cryogenics
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• v.8 no.4
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• pp.8-11
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• 2006

High temperature superconducting coated conductor has various buffer structures on Ni-W alloy. We comparatively studied the growth conditions of a multi buffer layer $(CeO_2/YSZ/CeO_2)$ and a single buffer layer$(CeO_2)$ on textured Ni-W alloy tapes. XRD data showed that the qualities of in-plane and out-of-plane textures of the two type buffer structures were good. Also, we investigated the properties of SmBCO superconducting layer that was deposited on the two type buffer structure. The SmBCO superconducting properties on the single and multi buffer structure showed different critical current values and surface morphologies. FWHM of In-plane and out-of-plane textures were $7.4^{\circ},\;5.0^{\circ}$ in the top CeO2 layer of the multi-buffer layers of $CeO_2/YSZ/CeO_2$, and $7.3^{\circ},\;5.1^{\circ}$ in the $CeO_2$ single buffer layer. $1{\mu}m-thick$ SmBCO superconducting layers were deposited on two type buffer layer. $I_c$ of SmBCO deposited on single and multi buffer were 90 A/cm, 150 A/cm and corresponding $J_c$ were $0.9MA/cm^2,\;1.5MA/cm^2$ at 77K in self-field, respectively.

• Applied Science and Convergence Technology
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• v.24 no.5
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• pp.162-166
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• 2015

Linear ion beams have been introduced for the ion beam treatments of flexible substrates in roll-to-roll web coating systems. Anode layer linear ion sources (300 mm width) were used to make the linear ion beams. Oxygen ion beams having an ion energy from 200 eV to 800 eV used for the adhesion improvement of Cu thin films on PET substrates. The Cu thin films deposited by a conventional magnetron sputtering on the oxygen ion beam treated PET substrates showed Class 5 adhesion defined by ASTM D3359-97 (tape test). Argon ion beams with 1~3 keV used for the ion beam sputtering deposition process, which aims to control the initial layer before the magnetron sputtering deposition. When the discharge power of the linear ion source is 1.2 kW, static deposition rate of Cu and Ni were 7.4 and $3.5{\AA}/sec$, respectively.