• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 1996년도 추계학술대회 논문집
• /
• pp.59-62
• /
• 1996

The effect of NiO addition on the microstructure and microwave dielectric properties of (Zr$_{0.8}$Sn$_{0.2}$)TiO$_4$(ZST) was investigated. With the NiO addition, a dense ZST body of density higher than 95% has been achieved in the sintering temperature range of 1400 to 150$0^{\circ}C$. Energy dispersive X-ray spectrometry (EDS) analysis of sintered specimen shows the presence of second phase at grain boundaries, which is considered to be NiTiO$_3$. Dielectric constant of the specimen is found to increase linearly with density. Q-values and TC$_{f}$decrease with increasing NiO content. The variation of dielectric properties with NiO content is discussed in term of the second phase. The ZST ceramics with small amount of additive gave $\varepsilon$$_{r}$=38, Q=7000 at 7 GHz and TC$_{f}$=-0.5 ppm/$^{\circ}C$, comparable with the values obtained by previous investigation.stigation.

• Advances in materials Research
• /
• 제1권1호
• /
• pp.83-92
• /
• 2012

The effect of under-bump-metallization (UBM) on electromigration was investigated at temperatures ranging from $135^{\circ}C$ to $165^{\circ}C$. The UBM structures were examined: 5-${\mu}m$-Cu/3-${\mu}m$-Ni and $5{\mu}m$ Cu. Experimental results show that the solder joint with the Cu/Ni UBM has a longer electromigration lifetime than the solder joint with the Cu UBM. Three important parameters were analyzed to explain the difference in failure time, including maximum current density, hot-spot temperature, and electromigration activation energy. The simulation and experimental results illustrate that the addition 3-${\mu}m$-Ni layer is able to reduce the maximum current density and hot-spot temperature in solder, resulting in a longer electromigration lifetime. In addition, the Ni layer changes the electromigration failure mode. With the $5{\mu}m$ Cu UBM, dissolution of Cu layer and formation of $Cu_6Sn_5$ intermetallic compounds are responsible for the electromigration failure in the joint. Yet, the failure mode changes to void formation in the interface of $Ni_3Sn_4$ and the solder for the joint with the Cu/Ni UBM. The measured activation energy is 0.85 eV and 1.06 eV for the joint with the Cu/Ni and the Cu UBM, respectively.

• 한국수소및신에너지학회논문집
• /
• 제10권4호
• /
• pp.225-232
• /
• 1999

Ni-MH 2차 전지의 음극재료로 사용되는 수소저장합금중 이론 방전용량이 가장 높은 $Mg_2Ni$를 기계적 합금법으로 제조하여 각종 첨가물의 첨가에 따른 전기화학적 특성을 조사하였다. $Mg_2Ni$는 고에너지 볼밀인 SPEX 8000을 이용하여 두가지 방법으로 제조하였다. 하나는 Mg, Ni 분말에 첨가물인 $AB_5$, $AB_2$계 수소저장합금과 Ni, Co, Cu를 첨가하여 12시간 볼밀링한 경우이고, 다른 하나는 먼저 Mg, Ni 분말을 1시간동안 볼밀링한 후 $300{\sim}400^{\circ}C$에서 열처리하여 $Mg_2Ni$를 제조한 후 여기에 첨가물을 10wt% 첨가하여 12 시간동안 볼밀할 경우이다. 이 볼밀링한 복합분말을 상온에서 $754tons/cm^2$의 압력으로 냉간압착하여 디스크 모양의 전극을 제조하였다. 실험결과 볼밀링 후 열처리를 거친 합금분말의 경우가 그렇지 않은 경우에 비해 전극의 방전용량이 높았으며, Ni을 첨가한 경우는 방전용량을 증가시키고 Co를 첨가한 경우는 싸이클 특성이 향상되었다. 특히 $Mg_2Ni$에 Ni을 10wt%를 첨가하여 12시간 볼밀한 경우 $Mg_2Ni$의 최대 방전용량은 546mAh/g.alloy으로 이론용량의 약 55%에 달했다.

• 전기화학회지
• /
• 제14권3호
• /
• pp.163-170
• /
• 2011

첨가제 농도, 전류밀도, 도금용액 pH가 Ni 박막의 잔류응력, 표면형상, 미세조직에 미치는 영향을 관찰하기 위하여 chloride 도금용액으로부터 나노결정립 Ni 박막이 제조되었다. Ni 박막에서 잔류응력은 첨가제인 saccharin의 농도가 증가함에 따라 인장응력모드(약 150 MPa)로부터 압축응력모드(약 -100 MPa)로의 천이가 관찰되었다. Ni 박막의 미세구조는 도금용액 내에 saccharin의 유무에 따라 변화되었다. Saccharin이 첨가되지 않은 도금용액으로부터 전기도금된 Ni 박막은 주로 FCC(111) 과 FCC(200) 상들로 구성되어 있다. 그러나 Saccharin이 첨가된 도금용액으로부터 전기도금된 Ni 박막은 FCC(111), FCC(200), FCC (311) 상[때로는 FCC (220)]들로 구성되어 있다. 전류밀도는 Ni 박막의 잔류응력에 영향을 미치는 것으로 관찰되었다. $2.5\sim2.5{\mu}10mA{\cdot}cm^{-2}$의 전류밀도에서 가장 낮은 압축응력 값(약 -100 MPa)을 나타내었다. 도금용액의 pH 도 역시 Ni 박막의 잔류응력에 영향을 미쳤다. 한편, 도금용액에 saccharin의 첨가는 Ni 박막의 결정립 크기에 영향을 나타내었다. Saccharin이 첨가되지 않은 경우 Ni 박막의 결정립 크기가 약 60 nm로 측정되었으며, saccharin 함량이 0.0005 M 이상 첨가된 경우 Ni 박막의 결정립 크기가 24~38 nm로 측정되었다. Ni 박막의 표면 형상은 saccharin이 첨가됨에 따라 nodular 형상으로부터 매끄러운 (smooth) 형상으로 변화되었다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 유기절연재료 방전 플라즈마연구회
• /
• pp.11-14
• /
• 2003

Sintered Cu-W has been used for the electrode of GIS for interrupting the abnormal current. In this study the effect of Ni addition in Cu-W electrode was investigated. Cu-W electrodes used contains 0.1~0.2wt% Ni and were conducted the experiments which was attacked by DC arc test (70V-70A) for 300 times periodically. As the contents of Ni in Cu-W electrode increase, the hardness and electrical conductivity were decreased. The weight change ($\Delta$mg) of electrode after DC arc test increased with increasing Ni contents and test times. The hardness and electrical conductivity of electrode after DC arc test were decreased compared with non-arc affected electrode, which was owing to the defects near surface of electrode and degradation by arc heat. It was considered that Cu in the Cu-W electrode was scattered to all directions by arc heat, therefore, the electrodes were damaged and deformed in the surface and cross-section of electrode. It is difficult to estimate directly the characteristics of Cu-W electrode for GIS related with high voltage and current from the results of DC arc test conducted in this study. However, the results of the effect of Ni addition in Cu-W electrode could be applied for the research of electrode for GIS.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
• /
• pp.172-172
• /
• 2003

It has been known that Pd-MILC shows much faster and lower temperature crystallization than Ni-MILC but it can not be put into practice due to the quality issue of thus fabricated poly crystals. In this study, addition of Pd into Ni-MILC has been attempted in order to take advantages of the Pd-MILC without sacrificing of the Ni-MILC TFTs. It turns out that when 5% of Pd has been added to Ni for MILC, MILC growth rate increases two - three times faster than pure Ni-MILC. The MILC growth rate shows monotonic increase with increase the amount of Pd in Ni up to 50%. Even when small amount of Pd was added to Ni like 5%, crystallization phenomenon already follows the way of Pd-MILC. The Poly-W thus fabricated shows lower leakage current than pure Ni-MILC TFT without losing any amount of on-current This fact is very important in low temperature poly-TFTs because MILC-TFTs, especially suffer from the relatively high leakage current

• 한국주조공학회지
• /
• 제23권5호
• /
• pp.286-290
• /
• 2003

본 연구에서는 Ni-Zr-Ti의 3원계 합금을 기본으로 하여, Si 및 Sn 등의 원소를 첨가하여 Ni-rich 영역에서 벌크 비정질 합금을 제조하였다. $Ni_{59}Zr_{20}Ti_{16}Si_2Sn_3$ 조성의 합금에서 injection casting에 의하여 약 58 K의 과냉각액상영역을 가지고 있는 직경 3 mm의 벌크 비정질 시편을 제조하였다. 이러한 우수한 비정질 형성능은 액상온도의 저하로 인해 낮은 온도까지 액상이 쉽게 과냉되기 때문인 것으로 사료된다. $Ni_{59}Zr_{20}Ti_{16}Si_5$ 합금은 두 단계에 걸쳐 결정화가 일어나는 반면, $Ni_{59}Zr_{20}Ti_{16}Si_2Sn_3$ 합금은 단일 단계에 의해 orthorhombic $Ni_{10}{(Zr,Ti)}_7$ 결정상과 cubic NiTi 결정상으로 결정화가 일어난다. 벌크 비정질 $Ni_{59}Zr_{20}Ti_{16}Si_2Sn_3$ 합금의 경우 압충강도는 2.7 GPa, 연신율은 약 2% 정도의 값을 가진다.

• 한국분말재료학회지
• /
• 제8권1호
• /
• pp.26-34
• /
• 2001

In the present study, the effect of Ni content on densification and grain growth in Ni doped W compacts was investigated by using the dilatometric analysis. The Ni-doped W compacts with various amount of Ni activator from 0.02 to 0.4 wt％ were sintered in hydrogen atmosphere up to 140$0^{\circ}C$. As the amount of Ni and heating rates, the Ni-doped W compacts show a greatly different dilatometric behavior during the sintering. The sintered specimen was densified over 98％ of theoretical density by adding only 0.06 wt％ Wi in sub-micron W powder and the appropriate heating rate. It was also observed that the microstructure development strongly depended on the change of the Ni amount. In addition, it was found that the critical content of Ni showing large grain growth in microstructure was below 0.1 wt％.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
• /
• pp.726-731
• /
• 2002

Reaction synthesis is a process to form ceramics, intermetallics and their composites from elemental powder mixture. Application of this process to a surface modification techniques has a possibilities to enable the process at a lower temperature or for a shorter time, although synthesized materials are likely to include voids and unreacted elements. This paper intend to examine the effect of Si addition to the mixture of Al and Ni on the densification of synthesized Ni-Al intermetallic compounds and to evaluate the surface properties of obtained coatings. By the Si addition, exothermic reaction temperature to form Ni-Al intermetallic was lowered to be below the melting point of Al. Si soluted $Al_3$Ni$_2$, $Al_3$Ni and $Al_{6}$Ni$_3$Si were mainly formed in the coating layer when powder mixture was heated to 973K for 300s. Besides, densification was enhanced by increasing hot press pressure, Si additions and heating rate. When the composition of eutectic Al-Si reaches 78%, void ratio of sintered compact reduced to 0.4%. It is caused by higher flowability of Al-Si liquid phase generated and its infiltration into the void. Since the hardness of NiAl(Si) compound (about 600HV) formed in the coating layer is higher than that of Ni-Al compound (about 400HV), coating layer with high density and superior wear property is obtained by hot press using reaction synthesis from Al-Ni-Si powder mixture.

• 연구논문집
• /
• 통권24호
• /
• pp.161-174
• /
• 1994

The Ni-Al intermetallic compound that has the greatest potential to be commercialized shows the high ductility at room temperature with the addition of boron, but has extremely low ductility at high temperature and oxidation environment. On this research work, the changes of microstructure and compressive fracture properties were studied in ($NiAl+Ni_3Al$) two-phase alloys. The precipitation behavior of $Ni_3Al$ after solution treatment at $1300^\circC$ for 14hrs and aging treatment at $800^{\circ}C$ for 14hrs was varied with Al content in ($NiAl+Ni_3Al$) two-phase alloys. These microstructure could be modified dramatically by suitable heat treatments. Martensite or martensite plus $Ni_3Al$ microstructure was obtained upon oil quenching from $1300^\circC$. Aging of Martensite at $800^\circC$ resulted in the $Ni_3Al$ plus NiAl phase. The compressive fracture strength and compressive fracture strain were improved by the $Ni_3Al$ plus NiAl phase mixtures at room temperature and $1100^\circC$. Microcracks are observed mostly in the region of NiAl and the interface of $NiAl-Ni_3Al$ phase after compressive test at room temperature. In the case of high temperature compressive test, microcracks are formed in the region of $Ni_3Al$ phase.