• 반도체디스플레이기술학회지
• /
• 제6권3호
• /
• pp.13-17
• /
• 2007

Effect of Co substitution on crystal structures of two nickel silicides, NiSi and $NiSi_2$, is investigated by using an ab initio calculation. Relaxed NiSi and $NiSi_2$ structures are calculated and the calculated lattice parameters are in good agreement with experimentally determined lattice parameters within about 2%. A Co atom substitutes a Ni and Si site, respectively, to evaluate the preferable site between them. Co prefers Ni site to Si site in both NiSi and $NiSi_2$. The calculated total energy also indicates that the Co substitution to Ni site stabilizes both the NiSi and $NiSi_2$ structures. Co also prefers Ni site in $NiSi_2$ to that in NiSi, indicating that $NiSi_2$ becomes more stable than NiSi with Co substitution. As Co addition to NiSi improves its thermal stability experimentally, this indicates that the energy barrier between the two phases is high enough to prevent the phase transformation from NiSi to $NiSi_2$ up to high temperature.

• 반도체디스플레이기술학회지
• /
• 제6권4호
• /
• pp.65-68
• /
• 2007

An epitaxial NiSi structure on Si (001) substrate was studied by using density functional theory (DFT). Orhorhombic and B2-NiSi structures were compared first. B2 structure was further considered as it has same crystal structure as Si and the lattice mismatch between B2 and Si is small, compared to orthorhombic-NiSi. The lattice parameters of x- and y-direction in B2-NiSi structure were modified to match with those in Si (001). The size reduction of the lattice parameter of B2-NiSi to match with that of Si increased the lattice parameter of z-direction by 10.5%. Therefore, we propose that an optimum structure of NiSi for epitaxial growth on Si (001) is a tetragonal structure.

• 한국세라믹학회지
• /
• 제13권3호
• /
• pp.55-62
• /
• 1976

순수한 닉켈과 금 박막을 (III)규소 단 결정위에 진공 증착시켰다. Ni/Au/Si나 Au/Ni/Si시료를 진공중에서 약 55$0^{\circ}C$로 가열하였을 때 육방정 혹은 변형된 육방정의 미소 결정들이 규소 기질위에 형성되었다. 이들 미소 결정들의 형성과정 및 조성은 X-선 회절법, scanning electron microscopy 및 scanning Auger microprobe 법을 사용하여 결정하였다. 이들 미소 결정은 NiSi2임이 확인되었다. Ni/Au/Si 시료에서는 Au-Si 공융점(37$0^{\circ}C$) 이상으로 온도가 증가됨에 따라 닉켈과 규소가 Au-Si 공융체 속으로 이동한 후 반응하여 NiSi2를 형성하였다. Au/Ni/Si 시료에 있어서의 Au-Si 공융체 형성은 닉켈 박막에 있는 바늘구멍형의 표면 결함과 관련 지을 수 있겠다. 금이 닉켈 박막의 grain boundary를 통하여 Ni/Si 계면으로 확산되어 그 계면을 습윤시킨 다음 Au-Si 공융체를 형성하였다. 이런 Au-Si 공용체는 닉켈과 규소 원자에 대한 높은 확산 매질로서 작용하여 NiSi2 형성을 촉진시켰다. 표면에 평행한 (III)규소면 위의 NiSi2 미소 결정은 유사한 육방정으로 나타났으며, 경사진 미소결정은 부등변 사변형과 유사하였다. Auger 스펙트럼 및 Ni, Au 및 Si에 대한 내층조성(indepth Composition Profiles)은 NiSi2 미소 결정이 Au-Si 공융체의 matrix에 미소 부분으로 나타났음을 보여주었다.

• 한국진공학회지
• /
• 제12권S1호
• /
• pp.7-9
• /
• 2003

Solid-state reactions in Ni/Si multilayered films (MLF) with an overall stoichiometry of $Ni_2Si$, NiSi and $NiSi_2$, induced by ion-beam mixing (IBM) and thermal annealing, were studied by using spectroscopic ellipsometry and magneto-optical spectroscopy as well as x-ray diffraction (XRD). The mixing was performed with Ar+ ions of an energy of 80 keV and a dose of $1.5 x\times10^{16}$ $Ar^+$/$\textrm{cm}^2$. It was shown that the IBM induces structural changes in the Ni/Si MLF, which cannot be detected by XRD but are confidently recognized by the optical method. A thermal annealing at 673 K of the Ni/Si MLF with an overall stoichiometry of NiSi and $NiSi_2$ causes formation of the first η -NiSi phase. The first trace for $NiSi_2$ phase on the background of NiSi one was detected by XRD after an annealing at 1073 K while, according to the optical results, $NiSi_2$ turns out be the dominant phase for the annealed Ni/Si MLF with an overall stoichiometry of $NiSi_2$.

• Applied Microscopy
• /
• 제24권4호
• /
• pp.123-131
• /
• 1994

In this study the initial stage nucleation and growth of Ni silicide on (001) Si by evaporation and furnace annealing have been investigated by transmission electron microscopy. The pressure was $10^{-6}$ Torr during evaporation and annealing. And the annealing temperature to produce $NiSi_2\;was\;800^{\circ}C$. From the evaporated film, $NiSi_2$ nucleus has grown into Si substrate with an epitaxial orientation relationship. Interfaces between $NiSi_2$ and Si were A-type {111} interfaces and {100} $NiSi_2$ interfaces were also observed at the initial stage of nucleation. Ni silicide grew into Si substrate, but the nucleus partly grew into the evaporated film, with no facets, from the nuclei in the Si substrate. $NiSi_2$ nucleus with (111) habit planes was also observed.

• 전자공학회논문지D
• /
• 제35D권11호
• /
• pp.70-77
• /
• 1998

본 논문에서는 nickel/silicon carbide(Ni/SiC) 접합에 의한 Schottky 다이오드를 제작하고, 그 전기적 특성을 조사하였다. Ni/4H-SiC의 경우, 산화막 모서리 단락을 하였을 때 상온에서 973V의 역방향 항복전압이 측정되었으며 이는 모서리 단락되지 않은 Schottky 다이오드의 역방향 항복전압 430V에 비해 매우 높았다. Ni/6H-SiC Schottky 다이오드의 경우, 산화막으로 모서리 단락시켰을 때와 시키지 않았을 때의 역방향 항복전압은 각각, 920V와 160V 였다. 고온에서의 소자 특성도 매우 좋아서 Ni/4H-SiC Schottky 다이오드와 Ni/6H-SiC Schottky 다이오드 모두 300℃까지 전류 특성의 변화가 거의 없었으며 550℃에서도 양호한 정류 특성을 보였다. 상온에서의 Schottky barrier height와 이상인자(ideality factor) 및 specific on-resistance는 Ni/4H-SiC의 경우는 1.55eV, 1.3, 3.6×10/sup -2/Ω·㎠이었으며 Ni/6H-SiC Schottky 다이오드의 경우에 1.24eV, 1.2, 2.6×10/sup -2Ω·㎠/로 나타났다. 실험 결과 Ni/4H-SiC 및 Ni/6H-SiC Schottky 다이오드 모두 고온, 고전압 소자로서 우수한 특성을 나타냄이 입증되었다.

• 한국재료학회지
• /
• 제18권9호
• /
• pp.482-485
• /
• 2008

Tetragonal-$Ni_{1-x}Pd_x$Si/Si (001) structure was studied by using density functional theory (DFT). An epitaxial interface between $2{\times}2{\times}4$ (001) tetragonal-NiSi supercell and $1{\times}1{\times}2$ (001) Si supercell was first constructed by adjusting the lattice parameters of B2-NiSi structure to match those of the Si structure. We chose Ni atoms as a terminating layer of the B2-NiSi; the equilibrium gap between the tetragonal-NiSi and Si was calculated to be 1.1 ${\AA}$. The Ni atoms in the structure moved away from the original positions along the z-direction in a systematic way during the energy minimization. Two different Ni sites were identified at the interface and the bulk, respectively. The two Ni sites at the interface have 6 and 7 coordination numbers. The Ni sites with coordination number 6 at the interface were located farther away from the interface, and were more favorable for Pd substitution.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2002년도 하계학술대회 논문집
• /
• pp.288-291
• /
• 2002

Application of metal silicides such as TiSi$_2$ and CoSi$_2$ as contacts and gate electrodes are being studied. However, TiSi$_2$ due to the linewidth-dependance, and CoSi$_2$ due to the excessive Si consumption during silicidation cannot be applied to the deep-submicron MOSFET device. NiSi shows no such problems and can be formed at the low temperature. But, NiSi shows thermal instability. In this investigation, NiSi was formed with a Ti-capping layer to improve the thermal stability. Ni and Ti films were deposited by the thermal evaporator. The samples were then annealed in the N$_2$ ambient at 300-800$^{\circ}C$ in a RTA (rapid thermal annealing) system. Four point probe, FESEM, and AES were used to study the thermal properties of Ti-capped NiSi layers. The Ti-capped NiSi was stable up to 700$^{\circ}C$ for 100 sec. RTA, while the uncapped NiSi layers showed high sheet resistance after 600$^{\circ}C$. The AES results revealed that the Ni diffusion further into the Si substrate was retarded by the capping layer, resulting in the suppression of agglomeration of NiSi films.

• 열처리공학회지
• /
• 제14권1호
• /
• pp.1-7
• /
• 2001

A method to simultaneously synthesize and consolidate the silicide $NiSi_2$ and the composite $NiSi_2$-20vol.%Nb from powders of Ni, Si, and Nb was investigated. Combustion synthesis was carried out under the combined effect of an electric field and mechanical pressure. The final density of the products increased nearly linearly with the applied pressure. Highly dense $NiSi_2$ and $NiSi_2$-20vol.%Nb with relative densities of up to 97% were produced under the simultaneous application of a 60MPa pressure and a 3000A current on the reactant powders. The respective Vickers microhardness values for these materials were 6.0 and 5.8 GPa. From indentation crack measurements, the fracture toughness values for $NiSi_2$ and $NiSi_2$-20vol.%Nb were calculated to be 3.3 and 4.7 $MPa{\cdot}m^{1/2}$, respectively.

• 한국결정성장학회지
• /
• 제6권1호
• /
• pp.62-72
• /
• 1996

SiC와 금속박막간의 계변형성 및 반응 생성물의 구조가 $5500^{\circ}C$에서 $1450^{\circ}C$의 온도 범위에서 조사되어졌다. SiC와 코발트간의 반응에 있어서 전형척인 반응충의 순서는 $1050^{\circ}C$에서 $1250^{\circ}C$까지의 온도 범위에서 CoSi/CoSi+C/CoSi/CoSi+C/ $\cdots$ /SiC이었고, SiC와 니켈간의 반응에 있어셔 전형적인 반응충의 순셔는 $950^{\circ}C$에서 $1050^{\circ}C$까지의 온도 범위에서 $Ni_2Si/Ni_2Si+C/Ni_2Si/Ni_2Si+C/ {\cdots} /SiC$이었다. 탄소의 결정화가 SiC / Co 반응에 있어서논 $1450^{\circ}C$ 이상에서 그리고 SiC/Ni 반응에 였어서는 $1250^{\circ}C$ 이상에서 바깐면으로 우선적으로 석출되였다. 또한, 탄 소석출거동을 동반한 주기적인 띠구조의 형성 기구가 열역학적인 고찰을 통하여 논하여졌다.