• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1163-1167
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• 2008

Since Samsung SDI and Sony started mass production of AM-OLED display for mobile/TV applications, OLED technology has emerged as leading candidate among the many technologies under development for next generation Flat panel displays. P-OLED (Polymer Organic Lighting Emitting Diode) technology, a class of OLED, is gathering momentum towards commercialization. P-OLED technology has made tremendous progress in terms of display performance (including life time, efficiency and color gamut) and in the maturity of ink jet printing process and equipment. In order to get into the mobile/TV application market successfully, P-OLED display technology must meet the following display makers' requirements: (1) P-OLED Display Performance in terms of lifetime, efficiency, and color coordinates, (2) Low Cost Manufacturing Technology such as "Solution Processable Printing Technology". P-OLED technology has already overcome many of the hurdles to mass manufacturing. In this paper, the latest developments in ink jet printing technology, including P-OLED material performance, is discussed.

• 한국정보디스플레이학회:학술대회논문집
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• 2001.08a
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• pp.3-8
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• 2001

This paper will review the state of the latest development of AMLCD manufacturing facilities for large Substrate and discuss the future technologies. The trend of the display size enlargement of Note book PC has hauled the enlargement of the mother glass substrate in past 10 years. The enlargement of a substrate size has brought about the productivity improvement of the TFT panel with process innovation as yet. Will this trend be continuing hereafter too? The issues of the processing and facilities related with the large square substrate and mask step reduction will be overviewed and the future processing and facilities will be discussed.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.867-872
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• 2005

High-pixel-density displays are now under development to meet the needs of next-generation mobile devices; methods to more efficiently build such displays are described. Displays based on subpixel rendering and RGBW technologies, known as PenTile $Matrix^{TM}$ RGBW, are shown to offer the best approach to meeting the demanding requirements of low manufacturing cost, high brightness, and low power.

• Proceedings of the IEEK Conference
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• 1999.11a
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• pp.739-742
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• 1999

This study is to increase capability of the DC/DC converter (for PCS) in miniaturizing, stabilizing by locating an inductor with the structure of multi layer on to the glass/ceramic circuit board. When the DC/DC converter is stimulated. the characteristic operation of PWM switching circuit, losses. output power to input power, stability, efficiency and interfaces inside of control circuit and convener circuit are to be distinguished. The process would make it able to develop the techniques of designing and manufacturing of the converter of next generation.

• Journal of Welding and Joining
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• v.20 no.3
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• pp.46-53
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• 2002

The expolitation of substitute material and new manufacturing technology of the automobile body panel for next generation cars have been steadily professed by advanced automobile companies. High strength steel of TRIP (Transformation of Induced Plasticity) type is developed in response to demands about crash safety and high strength of automobile. In this study, basic technologies can fix up problems occurring on the mass production and applied to the other forming methods will be prepared through rasping a property of TRIP material.

• Journal of the Korea Society of Computer and Information
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• v.20 no.10
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• pp.7-13
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• 2015

Wearable device, next generation smart device, is consistently growing. The flexible display will be a kind of display in the wearable device. The flexible display technology is now evolving with end-user requirement such as portability and easy installation. Previous wearable display products still have some difficulties in manufacturing and in flexibility whole device. But it can be a flexible display with LED device and utilized in commercial area. In this paper, we propose a driver to control the LED display and implement a flexible LED display system.

• Advances in Computational Design
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• v.4 no.1
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• pp.43-52
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• 2019

Variation Analysis (VA) is used to simulate final product variation, taking into consideration part manufacturing and assembly variations. In VA, all the manufacturing and assembly processes are defined at the product design stage. Process Capability Data Bases (PCDB) provide information about measured variation from previous products and processes and allow the designer to apply this to the new product. A new challenge to this traditional approach is posed by the Industry 4.0 (I4.0) revolution, where Smart Manufacturing (SM) is applied. The manufacturing intelligence and adaptability characteristics of SM make present PCDBs obsolete. Current tolerance analysis methods, which are made for discrete assembly products, are also challenged. This paper discusses the differences expected in future factories relevant to VA, and the approaches required to meet this challenge. Current processes are mapped using I4.0 philosophy and gaps are analysed for potential approaches for tolerance analysis tools. Matching points of simulation capability and I4.0 intents are identified as opportunities. Applying conditional variations, incorporating levels of adjustability, and the un-suitability of present Monte Carlo simulation due to changed mass production characteristics, are considered as major challenges. Opportunities including predicting residual stresses in the final product and linking them to product deterioration, calculating non-dimensional performances and extending simulations for process manufactured products, such as drugs, food products etc. are additional winning aspects for next generation VA tools.

• Journal of the Semiconductor & Display Technology
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• v.14 no.3
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• pp.13-22
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• 2015

LED (Light Emitting Diode) lighting is gaining more and more market penetration as one of the global warming countermeasures. LED is the next generation of fusion source composed of epi/chip/packaging of semiconductor process technology and optical/information/communication technology. LED has been applied to the existing industry areas, for example, automobiles, TVs, smartphones, laptops, refrigerators and street lamps. Therefore, LED makers have been striving to achieve the leading position in the global competition through development of core source technologies even before the promotion and adoption of LED technology as the next generation growth engine with eco-friendly characteristics. However, there has been a point of view on the cost compared to conventional lighting as a large obstacle to market penetration of LED. Therefore, companies are developing a Chip-Scale Packaging (CSP) LED technology to improve performance and reduce manufacturing costs. In this study, we perform patent analysis associated with Flip-Chip CSP LED and flow chart for promising technology forecasting. Based on our analysis, we select key patents and key patent players to derive the business strategy for the business success of Flip-Chip CSP PKG LED products.

• International Journal of Control, Automation, and Systems
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• v.1 no.1
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• pp.1-10
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• 2003

This paper presents a high-precision magnetically levitated (maglev) stage to meet demanding motion specifications in the next-generation precision manufacturing and nanotechnology. Characterization of dynamic behaviors of such a motion stage is a crucial task. In this paper, we address the issues related to the stochastic modeling of the stage including transfer function identification, and noise/disturbance analysis and prediction. Provided are test results on precision dynamics, such as fine settling, effect of optical table oscillation, and position ripple. To deal with the dynamic coupling in the platen, we designed and implemented a multivariable linear quadratic regulator, and performed time-optimal control. We demonstrated how the performance of the current maglev stage can be improved with these analyses and experimental results. The maglev stage operates with positioning noise of 5 nm rms in $\chi$ and y, acceleration capabilities in excess of 2g(20 $m/s^2$), and closed-loop crossover frequency of 100 Hz.

• Textile Coloration and Finishing
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• v.24 no.3
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• pp.204-212
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• 2012

This study was used a thermogravimetric analyzer to determine thermal characteristics, a hair analysis system to examine morphological changes of wefts-human hair, poly vinyl chloride(PVC) and polyethylene terephthalate (PET)-used in manufacturing wigs. According to a flammability test on human hair and synthetic wefts for wigs, the best results were observed in human hair. According to a thermal test, PET was the best in terms of thermal stability. Also good tensile strength was observed as well. In a scanning electron microscope observation, no human hair scale layer was found because of chemical treatment. In the PVC sample, homogeneous unevenness was observed. Due to a lack of human hair supply and increase in its price, recently, PET weft has emerged as a great substitution for human hair. Because it can be curled using an electric curling device and is more efficient than the conventional non-flammable material PVC in terms of thermal resistance, it will become the next-generation weft for wigs.