• 한국주조공학회지
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• 제35권6호
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• pp.170-177
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• 2015

Segregation during solidification and homogenization during thermal exposure in GTD 111 were investigated. The microstructures of as-cast, standard heat-treated, and thermally exposed specimens were observed by SEM. A compositional analysis of each specimen was conducted by EDS. The dendrite core was enriched in W and Co, though lower levels of Ti and Ta were observed. An unexpected phase, in this case like the ${\eta}$ phase, was observed due to segregation near the ${\gamma}-{\gamma}^{\prime}$ eutectic in the standard heat-treated specimen. Segregation also induced microstructural evolution near the ${\gamma}-{\gamma}^{\prime}$ eutectic during the standard heat treatment. A quantitative analysis and microstructural observations showed that the thermal exposure at a high temperature enhanced the chemical homogeneity of the alloy.

• Journal of Welding and Joining
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• 제18권2호
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• pp.86-94
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• 2000

This study was performed to investigate types and formation mechanism of cracks in two Al alloy welds, A5083 and A7N01 spot-welded by pulse Nd : YAG laser, using SEM, EPMA and Micro-XRD. In the weld zone, three types of crack were observed : center line crack({TEX}$C_{C}${/TEX}), diagonal crack({TEX}$C_{D}${/TEX}), and U shape crack({TEX}$C_{U}${/TEX}). Also, HAZ crack({TEX}$C_{H}${/TEX}) was observed in the HAZ region, furthermore, mixing crack({TEX}$C_{M}${/TEX}) consisting of diagonal crack and HAZ crack was observed. White film was formed at th hot crack region in the fractured surface after it was immersed to 10% NaOH water. In the case of A5083 alloy, white films in {TEX}$C_{C}${/TEX} crack and {TEX}$C_{D}${/TEX} crack region were composed of low melting phases, {TEX}$Fe_{2}SiAl_{8}${/TEX} and eutectic phases, $Mg_2$Al$_3$ and $Mg_2$Si. Such films observed $CuAl_2$, {TEX}$Mg_{32}(Al,Zn)_{3}${/TEX}, MgZn$_2$, $Al_2$CuMg and $Mg_2$Si were observed in the whitely etched films near {TEX}$C_{C}${/TEX} crack and {TEX}$C_{D}${/TEX} crack regions. The formation of liquid films was due to the segregation of Mg, Si, Fe in the case of A5083 alloy and Zn, Mg, Cu, Sim in the case of A7N01 alloy, respectively. The {TEX}$C_{C}${/TEX} and {TEX}$C_{D}${/TEX} cracks were regarded as a result of the occurrence of tensile strain during the welding process. The formation of {TEX}$C_{M}${/TEX} crack is likely to be due to the presence of liquid film at the grain boundary near the fusion line in the base metal as well as in the weld fusion zone during solidification. The {TEX}$C_{U}${/TEX} crack is considered a result of the collapsed keyhole through incomplete closure during rapid solidification.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1999년도 춘계학술대회논문집
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• pp.199-202
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• 1999

Many processing times for fabricating complex shaped parts by near net shape process such as thixoforming or semi-solid forming, are required due to the time for die design, induction heating and forming process. Therefore, for the thixoforming process, multi-capacity induction heating process is very important due to the reduction of the processing time and cost. It is indispensable to adopt a power-time heating pattern which manages to conciliate complete eutectic melting at the core with limited overheating at the periphery. The total reheating time is thus dependent on billet diameter; in inches$(pm20%)$. Typically, high frequency is used for the rapid reheating of the billet to the eutectic temperature range and low frequency for the remelting of the desired fraction of liquid and for the radial homogeneization of the liquid fraction. So in this study, the multi-capacity induction heating conditions of ALTHIX 86s alloy to reduce the processing time and cost would be proposed. The suitability of multi-capacity induction heating conditions would be verified through the comparison to Garat's data.

• 한국주조공학회지
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• 제18권6호
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• pp.570-577
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• 1998

An investigation has been conducted to describe solidification characteristics in Sn-Zn binary system and Sn-Zn-Ag ternary system added by Ag produced by the continuous casting process using heated mold as a basic study for developing Pb-free solder materials. To obtain the continuous casting rods with mirror surface and near net shape at higher casting speed, water flow rates must be increased and mold temperature must be lowered. However, surface tearing in the casting rods occured at lower continuous casting speed while break out occured at higher continuous casting speed even if optimum conditions such as water flow rate and heated mold temperature are determined. Primary ${\alpha}Sn$ and eutectic structure in unidirectioally solidified Sn-Zn alloys were finer with increased casting speed. But, directionality may not be expected for primary Zn in hypereutectic Sn-Zn alloy. It was found that the addition of $0.2{\sim}0.8%$ Ag promoted the growth of primary ${\alpha}Sn$ dendrites. The changes of tensile strength and elongation in Sn-Zn binary alloys were not observed while the increase of tensile strength and the decrease of elongation in Sn-Zn-Ag ternary alloys were observed with increased casting speed.

• 한국주조공학회지
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• 제15권5호
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• pp.483-493
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• 1995

The microstructural changes during semi-solid state processing of hypereutectic Al-Si alloy has been investigated in the present study. Stirring of semi-solid slurry results in the morphological changes of the primary Si particles, i.e. from angular rod shape to near-spherical shape. Besides the spherodization of primary Si particles, the average particle size increases, especially, at much higher rate in the final stage than that in the early stage of stirring. Various microstructure characterization techniques, such as anisotropic etching, SEM imaging and ECP analysis, reveal that the spherodization of primary Si particles occurs by the combinations of the mechanisms of coalescence, fracture, and wear of the individual particles. Isothermal shearing of hypereutectic Al-Si at $580^{\circ}C$ shows that spherical ${\alpha}-Al$ particles are formed by the dissociation of Al-Si eutectic structure at the early stage of isothermal shearing. The spherical ${\alpha}-Al$ particles gradually grow by the mechanisms of Ostwald ripening and coalescence of the particles.

• 한국방사성폐기물학회:학술대회논문집
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• 한국방사성폐기물학회 2004년도 Proceedings of the 4th Korea-China Joint Workshop on Nuclear Waste Management
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• pp.165-169
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• 2004

It was studied on the reductive extraction between the eutectic salt and Bi metal phases. The solutes were zirconium and the rare earth elements, where zirconium was used as the surrogate for the transuranic(TRU) elements. All the experiments were performed in a glove box filled with argon gas. Two types of experimental conditions were used -high and low initial solute concentrations in salt. Li-Bi alloy was used as a reducing agent to reduce the high chemical activity of Li. The reductive extraction characteristics were examined using ICP, XRD and EPMA analysis. Zirconium was successfully separated from the rare earth elements by the reductive extraction method. The LiF-NaF-KF system was favorable among the fluoride salt systems, whereas the LiCl-KCl system was favorable among the chloride salt systems. When the solute concentrations were high, intermetallic compounds were found near the salt-metal interface.

• 대한금속재료학회지
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• 제47권8호
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• pp.500-507
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• 2009

Pb-free solder has recently been used in electronics in efforts to meet environmental regulations, and a number of Pb-free solder alloy choices beyond the near-eutectic SnAgCu solder are now available. With increased demand for thin and portable electronics, the high cost of alloys containing significant amounts of silver and their poor mechanical shock performance have spurred the development of low Ag SnAgCu solder, which provides improved mechanical performance at a reasonable cost. Although low Ag SnAgCu solder exhibits significantly higher fracture resistance under high-strain rates, little thermal fatigue data exist for this solder. Therefore, it is necessary to investigate thermal fatigue reliability of low Ag SnAgCu solder under variation of thermal stress in order to allow its implementation in electronic products with high reliability requirements. In this study, the reliability of Sn0.3Ag0.7Cu(SAC0307), a low Ag solder alloy, is discussed and compared with that of Sn3Ag0.5Cu(SAC305). Three sample types and six samples size are evaluated. Mechanical properties and microstructure of the solder joint are investigated under thermal shock cycles. It was observed that the mechanical strength of SAC0307 dropped slightly with thermal cycling relative to that of SAC305. This reveals that the failure mode of SAC0307 is different from that SAC305 under this critical condition.

• Nuclear Engineering and Technology
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• 제54권7호
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• pp.2720-2727
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• 2022

The Generation IV Lead-cooled fast reactor (LFR) take the liquid lead or lead-bismuth eutectic alloy (LBE) as the coolant of the primary cooling circuit. Combined with the natural characteristics of lead alloy and the design features of LFR, the system is the simplest and the number of equipment is the least, which reflects the inherent safety characteristics of LFR. The nuclear main coolant pump (MCP) is the only power component and the only rotating component in the primary circuit of the reactor, so the various operating characteristics of the MCP are directly related to the safety of the nuclear reactor. In this paper, various working conditions that may occur in the normal rotation (positive rotating) of the MCP and the corresponding internal flow characteristics are analyzed and studied, including the normal pump condition, the positive-flow braking condition and the negative-flow braking condition. Since the corrosiveness of LBE is proportional to the fluid velocity, the distribution of flow velocity in the pump channel will be the focus of this study. It is found that under the normal pump condition and positive-flow braking conditions, the high velocity region of the impeller domain appears at the inlet and outlet of the blade. At the same radius, the pressure surface is lower than the back surface, and with the increase of flow rate, the flow separation phenomenon is obvious, and the turbulent kinetic energy distribution in impeller and diffuser domain shows obvious near-wall property. Under the negative-flow braking condition, there is obvious flow separation in the impeller channel.

• 한국재료학회지
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• 제8권12호
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• pp.1165-1169
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• 1998

제1세대 니켈계 단결정 초합금인 CMSX 6를 사용하여 셀렉타법으로 진공 정밀주조하여 단결정을 제작하였다. 주형온도 약 150$0^{\circ}C$, 주입온도 약 163$0^{\circ}C$와 용탕 주입 직후 주형을 2.5mm/분 속도로 하강시켜 단결정을 성장시켰다. 단결정 주조조직에서 기지와 공정조직은 ${\gamma}$' 석출물(Ni$_3$(Al, Ti)) 모양과 크기에 따라 각각 모두 두영역으로 구분되었으며, 공정조직의 Ti함랗은 기지보다 높았다. 즉, EPMA 및 CBED 분석 등으로 ${\gamma}$' 석출물을 분석한 결과, 기지내의 ${\gamma}$'은 크기가 0.5~0.7$\mu\textrm{m}$ 이하이며 화학조성상 Ni$_3$Al에 가까웠으며 격자구조도 Ll$_2$를 나타내었다. 반면에 공정조직에 가까울수록 ${\gamma}$' 크기는 1.0$\mu\textrm{m}$보다 컸으며, 모양도 판상형의 거대한 모양으로 바뀌었다. 화학조성 또한 Ni$_3$Ti에 가까웠으며 격자구조도 D $O_{24}$를 나타내었으므로 수지상과 공정조직의 ${\gamma}$' 석출물은 화학조성 및 격자구조가 상이함을 알 수 있었다.

• 대한금속재료학회지
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• 제47권12호
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• pp.842-851
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• 2009

The long-term reliability of Sn-0.3wt%Ag-0.7wt%Cu solder joints was evaluated and compared with Sn-3.0wt%Ag-0.5wt%Cu under thermal shock conditions. Test vehicles were prepared to use Sn-0.3Ag-0.7Cu and Sn-3.0Ag-0.5Cu solder alloys. To compare the shear strength of the solder joints, 0603, 1005, 1608, 2012, 3216 and 4232 multi-layer ceramic chip capacitors were used. A reflow soldering process was utilized in the preparation of the test vehicles involving a FR-4 material-based printed circuit board (PCB). To compare the shear strength degradation following the thermal shock cycles, a thermal shock test was conducted up to 2,000 cycles at temperatures ranging from $-40^{\circ}C$ to $85^{\circ}C$, with a dwell time of 30 min at each temperature. The shear strength of the solder joints of the chip capacitors was measured at every 500 cycles in each case. The intermetallic compounds (IMCs) of the solder joint interfaces werealso analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). The results showed that the reliability of Sn-0.3Ag-0.7Cu solder joints was very close to that of Sn-3.0Ag-0.5Cu. Consequently, it was confirmed that Sn-0.3Ag-0.7Cu solder alloy with a low silver content can be replaced with Sn-3.0Ag-0.5Cu.