• 대한전자공학회논문지
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• 제26권11호
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• pp.1672-1678
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• 1989

Major problems preventing the device-quality GaAs/Si heterostructure are the lattice mismatch of about 4% and difference in thermal expansion coefficient by a factor of 2.64 between Si and GaAs. Ge is a good candidate for the buffer layer because its lattice parameter and thermal expansion coefficient are almost the same as those of GaAs. As a first step toward developing heterostructure such as GaAs/Ge/Si entirely by a home-built PAE (plasma-assisted epitaxy), Ge films have been deposited on p-type Si (100)substrate by the plasma assisted evaporation of solid Ge source. The characteristics of these Ge/Si heterostructure were determined by X-ray diffraction, SEM and Auge electron spectroscope. PAE system has been successfully applied to quality-good Ge layer on Si substrate at relatively low temperature. Furthermore, this system can remove the native oxide(SiO2) on Si substrate with in-situ cleaning procedure. Ge layer grown on Si substrate by PAE at substrate temperature of 450\ulcorner in hydrogen partial pressure of 10mTorr was expected with a good buffer layer for GaAs/Ge/Si heterostructure.

• 한국전기전자재료학회논문지
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• 제30권10호
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• pp.615-624
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• 2017

This study investigated the various physical and electrical effects of silicon direct bonding. Direct bonding means the joining of two wafers together without an intermediate layer. If the surfaces are flat, and made clean and smooth using HF treatment to remove the native oxide layer, they can stick together when brought into contact and form a weak bond depending on the physical forces at room temperature. An IR camera and acoustic systems were used to analyze the voids and bonding conditions in an interface layer during bonding experiments. The I-V and C-V characteristics are also reported herein. The capacitance values for a range of frequencies were measured using a LCR meter. Direct wafer bonding of silicon is a simple method to fuse two wafers together; however, it is difficult to achieve perfect bonding of the two wafers. The direct bonding technology can be used for MEMS and other applications in three-dimensional integrated circuits and special devices.

• 전자공학회논문지D
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• 제34D권3호
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• pp.1-8
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• 1997

The surface properties after plasma etching of TiW alloy using the chemistries of BCl$_{3}$ and SF$_{6}$ gases with varying mixing ratio have been investigated using XPS(X-ray photoelectron spectrocopy). The elements existed on the etched sampled have been extracted with BCL$_{3}$/SF$_{6}$ ratio and their chemical binding states have also been analysed. It was confirmed that the thickness of native oxide formed on the TiW films is thinner than 10nm by using Ar sputtering. At the same time, the roughness of etched surface has been esamnied using AFM (atomic force microscopy). on the basis of the basis of this results, the relations between the caanges of oxygen contents detected by XPS and the rouhness of etched surface have been discussed. And the etch rate and etched profile of Tiw films have been examined and the changes of the etch rate and etched prfile have been discussed with XPS results. From XPS results, the role of passivation layer consisted of Ti-S compound with XPS results. From XPS results, the role of passivation layer consisted of Ti-S compound has been proposed. Ti-S compound seems to make a role of passivation layer that surpresses Ti-O formation.ion.

• Asian-Australasian Journal of Animal Sciences
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• 제9권2호
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• pp.127-132
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• 1996

Effects on feed intake, liveweight gain and economic benefits of supplementing lambs with urea molasses blocks, were studied. Forty eight crossbred lambs were divided into 6 groups and assigned randomly to grazing on native pasture (CONT) or along with supplements of Commercial ration (COM) and urea molasses blocks (UMBs) containing two levels of cement and calcium oxide as a binding agent. Analysis of variance revealed highly significant (p<0.01) differences in dry matter (DMI, g/day), crude protein (CPI, g/day) and metabolizable energy (MEI, MJ/day) intakes. Differences in liveweight gain (LWG, g/day), feed conversion ratio (FCR) and net economic benefit of supplementation were also highly variable. The intake of DM, CP and ME varied from 974 to 1002, 66-70 and 7.6-8.4 in lambs supplemented with UMBs, significantly (p<0.01) greater than 848, 52.5 and 5.6 in lambs supplemented with COM or FCR and net economic benefits (54.3; 57.8; 17.1 and 1.96; 2.4) in lambs supplemented with COM and UMB-2, were CONT or supplemented with UMB-1, UMB-3 and UMB-4 respectively. Factors responsible for differences in feed intake, liveweight gain and economic benefits, are discussed.

• 한국진공학회지
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• 제6권1호
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• pp.97-102
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• 1997

이온-고체 표면 사이의 상호작용에 관한 연구를 수행하기 위하여 중 에너지 이온산 란 분광장치를 개발하였고 그 특성 평가를 수행하였다. 제작된 MEIS의 에너지 분해능은 $4\times 10^{-3}$으로 측정되었다. MEIS의 표면분석의 응용으로 60keVH+을 $Ta_2O_5$(300$\AA$)/Si에 적용하 여 에너지 손실인자와 깊이분해능을 얻은 결과는 42eV/$\AA$와 9.7$\AA$이었다. 또한, Si(100)표면 에 97.5KeV$H^+$이온을 random방향으로 입사시켜 이차원 스펙트럼을 얻었다.

• Progress in Superconductivity
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• 제3권1호
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• pp.49-55
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• 2001

Josephson junction arrays were fabricated by DC magnetron sputtering, self-aligning and reactive ion etching technique. The Al native oxide, formed by thermal oxidation, was used as the tunneling barrier of Nb/$Al-A1_2$$O_3$Nb trilayer. The arrays have 2,000 Josephson junctions with the area of $14\mu\textrm{m}$ $\times$ $46\mu\textrm{m}$. The gap voltages were in the range of 2.5 ~2.6 mV and the spread of critical current was $\pm$11~14%. When operated at 70~94 ㎓, the arrays generated zero-crossing steps up to 2.1~2.4 V. To improve transmission of microwave power and prevent diffusion of oxygen into Nb ground-plane while depositing $SiO_2$dielectric, we applied a plasma nitridation process to the Nb ground-plane. The microwave power was well propagated in Josephson junction arrays with nitridation. The difference in microwave transmission 7an be interpreted by the surface impedance change depending on nitridation.

• 대한의생명과학회지
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• 제26권2호
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• pp.109-113
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• 2020

Dangyuja (Citrus maxima (Burm.) Merr.) is a native fruit of great economic importance in Jeju island in Korea. To provide experimental evidence for the antioxidant and anti-inflammation properties on extraction ethanol concentration of Dangyuja, 2 cultivars, including 30-year-old and 120-year-old were evaluated. 30-year-old Dangyuja 50%, 70% ethanol extracts had the highest polyphenol and flavonoid content, and the strongest 2,2'-azino-bis (3-ethylbenzothiazoline-6-sulfonic acid) (ABTS) radical scavenging activity. To investigate the anti-inflammatory activity of Dangyuja ethanol extracts, we used BV-2 microglia cells and induced inflammation using lipopolysaccharide (LPS). Then, we measured levels of inflammatory mediators as nitric oxide (NO). Among the 6 extracts, 30-year-old Dangyuja 50% ethanol extracts show the highest anti-inflammatory activity. The results suggest that 30-year-old Dangyuja 50% ethanol extracts provides significant health benefits and may be used for developing new functional materials.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.17-18
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• 2005

실리콘 기판 위에 100nm의 선폭을 갖는 선들이 일정한 간격을 가지고 연속적으로 배열되어 있는 구조를 형성시켜 보았다. PMMA가 코팅되어 있는 실리콘 기판위에 전자빔으로 패턴을 하였고, 건식에칭을 통해 구조물을 형성한 후 원자 현미경으로 관찰하였다. 이러한 나노구조물의 구현은 전자빔 패터닝시에 전자빔이 실리콘 기판에 충돌할 때 나타나는 backward scattering과 proximity 효과 등의 영향으로 인해 pitch의 크기가 작아질수록 구현하기가 쉽지 않았다. 화합물반도체 단일 나노선 소자를 제작하여 소자의 전기적 특성을 측정할 때, 나노선 표면에 있는 자연산화막은 금속전극과 나노선 사이의 전기전도특성을 저해하는 요소로 알려져 있다. 이러한 자연산화막을 제거하기 위해 나노선을 건식에칭해 보았고, 원자현미경을 통해 에칭에 따른 나노선의 모양변화를 관찰하였다.

• 소성∙가공
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• 제12권7호
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• pp.640-646
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• 2003

The nanoprobe based on lithography, mainly represented by SPM based technologies, has been recognized as potential application to fabricate the surface nanostructures because of its operational versatility and simplicity. The objective of the work is to suggest new mastless pattern fabrication technique using the combination of machining by nanoindenter and KOH wet etching. The scratch option of the nanoindenter is a very promising method for obtaining nanometer scale features on a large size specimen because it has a very wide working area and load range. Sample line patterns were machined on a silicon surface, which has a native oxide on it, by constant load scratch (CLS) of the Nanoindenter with a Berkovich diamond tip, and they were etched in KOH solutions to investigate chemical characteristics of the machined silicon surface. After the etching process, the convex structure was made because of masking effect of the affected layer generated by nano-scratch. On the basis of this fact, some line patterns with convex structures were fabricated. Achieved patterns can be used as a mold that will be used for mass production processes such as nanoimprint or PDMS molding process. All morphological data of scratch traces were scanned using atomic force microscope (AFM).

• Journal of the Optical Society of Korea
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• 제19권3호
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• pp.217-221
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• 2015

Developing a metallization that has low cost and high efficiency is essential in solar-cell industries, to replace expensive silver-based metallization. Ni/Cu two-step metallization is one way to reduce the cost of solar cells, because the price of copper is about 100 times less than that of silver. Alkaline electroless plating was used for depositing nickel seed layers on the front electrode area. Prior to the nickel deposition process, 2% HF solution was used to remove native oxide, which disturbs uniform nickel plating. In the subsequent step, a nickel sintering process was carried out in $N_2$ gas atmosphere; however, copper was plated by light-induced plating (LIP). Plated nickel has different properties under different bath conditions because nickel electroless plating is a completely chemical process. In this paper, plating bath conditions such as pH and temperature were varied, and the metal layer's structure was analyzed to investigate the adhesion of Ni/Cu metallization. Average adhesion values in the range of 0.2-0.49 N/mm were achieved for samples with no nickel sintering process.