• Composites Research
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• v.20 no.5
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• pp.49-55
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• 2007

Nanocomposite blade for dicing semiconductor wafer is investigated for micro/nano-device and micro/nano-fabrication. While metal blade has been used for dicing of silicon wafer, polymer composite blades are used for machining of quartz wafer in semiconductor and cellular phone industry in these days. Organic-inorganic material selection is important to provide the blade with machinability, electrical conductivity, strength, ductility and wear resistance. Maintaining constant thickness with micro-dimension during shaping is one of the important technologies fer machining micro/nano fabrication. In this study the fabrication of blade by wet processing of mixing conducting nano ceramic powder, abrasive powder phenol resin and polyimide has been investigated using an experimental approach in which the thickness differential as the primary design criterion. The effect of drying conduction and post pressure are investigated. As a result wet processing techniques reveal that reliable results are achievable with improved dimension tolerance.

• Korean Chemical Engineering Research
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• v.54 no.3
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• pp.410-418
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• 2016

In this study, we prepared electrically conducting composites using epoxy resin of diglycidyl ether of bisphenol A (DGEBA) as a matrix, triethylenetetramine (TETA) as a hardener and nickel powder or multi-walled carbon nanotubes (MWCNTs) grafted with $-NH_2$ groups (MWCNT-$NH_2$) as electrically conducting fillers. Electrical conductivity of composite films were measured by coating on the slide glass with a doctor blade. We measured modification reactions of MWCNT and reaction of MWCNT-$NH_2$ with DGEBA epoxy resin by fourier transform infrared spectrometer (FTIR), thermogravimetric analyzer (TGA) and elemental analyzer (EA). Morphology of composites was investigated by scanning electron microscope (SEM) and sheet resistances of composites were measured by 4-point probe. We found $(9.87{\pm}1.09){\times}10^4{\Omega}/sq$ of sheet resistance for epoxy composite containing both 40 wt% nickel powder and 0.5 wt% of MWCNT-$NH_2$ as fillers, equivalent to epoxy composite containing 53.3 wt% nickel powder only as a filler.