• Title/Summary/Keyword: Nano-injection Molding

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Development of Micro mold with Electroplating Ni for Injection molding (사출 성형을 위한 니켈 도금을 수행한 마이크로 몰드의 개발)

  • Hwang, Kyo-Il;Kim, Hun-Mo
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.2 s.179
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    • pp.138-145
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    • 2006
  • An injection molding is necessary to mass-product for micro-nano system, so micro-nano mold must be developed for injection molding. The micro-nano mold has precision and strength to overcome a surround of injection. So in this paper, two methods were used. First, after etching the Al, Ni was electroplated in etched AI. The other, LIGA method was used. A temperature and thickness of Ni are important factors in these methods. So after fabrication, the simulation was processed to find optimal thickenss of Ni and temperature.

Injection Molding of Hydrophobic Plastic Plates (사출 성형에 의한 소수성 플라스틱 기판 제작)

  • Yoo, Y.E.;Lee, K.H.;Yoon, J.S.;Choi, D.S.;Kim, S.K.
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1563-1565
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    • 2008
  • Hydrophobic plastic plates employing nano surface features are injection molded using thermoplastic materials. A variotherm molding process is devised for filling the nano pores and releasing the molded nano features from the master. The size of the molded nano surface features are about 100nm in diameter and 200nm in height. The size of the molded plate is about 30mm x 30mm and the thickness is 1mm. As molding materials, Polypropylene, PMMA, COC and PC are employed, which are all typical commodity thermoplastic materials. The mold temperature(stamper temperature) is investigated as a major processing parameter for molding high aspect ratio nano surface features. Almost fully molded nano features are fabricated above a certain level of mold temperature depends on the employing material. The contact angles on the injection molded plates are measured to estimate the hydrophobicity and found to have higher contact angle up to 180% compared to the blank plate with no surface features.

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Development of the DNA Sequencing Chip with Nano Pillar Array using Injection Molding (Nano Pillar Array 사출성형을 이용한 DNA 분리 칩 개발)

  • Kim S.K.;Choi D.S.;Yoo Y.E.;Je T.J.;Kim T.H.;Whang K.Y.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1206-1209
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    • 2005
  • In recent, injection molding process for features in sub-micron scale is under active development as patterning nano-scale features, which can provide the master or stamp for molding, and becomes available around the world. Injection molding has been one of the most efficient processes for mass production of the plastic product, and this process is already applied to nano-technology products successfully such as optical storage media like DVD or BD which is a large area plastic thin substrate with nano-scale features on its surface. Bio chip for like DNA sequencing may be another application of this plastic substrate. The DNA can be sequenced using order of 100 nm pore structure when making the DNA flow through the pore structure. Agarose gel and silicon based chip have been used to sequence the DNA, but injection molded plastic chip may have benefit in terms of cost. This plastic DNA sequencing chip has plenty of pillars in order of 100 nm in diameter on the substrate. When the usual features in case of DVD or BD have very low aspect ratio, even less than 0.5, but the DNA chip will have relatively high aspect ratio of about 2. It is not easy to injection mold the large area thin substrate with sub-micron features on its surface due to the characteristics of the molding process and it becomes much more difficult when the aspect ratio of the features becomes high. We investigated the effect of the molding parameters for injection molding with high aspect ratio nano-scale features and injection molded some plastic DNA sequencing chips. We also fabricated PR masters and Ni stamps of the DNA chip to be used for molding

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Investigation on micro/nano filling behavior in LGP injection molding (LGP 사출성형 시의 미세충전 특성해석)

  • Cho, K.C.;Shin, H.G.;Kim, H.Y.;Kim, B.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2006.05a
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    • pp.91-94
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    • 2006
  • In this paper, in order to get micro or nano size optical patterns, an analytical and experimental investigation on a LGP (light guide plate) injection molding process has performed. The LGP, which diffusing and emitting the light from the CCFL or the LEDs to the panel front direction uniformly, typically has an under 1mm thick base substrate and numerous 60 to $170{\mu}m$ width and 6 to $10{\mu}m$ thick dot patterns on it. Generally, the small size LGPs, for mobile devices, have been and are being made of PMMA through the injection molding process. However, the substrate thickness and the dot pattern size are decreasing, it becomes hard to fill the micro to sub-micro cavities completely. To investigate the flow behavior of resin in micro/nano cavities and identify the characteristics of the LGP injection molding process, we carried out the flow analyses with respect to the variations of the substrate thickness, the dot pattern size and the pitch of a cavity.

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Active Control of Injection Mold Temperature using the Peltier Device (펠티어 소자를 이용한 사출 금형의 온도제어)

  • Cho, C.Y.;Shin, H.G.;Park, D.Y.;Hong, N.P.;Kim, B.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2007.05a
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    • pp.183-186
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    • 2007
  • The injection molding process has high accuracy and good reproducibility that are essential for mass production at low cost. Conventional molding processes typically use the water-based mold heating and air cooling methods. However, in the nano injection molding processes, this semi-active mold temperature control results in the several defects such as air-flow mark, non-fill, sticking and tearing, etc. Therefore, in order to control temperature of the molds actively and improve the quality of the molded products, the novel nano injection molding system, which uses active heating and cooling method, has been introduced. By using the Peltier devices, the temperature of locally adiabatic molds can be controlled dramatically and the quality of the molded patterns can be improved.

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Effects of the mold surface heating methods for the DVD stamper with nano pattern on the transcription of the injection molded parts using COC and PMMA plastics (나노패턴을 갖는 DVD용 스템퍼의 표면가열방식이 COC, PMMA 수지를 이용한 사출성형품의 전사성에 미치는 영향)

  • 김동학;유홍진;김태완
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.5 no.3
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    • pp.218-222
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    • 2004
  • We developed the stamper structured mold with moving core type with nano pattern. Among the factors affecting the quality of injection molding plastic parts, We studied the effects of moving core surface heating method on the transcription of injection molding plastic parts with nano structures. Moving core surface heating has been tested by three different methods. The first was conventional injection molding process without heating moving core surface, the second was halogen lamp radiation heating process and the last was MmSH process using gas flame. As a result of making injection molded parts by using thermoplastic amorphous resins such as COC, PMMA, MmSH method which is the most high temperature of moving core surface showed the best nano pattern transcription of the three methods, but the outcome of conventional injection molding process was not better than others.

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Micro Metal Injection Molding Using Hybrid Micro/Nano Powders

  • Nishiyabu, Kazuaki;Kakishita, Kenichi;Osada, Toshiko;Tanaka, Shigeo
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09a
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    • pp.36-37
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    • 2006
  • This study aims to investigate the usage of nano-scale particles in a micro metal injection molding ($\mu$-MIM) process. Nanoscale particle is effective to improve transcription and surface roughness in small structure. Moreover, the effects of hybrid micro/nano particles, Cu/Cu and SUS/Cu were investigated. Small dumbbell specimens were produced using various feedstocks prepared by changing binder content and fraction of nano-scale Cu particle (0.3 and $0.13{\mu}m$ in particle size). The effects of adding the fraction of nano-scale Cu powder on the melt viscosity of the feedstock, microstructure, density and tensile strength of sintered parts were discussed.

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