• Journal of Powder Materials
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• v.19 no.5
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• pp.343-347
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• 2012

In this study, an oxygen plasma treatment was used as a low temperature debinding method to form a conductive copper feature on a flexible substrate using a direct printing process. To demonstrate this concept, conductive copper patterns were formed on polyimide films using a copper nanoparticle-based paste with polymeric binders and dispersing agents and a screen printing method. Thermal and oxygen plasma treatments were utilized to remove the polymeric vehicle before a sintering of copper nanoparticles. The effect of the debinding methods on the phase, microstructure and electrical conductivity of the screen-printed patterns was systematically investigated by FE-SEM, TGA, XRD and four-point probe analysis. The patterns formed using oxygen plasma debinding showed the well-developed microstructure and the superior electrical conductivity compared with those of using thermal debinding.

• Journal of Powder Materials
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• v.23 no.3
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• pp.228-234
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• 2016

Copper nanoparticles attract much attention as substitutes of noble metals such as silver and can help reduce the manufacturing cost of electronic products due to their lower cost and good conductivity. In the present work, the chemical reduction is examined to optimize the synthesis of nano-sized copper particles from copper sulfate. Sodium borohydride and ascorbic acid are used as reducing and antioxidant agents, respectively. Polyethylene glycol (PEG) is used as a size-control and capping agent. An appropriate dose of PEG inhibits the abnormal growth of copper nanoparticles, maintaining chemical stability. The addition of ascorbic acid prevents the oxidation of nanoparticles during synthesis and storage. Transmission electron microscopy (TEM) and Fourier transform infrared spectroscopy (FTIR) are used to investigate the size of the synthesized nanoparticles and the coordination between copper nanoparticles and PEG. For chemical reduction, copper nanoparticles less than 100 nm in size without oxidized layers are successfully obtained by the present method.

• Advances in nano research
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• v.4 no.2
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• pp.113-128
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• 2016

Luminescent metallic clusters have attracted great interest due to their unique optical, electronic and chemical features. Comparing with intensively studied Au and Ag Clusters, Cu clusters are superior in the aspects of cost and wide industrial demanding. However, tiny copper clusters are extremely prone to aggregate and undergo susceptibility of oxidation, thereby the synthesis of fluorescent zero valent copper clusters is rather challenging. In this review, synthetic strategies towards luminescent copper clusters, including macromolecule-protection and micro molecule-capping, have been systematically surveyed. Both "bottom-up" and "top-down" synthetic routes are found to be effective in fabricating luminescent copper clusters, some of which are quite stable and possess decent luminescence quantum yields. In general, the synthesis of fluorescent copper clusters remains at its infant stage. A great deal of effort on developing novel and economic synthetic routes to produce bright and stable copper clusters is highly expected in future.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.344-345
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• 2015

Various concentration of copper was dopped in Fe-35%Ni thin sheet by electroforming and their electromagnetic, surface properties were determined. Microstructure observation by scanning electron microscopy revealed that the thin sheet had columnar grains with about 150 nm long. Phase analysis by X-ray diffractometry revealed that the alloy thin sheets were fine crystalline. The average surface roughnesses measured by atomic force microscopy (AFM) were about 14.38 nm. Nano hardnesses determined by tribo-nano indenter were 4.13 GPa. The surface resistances were 2.28 ohm/sq. The maximum magnetization, residual magnetization and coercive force depended on the copper concentration.

• Applied Chemistry for Engineering
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• v.16 no.4
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• pp.485-490
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• 2005

Effects of gas injectino on the copper recovery form industrial waste water in a fluidized-bed electrolytic reactor were investigated. Effects of gas injection on the individual phase holdup and efficiency of copper recovery for given operating variables such as liquid and gas velocity (0.1~0.4 cm/s), current density ($2.0{\sim}3.5A/dm^2$) and amount of fluidized solid particles (1.0~4.0 wt%) were examined. The solid particle, whose diameter and swelling density were 0.5 mm and $1100kg/m^3$, respectively, was made of polystylene and divinyl benzene. It was found that the holdup of gas and solid phases increased, but that of the liquid phase decreased with increasing velocity of gas injected into the reactor. With increasing gas and/or liquid velocity and increasing amount of fluidized particles is not needed, the rate of copper recovery increased to a maximum value of and subsequently decreased. The recovery rate of copper increased almost linearly with increasing current density in accordance with Faraday's law.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.486-486
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• 2009

In this paper, the current-voltage (I-V) curves, such as linear sweep voltammetry (LSV) and cyclic voltammetry (CV), were employed to evaluate the effect of electrolyte concentration on the electrochemical reaction trend. From the I-V curve, the electrochemical states of active, passive, transient and trans-passive could be characterized. And then, we investigated that how this chemical affect the process of voltage-induced material removal in electrochemical mechanical polishing (ECMP) of Copper. The scanning electron microscopy (SEM) and energy dispersive spectroscopy EDS) analyses were used to observe the surface profile. Finally, we monitored the oxidation and reduction process of the Cu surface by the repetition of anodic and cathodic potential from cyclic voltammetry (CV) method in acid- and alkali-based electrolyte. From these analyses, it was important to understand the electrochemical mechanisms of the ECMP technology.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.5
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• pp.616-621
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• 2010

New type of the base material of the light-emitting diode requires copper wafer in view of heat and electrical conductance. Therefore, polishing process of the substrate level is needed to get a nanometer level of surface roughness as compared with pattern structure of nano-size in the semiconductor industry. In this paper, a series of lapping and polishing technique is shown for the rough and deflected copper substrate of thickness 3mm. Lapping by sand papers tried air cooling method. And two steps of polishing used the diamond abrasives and the $Al_2O_3$ slurry of size 100mm considering the residual scratch. White-light interferometer proved successfully a mirror-like surface roughness of Ra 6nm on the area of $0.56mm{\times}0.42mm$.

• Membrane and Water Treatment
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• v.7 no.6
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• pp.555-571
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• 2016

Heavy metal contamination has attracted considerable attention during recent decades due to the potential risk brought about for human beings and the environment. Several adsorbent materials are utilized for the purification of contaminated water resources among which chitosan is considered as an appropriate alternative. Copper is a heavy metal contaminants found in several industrial wastewaters and its adsorption on porous and macroporous chitosan membranes is investigated in this study. Membranes are prepared by phase inversion and particulate leaching method and their morphology is characterized using SEM analysis. Batch adsorption experiments are performed and it is found that copper adsorption on macroporous chitosan membrane is higher than porous membrane. The iso-steric heat of adsorption was determined by analyzing the variations of temperature to investigate its effect on adsorption characteristics of macroporous chitosan membranes. Furthermore, desorption experiments were studied using NaCl and EDTA as eluants. The mechanism of copper adsorption was also investigated using XPS spectroscopy which confirms simultaneous occurrence of chelation and electrostatic adsorption mechanisms.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.05a
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• pp.40-44
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• 2002

The motivation of this work is to use SAM(Self-Assembled Monolayer) for developing a rapid and flexible non-photolithographic nano-structure fabrication technique which can be utilized in micro-machining of metals as well as silicon-based materials. The fabrication technique implemented in this work consists of a two-step process, namely, mechanical scribing followed by chemical etching. From the experimental results, it was found that thiol on copper surface could be removed even under a few nN normal load. The nano-tribological characteristics of thiol-SAM on various metals were largely dependent on the native oxide layer of metals. Based on these findings, nano-patterns with sub-micrometer width and depth on metal surfaces such as Cu, Au and Ag could be obtained using a diamond-coated tip.

• Journal of the Korean Magnetics Society
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• v.17 no.2
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• pp.99-102
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• 2007

The Cu oxide nano powders were synthesized by levitational gas condensation (LGC) method and their high heterogeneous catalytic effects of oxidation of 2,3,5-trimethyl-1,4-hydroquinone (TMHQ) and catalase activity were studied. The nano powders consist of mainly $Cu_2O$. The catalytic effect which was clarified by the oxidation of TMHQ and the activity of catalase, was found to depend on the amount of $Cu_2O$ phase and the particle size.