• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.989-992
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• 2004

A new method is proposed to fabricate a reusable qualtz master with order of 100 nm dot pattern on its surface. Some fabrication conditions such as dose are investigated to find optimal condition. This reusable qualtz master is used directly as a stamper to injection mold the dot patterns. Polycarbonate and Polyoxymethylene are used as molding materials and the effect of the mold temperature is also investigated to see the moldabilty of the injection molding for very fine dot features.

• 한국금형공학회:학술대회논문집
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• 한국금형공학회 2008년도 하계 학술대회
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• pp.35-38
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• 2008

A pattern master and a Ni stamper for 50nm class of patterns are fabricated through e-beam lithography and Ni electroforming process. A model pattern set is designed, which is based on unit patterns of 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The e-beam process is optimized to fabricate designed patterns with some parameters including dose, accelerating voltage, focal distance and developing time. For Ni electroforming to fabricate Ni stamper, a seed layer, a conducting layer, is deposited first on the pattern master fabricated by an e-beam lithography process. Ni, Ti/Ni and Cr are first tested to find optimal seed layer process. Currently the best result is obtained when adopting Cr deposited to be 100nm thick with continuous tilting motion of the master substrate during the deposition process.

• 한국산학기술학회논문지
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• 제5권3호
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• pp.218-222
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• 2004

본 연구에서는 분리형 이동코어 방식의 스탬퍼 금형을 개발하였고, 사출성형품 품질에 영향을 주는 인자 중에 이동코어 표면 가열 방식이 미세구조를 갖는 성형품 전사성에 미치는 영향에 대해 알아보았다. 이동코어 표면 가열방식은 이동코어를 가열하지 않는 일반사출방식, 할로겐램프를 이용한 복사형 가열방식과 기체화염을 이용해 가열하는 MmSH 방식을 사용했다. COC, PMMA 두 종류의 열가소성 수지를 사용하여 성형품을 제작한 결과, 이동코어 표면온도가 가장 높은 MmSH 방식에서 나노패턴 전사성이 가장 우수했고, 일반사출성형 방식으로 제작한 성형품에서 전사성이 가장 저조했다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.414-415
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• 2007

PMMA light guiding plate with nano pattern was fabricated by nano imprinting technology. Silicon mold was fabricated by conventional photolithography. A nickel stamper was fabricated by electroplating process using silicon mold. Nano imprinting was performed on PMMA plate at $140^{\circ}C$ under pressure of 20kN. The nano pattern on PMMA plate was investigated using FE-SEM.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1532-1536
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• 2007

A plastic substrate with tiny rectangular pillars less than 100nm is injection molded to study pattern replication in injection molding. The size of the substrate is 50mm ${\times}$ 50mm and 1mm thick. The substrate has 9 patterned areas of which size is 2mm ${\times}$ 2mm respectively. The lengths of the pillars are 50nm, 100nm, 150nm and 200nm and the width and height are 50nm and about 100nm respectively. A pattern master is fabricated by e-beam writing using positive PR(photo resist) and then a nickel stamper replicated from the PR master by nickel electro-plating. Cr is deposited on the PR pattern master before nickel electro-plating as a conducting layer. Using this nickel stamper, several injection molding experiments are done to investigate effects of the injection molding parameters such as mold temperature, injection rate, packing pressure or pattern location on the replication of the patterns under 100nm.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1563-1565
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• 2008

Hydrophobic plastic plates employing nano surface features are injection molded using thermoplastic materials. A variotherm molding process is devised for filling the nano pores and releasing the molded nano features from the master. The size of the molded nano surface features are about 100nm in diameter and 200nm in height. The size of the molded plate is about 30mm x 30mm and the thickness is 1mm. As molding materials, Polypropylene, PMMA, COC and PC are employed, which are all typical commodity thermoplastic materials. The mold temperature(stamper temperature) is investigated as a major processing parameter for molding high aspect ratio nano surface features. Almost fully molded nano features are fabricated above a certain level of mold temperature depends on the employing material. The contact angles on the injection molded plates are measured to estimate the hydrophobicity and found to have higher contact angle up to 180% compared to the blank plate with no surface features.

• 한국산학기술학회논문지
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• 제5권3호
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• pp.223-226
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• 2004

나노 패턴을 갖는 미세 구조물을 낮은 비용으로 생산하기 위해서는 플라스틱 재료를 이용하는 것이 필수적이고, 대량생산이 가능한 가공방법으로 사출성형 공정기술이 유망하다. 본 연구에서는 e-beam 리소그라피로 제작된 석영원판 내의 100-500nm크기의 선과 점 형상을 간단한 thermal embossing 공정을 이용하여 액상 PDMS를 고형화 시킨 후에 원판과 분리시켜 PDMS 몰드를 제작하였다. 실험결과, 원판에 있는 나노 크기의 다양한 패턴들은 PDMS 몰드에 균일하게 전사되었고, 이 몰드는 사출성형용 스탬퍼 제작에 유용하게 이용될 수 있을 것으로 사료된다.

• 한국생산제조학회지
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• 제18권6호
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• pp.697-701
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• 2009

A simple method for the fabrication of porous nano-master for the anti-reflection effect on the transparent substrates is presented. In the conventional fabrication methods for antireflective surface, coating method using materials with low refractive index has usually been used. However, it is required to have a high cost and long processing time for mass production. In this paper, we developed a porous nano-master with anti-reflective surface for the molding stamper of the injection mold, hot embossing and UV imprinting by using the aluminum anodizing process. Through two-step anodizing and etching processes, a porous nano-master with anti-reflective surface was fabricated at the large area. Pattern size Pore diameter and inter-pore distance are about 130nm and 200nm, respectively. In order to replicate anti-reflective structure, hot embossing process was performed by varying the processing parameters such as temperature, pressure and embossing time etc. Finally, antireflective surface can be successfully obtained after etching process to remove selectively silicon layer of AAO master.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 하계학술대회 논문집 C
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• pp.1576-1578
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• 2004

The alumina membrane with nano sized pore was prepared from aluminum by anodic oxidation to apply for storage equipment, gas sensor and stamper. The pore size and cell size of the pores are controlled by anodic oxidation voltage. The alumina thickness was controlled by etching process using 0.2M $H_3PO_4$. The thickness of alumina on Si wafer was very accurately controlled by anodic oxidation time. Nickel with nano-sized grain was electroplated on the Au layer on silicon wafer. The fabricated pores on alumina membrane was the thickness of $7{\sim}10{\mu}m$ with straight nano-sized pore of 307${\sim}$120nm. The alumina by the etching process shows smooth surface. The size of Ni grain was 130nm and 250nm for 10mA/$cm^2$and 20mA/$cm^2$of electroplating currents, respectively.

• 소성∙가공
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• 제16권1호
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• pp.9-14
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• 2007

In this paper, a mold temperature control method for injection molding is proposed. The inner surface of mold is locally heated by jet impingement to improve pattern transcription. Heating by hot jet is completed while the mold is open. An experimental system that realizes the proposed idea has been built, which includes mold, nozzle assembly and heater. Actual injection molding process including the proposed heating procedure has been conducted to verify the validity of the method. The process has been done for several conditions with different jet temperatures and duration of heating. The results from different conditions are compared.