• Applied Microscopy
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• v.42 no.1
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• pp.1-7
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• 2012

The possibility of nanoparticles (NPs) in biotechnology had been discussed by biomedical investigators. Here we report to suggest a solution and problems when using electron microscopy to determine the distribution of quantum dots (QDs) nanoparticles that penetrate skin. The results of this study showed that NPs were able to penetrate stratum corneum (SC) and sebocyte via hair follicle. However, we have found artifacts such as nanoparticles that are produced from combination of free fatty acid and osmium tetroxide during specimen preparation. It is usually difficult to identify NPs. Therefore, we tried to resolve these problems by comparing the cross-correlation image pattern that are derived from the images of sample that had been processed differently. This method can contribute to more accurate interpretation and minimal errors during the analysis using quantum dot as tracer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.192-192
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• 2009

We have successfully demonstrated the inkjet printing process to fabricate $Al_2O_3$ thick films without a high temperature sintering process. A single solvent system had a coffee ring pattern after printing of $Al_2O_3$ dot, line and area. In order to fabricate the smooth surface of $Al_2O_3$ thick film, we have introduced a co-solvent system which has nano-sized $Al_2O_3$ powders in the mixture of Ethylene glycol monomethyl ester and Di propylene glycol methyl ether. This co-solvent system approached a uniform and dense deposition of $Al_2O_3$ powders on the substrate. The packing density of inkjet-printed $Al_2O_3$ films is more than 70% which is very high compared to the value obtained from the films synthesized by other conventional methods such as casting processes. The characterization of the inkjet-printed $Al_2O_3$ films has been implemented to investigate its thickness and roughness. Also the dielectric loss of the films has been measured to understand the feasibility of its application to 3D integration package substrate.